Abstract: The present disclosure provides a method for forming an integrated circuit (IC) structure. The method includes providing a metal gate (MG), an etch stop layer (ESL) formed on the MG, and a dielectric layer formed on the ESL. The method further includes etching the ESL and the dielectric layer to form a trench. A surface of the MG exposed in the trench is oxidized to form a first oxide layer on the MG. The method further includes removing the first oxide layer using a H3PO4 solution.

Abstract: A method for installing rig structure (e.g. cabin, house, a doghouse) on a drilling rig, the method including: connecting support apparatus to a substructure of a drilling rig, supporting a drilling floor; moving a movement apparatus supporting a rig structure to position it adjacent the support apparatus, by moving movement apparatus on ground adjacent the substructure, moving the support apparatus into a connecting orientation with respect to the structure; connecting raising apparatus to the structure, the raising apparatus connected to the support apparatus; raising the structure up to the drill floor with the raising apparatus; and securing the structure to the support apparatus. This abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure and is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims, 37 C.F.R. 1.72(b).

Abstract: A method for installing rig structure (e.g. cabin, house, a doghouse) on a drilling rig, the method including: connecting support apparatus to a substructure of a drilling rig, supporting a drilling floor; moving a movement apparatus supporting a rig structure to position it adjacent the support apparatus, by moving movement apparatus on ground adjacent the substructure, moving the support apparatus into a connecting orientation with respect to the structure; connecting raising apparatus to the structure, the raising apparatus connected to the support apparatus; raising the structure up to the drill floor with the raising apparatus; and securing the structure to the support apparatus. This abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure and is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims, 37 C.F.R. 1.72(b).