Patents by Inventor Hee-Jeong Kim
Hee-Jeong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200020606Abstract: Disclosed is a semiconductor package comprising first and second semiconductor structures spaced apart on a first substrate, a heat sink covering the first and second semiconductor structure and the first substrate, and a thermal interface material layer between the heat sink and the first and second semiconductor structures. The first semiconductor structure includes a first sidewall adjacent to the second semiconductor structure and a second sidewall opposite the first sidewall. The thermal interface material layer includes a first segment between the first and second semiconductor structures and a second segment protruding beyond the second sidewall. A first distance from a top surface of the first substrate to a lowest point of a bottom surface of the first segment is less than a second distance from the top surface of the first substrate to a lowest point of a bottom surface of the second segment.Type: ApplicationFiled: December 18, 2018Publication date: January 16, 2020Applicant: Samsung Electronics Co., Ltd.Inventors: Hee-Jeong Kim, Juhyun LYU, Un-Byoung KANG, Jongho LEE
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Patent number: 10478445Abstract: Disclosed herein are compounds, compositions and methods for the treatment of a disease or disorder related to activation of deacetylase enzymes. The compounds and methods are related to boronic acid derivatives of resveratrol. In some forms, the compound, compositions and methods relate to treatment of prostate cancer, colon cancer, or breast cancer, a cardiovascular disease, inflammation, obesity, diabetes, or a neurodegenerative disease.Type: GrantFiled: July 3, 2014Date of Patent: November 19, 2019Assignee: Georgetown UniversityInventors: Insoo Bae, Yong Weon Yi, Hyo Jin Kang, Hee Jeong Kim
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Patent number: 10191203Abstract: A stacking-type optical sheet module includes an upper optical sheet having a first structural pattern with first unit light-condensing bodies successively repeated and cross-sectional areas gradually decreasing towards the top. A lower optical sheet has a second structural pattern and is below the upper optical sheet in a stack. Second and third unit light-condensing bodies are successively disposed in the second structural pattern. The second unit bodies have a gradually decreasing cross-sectional area toward the top and are joined with the upper optical sheet, and the third unit bodies have a gradually decreasing cross-sectional area toward the top, a vertical distance from a lowest to a highest portion thereof being relatively shorter than a corresponding vertical distance of the second unit bodies. A vertical angle of the highest portion of the second unit bodies is relatively smaller than a vertical angle of the highest portion of the third unit bodies.Type: GrantFiled: January 6, 2015Date of Patent: January 29, 2019Assignee: LMS CO., LTDInventors: Sung Sik Cho, Dong Cheol Lee, Tae Jun Lee, Hee Jeong Kim
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Patent number: 10180531Abstract: A laminated optical sheet module includes: an upper optical sheet having a first structure pattern in which a first unit light collector having an inclined surface, the cross-section area of which decrease when progressing upwardly, is continuously repeated; and a lower optical sheet laminated beneath the upper optical sheet and having a second structure pattern in which a second unit light collector having an inclined surface, the cross-sectional area of which decreases when progressing upwardly, is continuously repeated. The vertical distance between the lowermost portion and the uppermost portion of the second unit collector is greater than the vertical distance between the lowermost portion and the uppermost portion of the first unit collector. The surface area of the inclined surface of the second unit collector is relatively larger than the surface area of the inclined surface of the first unit collector.Type: GrantFiled: June 24, 2013Date of Patent: January 15, 2019Assignee: LMS Co., LTD.Inventors: Jee Hong Min, Young Il Kim, Sung Sik Cho, Woo Jong Lee, Tae Jun Lee, Hee Jeong Kim, Joon Hwan Hwang
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Patent number: 10132984Abstract: Disclosed is an optical sheet assembly comprising: a first optical sheet which comprises a first base film and a first optical pattern formed on the first base film, light being incident on the first base film; a second optical sheet which comprises a second base film and a second optical pattern formed on the second base film, the light exiting from the first optical sheet being incident thereon; and a third optical sheet which comprises a third base film and a third optical pattern formed on the third base film, the light exiting from the second optical sheet being incident thereon, wherein the first to third optical patterns perform light condensing or diffusing function, the first optical sheet is joined with the second optical sheet, and the second optical sheet is joined with the third optical sheet.Type: GrantFiled: January 6, 2015Date of Patent: November 20, 2018Assignee: LMS CO., LTDInventors: Sung Sik Cho, Dong Cheol Lee, Tae Jun Lee, Hee Jeong Kim, Ki Wook Lee, Jang Hee Cho, Byoung Hun Lee
