Abstract: The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKa greater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.

Abstract: An optical sheet suitable for use in a laminate comprising at least one glazing component. The optical sheet comprises a non-metallic multi-layer optical film that has multiple optical layers, and can be, for example, a solar energy reflective film (e.g., an infrared radiation reflective film). The multiple layers are thermally and/or otherwise fused together along all, substantially all or at least a substantial portion of the peripheral edge of at least the optical film, so as to prevent or at least substantially reduce the occurrence or degree of delamination of the multiple layers along all, substantially all, or the substantial portion of the peripheral edge of the optical film.