Patents by Inventor Hea Sung KIM

Hea Sung KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method of manufacturing the same
    Patent number: 11997788
    Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: May 28, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
  • PRINTED CIRCUIT BOARD
    Publication number: 20230335479
    Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.
    Type: Application
    Filed: June 16, 2023
    Publication date: October 19, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Hoon KO, Sang Hoon KIM, Yoong OH, Hea Sung KIM
  • PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230199956
    Abstract: A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.
    Type: Application
    Filed: May 10, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230171888
    Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.
    Type: Application
    Filed: September 1, 2022
    Publication date: June 1, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon KIM, Young Kuk KO, Gyu Mook KIM, Hea Sung KIM, Chi Won HWANG, Suk Chang HONG
  • PRINTED CIRCUIT BOARD
    Publication number: 20230147912
    Abstract: A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.
    Type: Application
    Filed: March 10, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
  • PRINTED CIRCUIT BOARD
    Publication number: 20220181245
    Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.
    Type: Application
    Filed: March 3, 2021
    Publication date: June 9, 2022
    Inventors: Chan Hoon KO, Sang Hoon KIM, Yoong OH, Hea Sung KIM
  • Printed circuit board
    Patent number: 11297714
    Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: April 5, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Kuk Ko, Yoong Oh, Sang-Hoon Kim, Gyu-Mook Kim, Yong-Soon Jang, Hea-Sung Kim
  • Printed circuit board and package structure having the same
    Patent number: 10991647
    Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: April 27, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yoong Oh, Sang-Hoon Kim, Hea-Sung Kim, Gyu-Mook Kim, Young-Kuk Ko
  • PRINTED CIRCUIT BOARD
    Publication number: 20210029825
    Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.
    Type: Application
    Filed: October 14, 2020
    Publication date: January 28, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Kuk KO, Yoong OH, Sang-Hoon KIM, Gyu-Mook KIM, Yong-Soon JANG, Hea-Sung KIM
  • Printed circuit board
    Patent number: 10849225
    Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: November 24, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Kuk Ko, Yoong Oh, Sang-Hoon Kim, Gyu-Mook Kim, Yong-Soon Jang, Hea-Sung Kim
  • PRINTED CIRCUIT BOARD
    Publication number: 20200260580
    Abstract: A printed circuit board includes: an insulating layer; a via passing through the insulating layer; and a metal post in contact with a surface of the via, and protruding from the insulating layer. The metal post includes a region having a width that is greater than a width of the via.
    Type: Application
    Filed: October 24, 2019
    Publication date: August 13, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Kuk KO, Yoong OH, Sang-Hoon KIM, Gyu-Mook KIM, Hea-Sung KIM
  • PRINTED CIRCUIT BOARD AND PACKAGE STRUCTURE HAVING THE SAME
    Publication number: 20200152566
    Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.
    Type: Application
    Filed: October 21, 2019
    Publication date: May 14, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yoong OH, Sang-Hoon KIM, Hea-Sung KIM, Gyu-Mook KIM, Young-Kuk KO
  • Embedded board and method of manufacturing the same
    Patent number: 10129982
    Abstract: An embedded board includes an insulating layer and an electronic device embedded in the insulating layer. A first circuit pattern is embedded to contact a bottom surface of the insulating layer, and a second circuit pattern protrudes from the bottom surface of the insulating layer. A via is bonded to the device and the second circuit pattern.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: November 13, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hoon Choi, Jung Hyun Park, Yong Ho Baek, Hea Sung Kim, Jung Hyun Cho, Il Jong Seo
  • EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160105967
    Abstract: An embedded board includes an insulating layer and an electronic device embedded in the insulating layer. A first circuit pattern is embedded to contact a bottom surface of the insulating layer, and a second circuit pattern protrudes from the bottom surface of the insulating layer. A via is bonded to the device and the second circuit pattern.
    Type: Application
    Filed: July 31, 2015
    Publication date: April 14, 2016
    Inventors: Jae Hoon CHOI, Jung Hyun PARK, Yong Ho BAEK, Hea Sung KIM, Jung Hyun CHO, Il Jong SEO