Patents by Inventor Hector Vidales

Hector Vidales has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7167371
    Abstract: A technique is provided for coupling and uncoupling modular devices with electronic and computing devices. A latch is coupled to a release member, which operates to release the latch from a mate latch by bending the release member to move the latch laterally away from the mate latch. The release member also may have grips for tool-lessly bending the release member to release the latch from the mate latch, and for removing the desired device. The technique also may embody a modular device having the latch and release member, or it may embody an overall system having the modular device disposed in a receptacle.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: January 23, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Henry C. Coles, Hector Vidales, Joseph R. Allen, Tri Nguyen
  • Publication number: 20040022034
    Abstract: A technique is provided for coupling and uncoupling modular devices with electronic and computing devices. A latch is coupled to a release member, which operates to release the latch from a mate latch by bending the release member to move the latch laterally away from the mate latch. The release member also may have grips for tool-lessly bending the release member to release the latch from the mate latch, and for removing the desired device. The technique also may embody a modular device having the latch and release member, or it may embody an overall system having the modular device disposed in a receptacle.
    Type: Application
    Filed: July 30, 2003
    Publication date: February 5, 2004
    Inventors: Henry C. Coles, Hector Vidales, Joseph R. Allen, Tri Nguyen
  • Patent number: 6633486
    Abstract: A technique is provided for coupling and uncoupling modular devices with electronic and computing devices. A latch is coupled to a release member, which operates to release the latch from a mate latch by bending the release member to move the latch laterally away from the mate latch. The release member also may have grips for tool-lessly bending the release member to release the latch from the mate latch, and for removing the desired device. The technique also may embody a modular device having the latch and release member, or it may embody an overall system having the modular device disposed in a receptacle.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: October 14, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Henry C. Coles, Hector Vidales, Joseph R. Allen, Tri Nguyen
  • Publication number: 20030099094
    Abstract: A technique is provided for coupling and uncoupling modular devices with electronic and computing devices. A latch is coupled to a release member, which operates to release the latch from a mate latch by bending the release member to move the latch laterally away from the mate latch. The release member also may have grips for tool-lessly bending the release member to release the latch from the mate latch, and for removing the desired device. The technique also may embody a modular device having the latch and release member, or it may embody an overall system having the modular device disposed in a receptacle.
    Type: Application
    Filed: November 28, 2001
    Publication date: May 29, 2003
    Inventors: Henry C. Coles, Hector Vidales, Joseph R. Allen, Tri Nguyen