Abstract: A ceramic sheet includes a first surface, a second surface opposite the first surface, and a pair of parallel edges extending therebetween. A thickness of the ceramic sheet is defined between the first and second surfaces, a width of the ceramic sheet is defined between the pair of parallel edges, and a length of the ceramic sheet is defined as a dimension orthogonal to both the thickness and the width. The thickness is less than or equal to 100 ?m, the length is greater than or equal to 10 m, and the width is less than or equal to 12 mm. The ceramic sheet has a grain size of less than or equal to 0.2 ?m and a porosity of less than or equal to 5%.

Abstract: In some embodiments, a method comprises forming a pilot hole or damage track through a laminate glass structure using a laser. The laminate glass structure comprising a first layer and a second layer adjacent to the first layer. The first layer is formed from a first glass composition. The second layer is formed from a second glass composition different from the first glass composition. After forming the pilot hole, the laminate glass structure is exposed to etching conditions that etch the first glass composition at a first etching rate and the second glass composition at a second etching rate, wherein the first etch rate is different from the second etch rate, to form an etched hole.

Abstract: A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.

Abstract: A substrate comprising: (i) a first series of blind vias into a thickness of a substrate and open to a first primary surface; and (ii) a second series of blind vias into the thickness of a substrate and open to a second primary surface. Each blind via includes an interior wall. The interior wall includes a first tapered region and a second tapered region. The first tapered region and the second tapered region have a distinct slope. Each of the blind vias of the second series of blind vias is coaxial with a different blind via of the first series of blind vias. Each blind via of the first series of blind vias has a depth that deviates from a mean depth by less than +/?10%. Each blind via of the second series of blind vias has a depth that deviates from a mean depth by less than +/?10%.

Abstract: Embodiments are related to systems and methods for forming multi-tile display panels, and more particularly to systems and methods for forming display tiles having wrap-around edge electrodes.

Abstract: Embodiments of a method of scribing a ceramic material are provided. In the method, a ceramic material having a thickness of 500 ?m or less between a first outer surface and a second outer surface is provided. The second outer surface is opposite the first outer surface. A beam focal line is directed at the ceramic material, and the beam focal line has a length over which its intensity is greater than a damage threshold of the ceramic material. The length is longer than the thickness of the ceramic material. Further, a damage track defining at least a first section of the ceramic material and a second section of the ceramic material is created by moving the beam focal line relative to the ceramic material. Also provided are embodiments of a laser scribed component and embodiments of a laser scribed ceramic substrate.

Abstract: A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

Abstract: A method for processing a transparent workpiece includes forming a closed contour line having a plurality of defects in the transparent workpiece such that the closed contour line defines a closed contour. Forming the closed contour line includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, and translating the transparent workpiece and the pulsed laser beam relative to each other along the closed contour line. The method further includes etching the transparent workpiece with a chemical etching solution at an etching rate of about 2.