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Patent number: 10018327Abstract: The present invention may relate to an optical sheet unit. According to an embodiment of the present invention, disclosed is an optical sheet unit comprising: a diffusion sheet for diffusing incident light such that the light can be uniformly emitted; a prism sheet unit arranged at the position facing the diffusion sheet to concentrate the light incident from the diffusion sheet; and a bonding layer formed between the prism sheet unit and the diffusion sheet to bond the entire surfaces of the prism sheet unit and the diffusion sheet facing each other.Type: GrantFiled: May 8, 2013Date of Patent: July 10, 2018Assignee: LMS CO., LTDInventors: Sung Sik Cho, Oh Hyun Kwon, Tae Jun Lee, Woo Jong Lee, Hee Jeong Kim, Jee Hong Min, Young Il Kim
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Publication number: 20160341882Abstract: A stacking-type optical sheet module includes an upper optical sheet having a first structural pattern with first unit light-condensing bodies successively repeated and cross-sectional areas gradually decreasing towards the top. A lower optical sheet has a second structural pattern and is below the upper optical sheet in a stack. Second and third unit light-condensing bodies are successively disposed in the second structural pattern. The second unit bodies have a gradually decreasing cross-sectional area toward the top and are joined with the upper optical sheet, and the third unit bodies have a gradually decreasing cross-sectional area toward the top, a vertical distance from a lowest to a highest portion thereof being relatively shorter than a corresponding vertical distance of the second unit bodies. A vertical angle of the highest portion of the second unit bodies is relatively smaller than a vertical angle of the highest portion of the third unit bodies.Type: ApplicationFiled: January 6, 2015Publication date: November 24, 2016Inventors: Sung Sik CHO, Dong Cheol LEE, Tae Jun LEE, Hee Jeong KIM
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Publication number: 20160334564Abstract: Disclosed is an optical sheet assembly comprising: a first optical sheet which comprises a first base film and a first optical pattern formed on the first base film, light being incident on the first base film; a second optical sheet which comprises a second base film and a second optical pattern formed on the second base film, the light exiting from the first optical sheet being incident thereon; and a third optical sheet which comprises a third base film and a third optical pattern formed on the third base film, the light exiting from the second optical sheet being incident thereon, wherein the first to third optical patterns perform light condensing or diffusing function, the first optical sheet is joined with the second optical sheet, and the second optical sheet is joined with the third optical sheet.Type: ApplicationFiled: January 6, 2015Publication date: November 17, 2016Inventors: Sung Sik CHO, Dong Cheol LEE, Tae Jun LEE, Hee Jeong KIM, Ki Wook LEE, Jang Hee CHO, Byoung Hun LEE
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Publication number: 20160203524Abstract: Provided are an apparatus for managing customer information, a method for managing customer information, a system for managing customer information, and a non-transitory computer readable storage medium having a computer program recorded thereon. That is, customer identification information may be transmitted to a customer managing apparatus through a customer identification information receiving apparatus positioned in the store. The customer managing apparatus may transmit customer management information corresponding to the customer identification information to a store managing apparatus in the store and user equipment of a clerk. The customer may be managed in the store based on the customer management information. Therefore, it is possible to indirectly acquire customer information from the customer and properly provide required information to the customer.Type: ApplicationFiled: November 24, 2015Publication date: July 14, 2016Inventors: Cheol Su KIM, Min Kyo SHIN, Hwa Yeon LEE, Hee Jeong KIM
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Publication number: 20160166592Abstract: Disclosed herein are compounds, compositions and methods for the treatment of a disease or disorder related to activation of deacetylase enzymes. The compounds and methods are related to boronic acid derivatives of resveratrol. In some forms, the compound, compositions and methods relate to treatment of prostate cancer, colon cancer, or breast cancer, a cardiovascular disease, inflammation, obesity, diabetes, or a neurodegenerative disease.Type: ApplicationFiled: July 3, 2014Publication date: June 16, 2016Inventors: Insoo Bae, Yong Weon Yi, Hyo Jin Kang, Hee Jeong Kim
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Patent number: 9357652Abstract: A method of manufacturing a circuit board may include: preparing a circuit board body including an insulating layer having a first surface and a second surface opposite to the first surface and a first conductive thin film layer disposed on the first surface of the insulating layer and having a convex portion which is disposed on a first surface of the first conductive thin film layer and is embedded in the insulating layer; removing the convex portion to form a cavity corresponding to the convex portion in the insulating layer; and forming one or more first wiring patterns on the first surface of the insulating layer by removing first portions of the first conductive thin film layer. The one or more first wiring patterns correspond to second portions of the first conductive thin film layer not removed.Type: GrantFiled: December 12, 2014Date of Patent: May 31, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hee Jeong Kim, Yong Kwan Lee
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Publication number: 20160098785Abstract: The present invention provides user equipment, a method of controlling the user equipment, and a non-transitory computer readable storage medium having a computer program recorded thereon. That is, according to the present invention, it is possible to provide an object for posting on SNS by connecting various data and contents accumulated in the entire process of purchases by a customer with the data on a receipt and then can automatically synchronize and display the object on SNS, a blog, or the like, so convenience for users can be improved.Type: ApplicationFiled: August 24, 2015Publication date: April 7, 2016Inventors: Min Kyo SHIN, Cheol Su KIM, Hwa Yeon LEE, Hee Jeong KIM
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Publication number: 20150333018Abstract: A semiconductor package may include a package substrate, an MRAM chip, a first magnetic shielding film and a second magnetic shielding film. The MRAM chip may be arranged over the package substrate. The MRAM chip may be electrically connected with the package substrate. The first magnetic shielding film may attach the MRAM chip to the package substrate. The first magnetic shielding film may shield magnetic interference between the MRAM chip and the package substrate. The second magnetic shielding film may be arranged over the MRAM chip to shield magnetic interference at an upper region over the MRAM chip. Thus, the magnetic shielding layer may be arranged between the bonding pads of the MRAM chip so that magnetic interference between the bonding pads may be suppressed.Type: ApplicationFiled: December 30, 2014Publication date: November 19, 2015Inventors: Dong-Kwan KIM, Hee-Jeong KIM, Nam-Kyu BAEK
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Publication number: 20150301265Abstract: A laminated optical sheet module includes: an upper optical sheet having a first structure pattern in which a first unit light collector having an inclined surface, the cross-section area of which decrease when progressing upwardly, is continuously repeated; and a lower optical sheet laminated beneath the upper optical sheet and having a second structure pattern in which a second unit light collector having an inclined surface, the cross-sectional area of which decreases when progressing upwardly, is continuously repeated. The vertical distance between the lowermost portion and the uppermost portion of the second unit collector is greater than the vertical distance between the lowermost portion and the uppermost portion of the first unit collector. The surface area of the inclined surface of the second unit collector is relatively larger than the surface area of the inclined surface of the first unit collector.Type: ApplicationFiled: June 24, 2013Publication date: October 22, 2015Inventors: Jee Hong Min, Young Il Kim, Sung Sik Cho, Woo Jong Lee, Tae Jun Lee, Hee Jeong Kim, Joon Hwan Hwang
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Publication number: 20150301264Abstract: An optical sheet module consisting of optical sheets having different thicknesses, includes: a first base film having a predetermined thickness and transmitting light from a lower portion thereof through an upper portion thereof; an upper optical sheet formed on the first base film and having a first structural pattern in which the upper optical sheet protrudes upwardly and the cross-sectional area thereof decreases when progressing toward an upper portion thereof; a second based film laminated beneath the upper optical sheet so as to transmit light from a lower portion thereof to the upper optical sheet; and a lower optical sheet formed on the second base film and having a second structural pattern in which the lower optical sheet protrudes toward the upper optical sheet and the cross-sectional area thereof decreases when progressing toward an upper portion thereof. The first base film is relatively thicker than the second base film.Type: ApplicationFiled: June 24, 2013Publication date: October 22, 2015Inventors: Jee Hong Min, Young Il Kim, Sung Sik Cho, Woo Jong Lee, Tae Jun Lee, Hee Jeong Kim, Yong Jin Kang
