Abstract: A test socket for integrated circuits includes a socket body for making electrical connection between leads or pads of an integrated circuit and a load board. A lid assembly is pivotally connected to the socket body by a hinge and is rotatable between a closed position and an open position. The lid assembly is removable from the socket body without tools. The lid assembly includes a frame member secured to the hinge, and a pressure plate and actuation member contained within the frame member. The bottom surface of the pressure plate includes a plurality of channels extending from an open central portion to the circumference of the pressure plate for permitting thermal air flow over the integrated circuit. A preferred embodiment of the lid assembly provides a visual indication to the user when an integrated circuit is undergoing testing.