Patents by Inventor He Luan
He Luan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11971689Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.Type: GrantFiled: December 12, 2018Date of Patent: April 30, 2024Assignees: Hewlett-Packard Development Company, L.P., INSTITUTO ATLANTICOInventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, He Luan, Jun Zeng, Scott Alan White, Sebastia Cortes i Herms, Nailson Boaz Costa Leite, Brian Schmitz Tani
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Patent number: 11971699Abstract: Examples of methods for thermal mapping by an electronic device are described herein. In some examples, a map is obtained. In some examples, a first thermal image at a first resolution is obtained. In some examples, a neural network is used to determine a second thermal image at a second resolution based on the map and the first thermal image. The second resolution is greater than the first resolution in some examples.Type: GrantFiled: October 29, 2018Date of Patent: April 30, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Jun Zeng
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Patent number: 11967037Abstract: Examples of methods for object deformation determination are described herein. In some examples, a method includes aligning a first bounding box of a three-dimensional (3D) object model with a second bounding box of a scan. In some examples, the method includes determining a deformation between the 3D object model and the scan based on the alignment.Type: GrantFiled: January 17, 2020Date of Patent: April 23, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Juan Carlos Catana Salazar, Jun Zeng, He Luan
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Patent number: 11931967Abstract: Examples of methods for detecting a material phase are described herein. In some examples, a kernel is predicted based on an input corresponding to an object and based on a machine learning model. In some examples, the machine learning model is constrained with a physical model. In some examples, a material phase is detected based on the kernel.Type: GrantFiled: April 10, 2019Date of Patent: March 19, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Jun Zeng
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Patent number: 11878464Abstract: A system includes a machine readable storage medium storing instructions and a processor. The processor is to execute instructions to receive contone agent maps of a three-dimensional (3D) part and sensed thermal maps from the 3D printing of the 3D part on a 3D printer. The processor is to execute instructions to generate layer sequences including the contone agent maps and the sensed thermal map for each layer of the 3D part. The processor is to execute instructions to select training samples from the layer sequences having temperature intensity variations within each layer or between neighboring layers. The processor is to execute instructions to train a neural network using the training samples to generate a model to predict thermal behavior in the 3D printer.Type: GrantFiled: August 10, 2018Date of Patent: January 23, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Jun Zeng
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Patent number: 11669057Abstract: Examples of a thermal behavior prediction method are described herein. In some examples of the thermal behavior prediction method, a predicted heat map of a layer corresponding to a three-dimensional (3D) model is computed using at least one neural network. The predicted heat map is computed based on a contone map corresponding to the 3D model.Type: GrantFiled: December 13, 2017Date of Patent: June 6, 2023Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Jun Zeng, He Luan
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Patent number: 11597156Abstract: Examples of methods for monitoring additive manufacturing by an electronic device are described herein. In some examples, a predicted thermal image is calculated for a layer. In some examples, a captured thermal image is obtained for the layer. In some examples, a risk score is calculated for the layer based on the predicted thermal image and the captured thermal image. In some examples, a mitigation operation is performed in response to determining that the risk score is outside of a threshold range.Type: GrantFiled: October 29, 2018Date of Patent: March 7, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Jun Zeng
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Publication number: 20230051704Abstract: Examples of methods for predicting object deformations are described herein. In some examples, a method includes predicting a point cloud. In some examples, the predicted point cloud indicates a predicted object deformation. In some examples, the point cloud may be predicted using a machine learning model and edges determined from an input point cloud.Type: ApplicationFiled: January 31, 2020Publication date: February 16, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Juan Carlos Catana Salazar, Jun Zeng
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Publication number: 20230043252Abstract: Examples of methods for model prediction are described herein. In some examples, a method includes predicting a compensated model. In some examples, the compensated model is predicted based on a three-dimensional (3D) object model. In some examples, a method includes predicting a deformed model. In some examples, the deformed mode is predicted based on the compensated model.Type: ApplicationFiled: January 31, 2020Publication date: February 9, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Juan Carlos Catana Salazar, Jun Zeng
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Publication number: 20230029302Abstract: Examples of methods for object deformation determination are described herein. In some examples, a method includes aligning a first bounding box of a three-dimensional (3D) object model with a second bounding box of a scan. In some examples, the method includes determining a deformation between the 3D object model and the scan based on the alignment.Type: ApplicationFiled: January 17, 2020Publication date: January 26, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Juan Carlos Catana Salazar, Jun Zeng, He Luan
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Publication number: 20220413464Abstract: Examples of methods for registering objects are described herein. In some examples, a method includes determining a set of overlap scores based on a set of orientations between a first bounding box of a three-dimensional (3D) object model and a second bounding box of a 3D scan of an object. In some examples, the method includes registering the 3D scan with the 3D object model based on the set of overlap scores.Type: ApplicationFiled: December 5, 2019Publication date: December 29, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jun ZENG, He LUAN, Juan Carlos CATANA SALAZAR
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Publication number: 20220388070Abstract: Examples of methods for predicting porosity are described herein. In some examples, a method includes predicting a height map. In some examples, the height map is of material for metal printing. In some examples, the method includes predicting a porosity of a precursor object. In some examples, predicting the porosity of the precursor object is based on the predicted height map.Type: ApplicationFiled: December 5, 2019Publication date: December 8, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Jun Zeng
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Publication number: 20220215528Abstract: An example three-dimensional (3D) printer may include a camera to capture a low-resolution thermal image of a build material bed. The 3D printer may include an interpolation engine to generate an interpolated thermal image based on the low-resolution thermal image. The 3D printer may also include a correction engine to enhance fine details of the interpolated thermal image without distorting thermal values from portions of the interpolated thermal image without fine details to produce an enhanced thermal image.Type: ApplicationFiled: September 26, 2019Publication date: July 7, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: HE LUAN, Jun Zeng
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Publication number: 20220171903Abstract: Examples of methods for adapting simulations are described herein. In some examples, a method may include simulating three-dimensional (3D) manufacturing. In some examples, the method may include adapting a boundary condition of the simulation of the 3D manufacturing based on a measurement from a thermal sensor at a point of a build enclosure.Type: ApplicationFiled: July 19, 2019Publication date: June 2, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan
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Publication number: 20220152936Abstract: Examples of methods generated thermal images are described. In some examples, a method may include simulating three-dimensional (3D) manufacturing to produce a simulated thermal image at a first resolution. In some examples, the method may include generating a thermal image at a second resolution based on the simulated thermal image. In some examples, the second resolution is greater than the first resolution.Type: ApplicationFiled: July 31, 2019Publication date: May 19, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Jun Zheng, Carlos Alberto Lopez-Collier de la Marliere
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Publication number: 20220088878Abstract: Examples of methods for adapting a simulation of three-dimensional (3D) manufacturing are described herein. In some examples, a method includes determining, using a machine learning model, a predicted thermal image based on a thermal imaging stream of 3D manufacturing. In some examples, a method includes adapting a simulation of the 3D manufacturing based on the predicted thermal image.Type: ApplicationFiled: June 11, 2019Publication date: March 24, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan
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Publication number: 20220016846Abstract: Examples of methods for determining an adaptive thermal diffusivity kernel are described herein. In some examples, an adaptive thermal diffusivity kernel is determined based on a map. In some examples, a temperature is predicted based on the adaptive thermal diffusivity kernel. In some examples, the map includes a temperature map, a shape map, or a concatenation of the temperature map and the shape map.Type: ApplicationFiled: April 10, 2019Publication date: January 20, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Jun Zeng
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Publication number: 20220016847Abstract: Examples of methods for detecting a material phase are described herein. In some examples, a kernel is predicted based on an input corresponding to an object and based on a machine learning model. In some examples, the machine learning model is constrained with a physical model. In some examples, a material phase is detected based on the kernel.Type: ApplicationFiled: April 10, 2019Publication date: January 20, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Jun Zeng
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Publication number: 20210349428Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.Type: ApplicationFiled: December 12, 2018Publication date: November 11, 2021Applicants: Hewlett-Packard Development Company, L.P., INSTITUTO ATLANTICOInventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, He Luan, Jun Zeng, Scott Alan White, Sebastia Cortes i Herms, Nailson Boaz Costa Leite, Brian Schmitz Tani
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Publication number: 20210276270Abstract: Examples of methods for monitoring additive manufacturing by an electronic device are described herein. In some examples, a predicted thermal image is calculated for a layer. In some examples, a captured thermal image is obtained for the layer. In some examples, a risk score is calculated for the layer based on the predicted thermal image and the captured thermal image. In some examples, a mitigation operation is performed in response to determining that the risk score is outside of a threshold range.Type: ApplicationFiled: October 29, 2018Publication date: September 9, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: He Luan, Jun Zeng