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Publication number: 20150262841Abstract: A method of manufacturing a circuit board may include: preparing a circuit board body including an insulating layer having a first surface and a second surface opposite to the first surface and a first conductive thin film layer disposed on the first surface of the insulating layer and having a convex portion which is disposed on a first surface of the first conductive thin film layer and is embedded in the insulating layer; removing the convex portion to form a cavity corresponding to the convex portion in the insulating layer; and forming one or more first wiring patterns on the first surface of the insulating layer by removing first portions of the first conductive thin film layer. The one or more first wiring patterns correspond to second portions of the first conductive thin film layer not removed.Type: ApplicationFiled: December 12, 2014Publication date: September 17, 2015Inventors: Hee Jeong KIM, Yong Kwan LEE
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Patent number: 9052498Abstract: There is disclosed a multilayer optical sheet module including an upper optical sheet comprising a first structural pattern projected upward; a lower optical sheet disposed under the upper optical sheet, the lower optical sheet comprising a second structural pattern projected toward the upper optical sheet; and an adhesion layer provided between the upper optical sheet and the lower optical sheet, wherein the second structural pattern includes a light transmitting part having a traverse cross section getting smaller along an upward direction; and an embedded part continuously connected to an upper portion of the light transmitting part, with a predetermined portion embedded in the adhesion layer, and a circumference of a cross section possessed by the embedded part, contacting with the adhesion layer, is larger than a circumference of a virtual cross section locus formed by extending the light transmitting part upward, with a continuous slope.Type: GrantFiled: December 8, 2012Date of Patent: June 9, 2015Assignee: LMS CO., LTD.Inventors: Jee Hong Min, Young Il Kim, Sung Sik Cho, Woo Jong Lee, Tae Jun Lee, Hee Jeong Kim, Joon Hwan Hwang, Sung Min Cho, Oh Hyun Kwon, Jin Gil Jeong
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Publication number: 20150138781Abstract: The present invention may relate to an optical sheet unit. According to an embodiment of the present invention, disclosed is an optical sheet unit comprising: a diffusion sheet for diffusing incident light such that the light can be uniformly emitted; a prism sheet unit arranged at the position facing the diffusion sheet to concentrate the light incident from the diffusion sheet; and a bonding layer formed between the prism sheet unit and the diffusion sheet to bond the entire surfaces of the prism sheet unit and the diffusion sheet facing each other.Type: ApplicationFiled: May 8, 2013Publication date: May 21, 2015Inventors: Sung Sik Cho, Oh Hyun Kwon, Tae Jun Lee, Woo Jong Lee, Hee Jeong Kim, Jee Hong Min, Young Il Kim
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Publication number: 20150103494Abstract: Printed circuit boards are provided. The printed circuit board includes an insulation layer, an interconnection portion and a metal layer. The insulation layer has a flat plate shape and includes a top surface and a bottom surface. The interconnection portion is disposed on at least one of the top and bottom surfaces of the insulation layer. The interconnection portion includes a plurality of interconnection patterns. The metal layer covers the plurality of interconnection patterns of the interconnection portion. Related semiconductor packages are also provided.Type: ApplicationFiled: October 14, 2014Publication date: April 16, 2015Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hee-jeong Kim, Eun-Chul AHN, Yong-Kwan LEE
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Patent number: 8987387Abstract: Disclosed is an interfacial polymer for a network used as a coupling agent in mixing of rubber-silica. More particularly, the interfacial polymer for a rubber-silica network is a block copolymer containing a copolymer of conjugated diene and vinyl aromatic monomers, in which when used as a coupling agent in the mixing of synthetic rubber and silica (an inorganic material), the polymer enhances silica dispersibility within the rubber, and improves compatibility and processability, resulting in considerable improvement in the dynamic property as well as the mechanical property of the rubber, and when used in a tire, etc., it enhances automobile braking performance and reduces rolling resistance.Type: GrantFiled: September 20, 2012Date of Patent: March 24, 2015Assignees: Korea Kumho Petrochemical Co., Ltd., Institute for Research & Industry Cooperation, PNUInventors: Gwang Hoon Kwag, Jong Yeop Lee, Jae Yun Kim, Han Baek Lee, Sang Chul Ji, Hyun Jong Paik, Won Ho Kim, Hee Jeong Kim, Ki Hyun Kim