Patents by Inventor He Luan

He Luan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11971689
    Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: April 30, 2024
    Assignees: Hewlett-Packard Development Company, L.P., INSTITUTO ATLANTICO
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, He Luan, Jun Zeng, Scott Alan White, Sebastia Cortes i Herms, Nailson Boaz Costa Leite, Brian Schmitz Tani
  • Patent number: 11971699
    Abstract: Examples of methods for thermal mapping by an electronic device are described herein. In some examples, a map is obtained. In some examples, a first thermal image at a first resolution is obtained. In some examples, a neural network is used to determine a second thermal image at a second resolution based on the map and the first thermal image. The second resolution is greater than the first resolution in some examples.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: April 30, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Patent number: 11967037
    Abstract: Examples of methods for object deformation determination are described herein. In some examples, a method includes aligning a first bounding box of a three-dimensional (3D) object model with a second bounding box of a scan. In some examples, the method includes determining a deformation between the 3D object model and the scan based on the alignment.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: April 23, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Juan Carlos Catana Salazar, Jun Zeng, He Luan
  • Patent number: 11931967
    Abstract: Examples of methods for detecting a material phase are described herein. In some examples, a kernel is predicted based on an input corresponding to an object and based on a machine learning model. In some examples, the machine learning model is constrained with a physical model. In some examples, a material phase is detected based on the kernel.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: March 19, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Patent number: 11878464
    Abstract: A system includes a machine readable storage medium storing instructions and a processor. The processor is to execute instructions to receive contone agent maps of a three-dimensional (3D) part and sensed thermal maps from the 3D printing of the 3D part on a 3D printer. The processor is to execute instructions to generate layer sequences including the contone agent maps and the sensed thermal map for each layer of the 3D part. The processor is to execute instructions to select training samples from the layer sequences having temperature intensity variations within each layer or between neighboring layers. The processor is to execute instructions to train a neural network using the training samples to generate a model to predict thermal behavior in the 3D printer.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: January 23, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Patent number: 11669057
    Abstract: Examples of a thermal behavior prediction method are described herein. In some examples of the thermal behavior prediction method, a predicted heat map of a layer corresponding to a three-dimensional (3D) model is computed using at least one neural network. The predicted heat map is computed based on a contone map corresponding to the 3D model.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: June 6, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Jun Zeng, He Luan
  • Patent number: 11597156
    Abstract: Examples of methods for monitoring additive manufacturing by an electronic device are described herein. In some examples, a predicted thermal image is calculated for a layer. In some examples, a captured thermal image is obtained for the layer. In some examples, a risk score is calculated for the layer based on the predicted thermal image and the captured thermal image. In some examples, a mitigation operation is performed in response to determining that the risk score is outside of a threshold range.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: March 7, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Publication number: 20230051704
    Abstract: Examples of methods for predicting object deformations are described herein. In some examples, a method includes predicting a point cloud. In some examples, the predicted point cloud indicates a predicted object deformation. In some examples, the point cloud may be predicted using a machine learning model and edges determined from an input point cloud.
    Type: Application
    Filed: January 31, 2020
    Publication date: February 16, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Juan Carlos Catana Salazar, Jun Zeng
  • Publication number: 20230043252
    Abstract: Examples of methods for model prediction are described herein. In some examples, a method includes predicting a compensated model. In some examples, the compensated model is predicted based on a three-dimensional (3D) object model. In some examples, a method includes predicting a deformed model. In some examples, the deformed mode is predicted based on the compensated model.
    Type: Application
    Filed: January 31, 2020
    Publication date: February 9, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Juan Carlos Catana Salazar, Jun Zeng
  • Publication number: 20230029302
    Abstract: Examples of methods for object deformation determination are described herein. In some examples, a method includes aligning a first bounding box of a three-dimensional (3D) object model with a second bounding box of a scan. In some examples, the method includes determining a deformation between the 3D object model and the scan based on the alignment.
    Type: Application
    Filed: January 17, 2020
    Publication date: January 26, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Juan Carlos Catana Salazar, Jun Zeng, He Luan
  • Publication number: 20220413464
    Abstract: Examples of methods for registering objects are described herein. In some examples, a method includes determining a set of overlap scores based on a set of orientations between a first bounding box of a three-dimensional (3D) object model and a second bounding box of a 3D scan of an object. In some examples, the method includes registering the 3D scan with the 3D object model based on the set of overlap scores.
