Patents by Inventor Hebert SCHIER

Hebert SCHIER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for etching semiconductor structures and etching composition for use in such a method
    Patent number: 9287228
    Abstract: A method of etching a semiconductor structure, comprises contacting an under bump metallization (UBM) with an etching composition. The UBM includes an underlying layer comprising titanium and an overlying layer comprising a second metal. The etching composition is a liquid comprising at least 0.1 wt % hydrofluoric acid and at least 0.1 wt % phosphoric acid.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: March 15, 2016
    Assignee: LAM RESEARCH AG
    Inventors: Harald Kraus, Hebert Schier
  • METHOD FOR ETCHING SEMICONDUCTOR STRUCTURES AND ETCHING COMPOSITION FOR USE IN SUCH A METHOD
    Publication number: 20150380370
    Abstract: A method of etching a semiconductor structure, comprises contacting an under bump metallization (UBM) with an etching composition. The UBM includes an underlying layer comprising titanium and an overlying layer comprising a second metal. The etching composition is a liquid comprising at least 0.1 wt % hydrofluoric acid and at least 0.1 wt % phosphoric acid.
    Type: Application
    Filed: June 26, 2014
    Publication date: December 31, 2015
    Applicant: LAM RESEARCH AG
    Inventors: Harald KRAUS, Hebert SCHIER