Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.

Abstract: A capacitor component includes a body including a dielectric layer, a layering portion in which first and second internal electrodes opposing each other are layered in a first direction, and first and second connecting portions disposed on both surfaces of the layering portion taken in a second direction perpendicular to the first direction and connected to the first and second internal electrodes, respectively; and first and second external electrodes disposed on the first and second connecting portions, respectively, and the first and second external electrodes include metal powder particles, a surface of each of which is coated with at least one of graphene and carbon nanotubes.

Abstract: A capacitor component includes a body including a dielectric layer, a layering portion in which first and second internal electrodes opposing each other are layered in a first direction, and first and second connecting portions disposed on both surfaces of the layering portion taken in a second direction perpendicular to the first direction and connected to the first and second internal electrodes, respectively; and first and second external electrodes disposed on the first and second connecting portions, respectively, and the first and second external electrodes include metal powder particles, a surface of each of which is coated with at least one of graphene and carbon nanotubes.

Abstract: A capacitor component includes a body including a dielectric layer, a layering portion in which first and second internal electrodes opposing each other are layered in a first direction, and first and second connecting portions disposed on both surfaces of the layering portion taken in a second direction perpendicular to the first direction and connected to the first and second internal electrodes, respectively; and first and second external electrodes disposed on the first and second connecting portions, respectively, and the first and second external electrodes include metal powder particles, a surface of each of which is coated with at least one of graphene and carbon nanotubes.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces. A thickness of each of the first and second side margin portions is 10 ?m or more and less than 45 ?m.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces. A thickness of each of the first and second side margin portions is 10 ?m or more and less than 45 ?m.

Abstract: A capacitor component includes a body including a dielectric layer, a layering portion in which first and second internal electrodes opposing each other are layered in a first direction, and first and second connecting portions disposed on both surfaces of the layering portion taken in a second direction perpendicular to the first direction and connected to the first and second internal electrodes, respectively; and first and second external electrodes disposed on the first and second connecting portions, respectively, and the first and second external electrodes include metal powder particles, a surface of each of which is coated with at least one of graphene and carbon nanotubes.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces. A thickness of each of the first and second side margin portions is 10 ?m or more and less than 45 ?m.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces. A thickness of each of the first and second side margin portions is 10 ?m or more and less than 45 ?m.

Abstract: There is provided a biochip stamping device. The biochip stamping device includes a stamping jig in which a first biochip is aligned; an inverting mechanism vertically inverting a second biochip; and a movement mechanism transferring the vertically inverted second biochip on the stamping jig to combine the first biochip and the second biochip.

Abstract: There is provided a fluid ejection device, including a piezo pipette head ejecting a first fluid; a solenoid valve head disposed to be adjacent to the piezo pipette head and ejecting a second fluid having a volume relatively larger than that of the first fluid; and a fluid collection unit allowing the second fluid ejected from the solenoid valve head to be formed thereon to thereby allow the volume of the second fluid to be measured by an optical image device.

Abstract: There are provided a device for testing droplets and an operation method thereof. The device includes a receiving layer on which a sample is received; a plurality of pressure sensors disposed below the receiving layer, and generating changes in capacitance by the sample received on the receiving layer; and a control unit measuring changes in capacitance generated by the plurality of pressure sensors and determining whether the sample received on the receiving layer is defective. According to the present invention, a location and an amount of a sample received on a receiving layer are measured based on changes in capacitance generated by a plurality of respective pressure sensors disposed below the receiving layer, thereby precisely testing whether the sample ejected in droplet form is defective.

Abstract: There is provided a biochip stamping device. The biochip stamping device includes a stamping jig in which a first biochip is aligned; an inverting mechanism vertically inverting a second biochip; and a movement mechanism transferring the vertically inverted second biochip on the stamping jig to combine the first biochip and the second biochip.

Abstract: There is provided a micro-ejecting apparatus. The micro-ejecting apparatus includes: an ejector including a channel therein and a driving part for ejecting a fluid to the outside; a body including a plurality of mounting parts on which the ejector is mounted; and guiding members fixed on the body and corresponding to the plurality of mounting parts so as to determine the positions of the plurality of mounting parts in the body.

Abstract: Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Then, at least one probe pin structure connected to the interlayer circuit is formed by selectively removing the plurality of photosensitive ceramic sheets having a ceramic powder and a photosensitive organic component on the ceramic laminated body necessarily, and by filling a metal material in a region from which the plurality of photosensitive ceramic sheets have been removed. Then, a ceramic substrate having the at least one probe pin structure is provided by simultaneously firing the ceramic laminated body and the photosensitive ceramic sheets, and by removing the photosensitive ceramic sheets.

Abstract: Provided is a method of fabricating a probe pin. In the method, a concave region for a probe pin is formed on a mold substrate. The surface roughness of the concave region is reduced to smooth the surface of the concave region. A release layer is formed on the surface of the concave region of the mold substrate. A plating process is performed to form a probe pin corresponding to the concave region. After the performing of the plating process, the mold substrate having the probe pin is disposed on a circuit substrate and the probe pin is connected to a desired portion of the circuit substrate. Thereafter, the mold substrate is separated from the probe pin in such a way that the mold substrate remains unchanged. Also, the separated mold substrate may be reused.

Abstract: Disclosed is an inkjet head. The inkjet head in accordance with an embodiment of the present invention can include a body in which a plurality of chambers divided by partitions are formed; a plurality of actuators coupled to one side of the body respectively such that pressure is supplied to each of the plurality of the chambers; and a fixture coupled to one side of the body in correspondence to a position of each of the partitions such that vibrations of the partitions are reduced.

Abstract: A method of manufacturing a micro electro-mechanical component having a three-dimensional structure includes preparing a conductive substrate, selectively insulating or removing the conductive substrate to form a functional structure for performing a desired electro-mechanical function, forming a plated structure serving as an electrical connection portion on at least one surface of the functional structure, and mounting the functional structure on a circuit substrate so that the electrical connection portion is connected to a circuit pattern of the circuit substrate.

Abstract: Provided is a probe card. The probe card includes a ceramic substrate including a signal line, and a plurality of probe pins formed on the ceramic substrate, and including probe bodies having one end connected to the signal line and probe tips formed at other end of the probe body. The probe body is divided into a first section adjacent to the signal line and second section adjacent the probe tips. The first section is united by an insulating support, and the second sections are divergently arranged to position the probe tips at different measurement regions, respectively.

Abstract: Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Then, at least one probe pin structure connected to the interlayer circuit is formed by selectively removing the plurality of photosensitive ceramic sheets having a ceramic powder and a photosensitive organic component on the ceramic laminated body necessarily, and by filling a metal material in a region from which the plurality of photosensitive ceramic sheets have been removed. Then, a ceramic substrate having the at least one probe pin structure is provided by simultaneously firing the ceramic laminated body and the photosensitive ceramic sheets, and by removing the photosensitive ceramic sheets.