    Type: Application
    Filed: December 5, 2019
    Publication date: December 29, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun ZENG, He LUAN, Juan Carlos CATANA SALAZAR
  • Publication number: 20220388070
    Abstract: Examples of methods for predicting porosity are described herein. In some examples, a method includes predicting a height map. In some examples, the height map is of material for metal printing. In some examples, the method includes predicting a porosity of a precursor object. In some examples, predicting the porosity of the precursor object is based on the predicted height map.
    Type: Application
    Filed: December 5, 2019
    Publication date: December 8, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Publication number: 20220215528
    Abstract: An example three-dimensional (3D) printer may include a camera to capture a low-resolution thermal image of a build material bed. The 3D printer may include an interpolation engine to generate an interpolated thermal image based on the low-resolution thermal image. The 3D printer may also include a correction engine to enhance fine details of the interpolated thermal image without distorting thermal values from portions of the interpolated thermal image without fine details to produce an enhanced thermal image.
    Type: Application
    Filed: September 26, 2019
    Publication date: July 7, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: HE LUAN, Jun Zeng
  • Publication number: 20220171903
    Abstract: Examples of methods for adapting simulations are described herein. In some examples, a method may include simulating three-dimensional (3D) manufacturing. In some examples, the method may include adapting a boundary condition of the simulation of the 3D manufacturing based on a measurement from a thermal sensor at a point of a build enclosure.
    Type: Application
    Filed: July 19, 2019
    Publication date: June 2, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan
  • Publication number: 20220152936
    Abstract: Examples of methods generated thermal images are described. In some examples, a method may include simulating three-dimensional (3D) manufacturing to produce a simulated thermal image at a first resolution. In some examples, the method may include generating a thermal image at a second resolution based on the simulated thermal image. In some examples, the second resolution is greater than the first resolution.
    Type: Application
    Filed: July 31, 2019
    Publication date: May 19, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zheng, Carlos Alberto Lopez-Collier de la Marliere
  • Publication number: 20220088878
    Abstract: Examples of methods for adapting a simulation of three-dimensional (3D) manufacturing are described herein. In some examples, a method includes determining, using a machine learning model, a predicted thermal image based on a thermal imaging stream of 3D manufacturing. In some examples, a method includes adapting a simulation of the 3D manufacturing based on the predicted thermal image.
    Type: Application
    Filed: June 11, 2019
    Publication date: March 24, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan
  • Publication number: 20220016846
    Abstract: Examples of methods for determining an adaptive thermal diffusivity kernel are described herein. In some examples, an adaptive thermal diffusivity kernel is determined based on a map. In some examples, a temperature is predicted based on the adaptive thermal diffusivity kernel. In some examples, the map includes a temperature map, a shape map, or a concatenation of the temperature map and the shape map.
    Type: Application
    Filed: April 10, 2019
    Publication date: January 20, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Publication number: 20220016847
    Abstract: Examples of methods for detecting a material phase are described herein. In some examples, a kernel is predicted based on an input corresponding to an object and based on a machine learning model. In some examples, the machine learning model is constrained with a physical model. In some examples, a material phase is detected based on the kernel.
    Type: Application
    Filed: April 10, 2019
    Publication date: January 20, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Publication number: 20210349428
    Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.
    Type: Application
    Filed: December 12, 2018
    Publication date: November 11, 2021
    Applicants: Hewlett-Packard Development Company, L.P., INSTITUTO ATLANTICO
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, He Luan, Jun Zeng, Scott Alan White, Sebastia Cortes i Herms, Nailson Boaz Costa Leite, Brian Schmitz Tani
  • Publication number: 20210276270
    Abstract: Examples of methods for monitoring additive manufacturing by an electronic device are described herein. In some examples, a predicted thermal image is calculated for a layer. In some examples, a captured thermal image is obtained for the layer. In some examples, a risk score is calculated for the layer based on the predicted thermal image and the captured thermal image. In some examples, a mitigation operation is performed in response to determining that the risk score is outside of a threshold range.
    Type: Application
    Filed: October 29, 2018
    Publication date: September 9, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng