Patents by Inventor Hee-Seok JUNG

Hee-Seok JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190230785
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 25, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190230787
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 25, 2019
    Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10362675
    Abstract: Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 23, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10356895
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 16, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10306773
    Abstract: An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Hyung Dal Kim, Oh Hyuck Kwon, Han Vit Kang, Jun Young Kim, Moon Kyeong Kim, Sang Seob Kim, Jung Sik Park, Hee Seok Jung, Sung Cho, Heung Sik Shin, Ji Woong Oh
  • Patent number: 10299375
    Abstract: The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: May 21, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190140371
    Abstract: Disclosed is a coaxial cable connector which can be manufactured in an ultra-thin type. The coaxial cable connector of the present invention comprises: a signal pin; a dielectric coupled to the signal pin; a first body coupled to a connector electrically connected to one side of the signal pin; and a second body extending from the first body and coupled to a cable electrically connected to the other side of the signal pin, wherein the second body includes a fixing portion for fixing the dielectric, and the dielectric includes a to-be-fixed portion corresponding to the fixing portion.
    Type: Application
    Filed: April 10, 2017
    Publication date: May 9, 2019
    Inventors: Jin Uk LEE, Sang Min SEO, Jang Mook LEE, Sun Tae KIM, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Patent number: 10276949
    Abstract: Provided are a connector and a blind mating connector including the same. The connector in accordance with the present invention includes a hollow body formed by bending a metal plate that is manufactured by press-processing a raw plate, a dielectric part built in the body, a signal pin passing through the dielectric part, a plurality of contact parts extending from both ends of the body, respectively, with a slit therebetween, a connection part defined in the body and at which both side ends of the metal plate are met and coupled, and an extension contact part bent and extending from one end of the contact part in a direction opposite to an extension direction of the contact part to face the contact part.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: April 30, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Jin Uk Lee, Sang Min Seo, Hwa Yoon Song, Chang Hyun Yang, Kyung Hun Jung, Hwang Sub Koo, Hyun Je Kim, Hee seok Jung
  • Publication number: 20190053379
    Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
    Type: Application
    Filed: February 8, 2017
    Publication date: February 14, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20190041907
    Abstract: A laptop computer, according to the present invention, comprises: a main body part comprising a mainboard and a coaxial cable, one end of which is connected to the mainboard; and a display part hinge-coupled with the main body part and comprising a flexible printed circuit board which is installed on the back of the display part and has one end thereof coupled with the other end of the coaxial cable.
    Type: Application
    Filed: July 5, 2016
    Publication date: February 7, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20190045630
    Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.
    Type: Application
    Filed: February 6, 2017
    Publication date: February 7, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20180269604
    Abstract: Provided are a connector and a blind mating connector including the same. The connector in accordance with the present invention includes a hollow body formed by bending a metal plate that is manufactured by press-processing a raw plate, a dielectric part built in the body, a signal pin passing through the dielectric part, a plurality of contact parts extending from both ends of the body, respectively, with a slit therebetween, a connection part defined in the body and at which both side ends of the metal plate are met and coupled, and an extension contact part bent and extending from one end of the contact part in a direction opposite to an extension direction of the contact part to face the contact part.
    Type: Application
    Filed: January 17, 2018
    Publication date: September 20, 2018
    Inventors: Jin Uk Lee, Sang Min Seo, Hwa Yoon Song, Chang Hyun Yang, Kyung Hun Jung, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20180206332
    Abstract: Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20180206331
    Abstract: The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20180206335
    Abstract: Provided are a flexible circuit board having enhanced bending durability and a method for preparing same. A method for preparing a flexible circuit board having enhanced bending durability, according to the present invention, comprises the steps of: (a) forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on the bottom side of the first dielectric body; (b) preparing a second dielectric body; (c) preparing a first bonding sheet and a first protective sheet which is connected to one end of the first boding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; (d) bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; (e) forming a via hole such that the first ground layer and second ground layer can be conducted; and (f) cutting in the width direction the second dielectric body placed on the first protective sheet.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Inventors: Sang Pil KIM, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20180160545
    Abstract: An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.
    Type: Application
    Filed: August 9, 2017
    Publication date: June 7, 2018
    Inventors: Hyung Dal KIM, Oh Hyuck KWON, Han Vit KANG, Jun Young KIM, Moon Kyeong KIM, Sang Seob KIM, Jung Sik PARK, Hee Seok JUNG, Sung CHO, Heung Sik SHIN, Ji Woong OH
  • Patent number: 9532446
    Abstract: A printed circuit board (PCB) used as a signal transmission line of a terminal, comprising a first ground layer elongating in one direction, a first dielectric layer deposited on a top of the first ground layer and elongating in the same direction as the first ground layer, a signal transmission line deposited on a top of the first dielectric layer and elongating in the same direction as the first dielectric layer, a ground pad elongating from one end of the first ground layer and in contact with an external ground, and a signal line pad extended from one end of the signal transmission line and in contact with an external signal line.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: December 27, 2016
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Ik Soo Kim, Yuck Hwan Jeon, Hee Seok Jung, Hwang Sub Koo, Hyun Je Kim
  • Patent number: 9459286
    Abstract: A large-area probe card and method of manufacturing the same including an insulation plate including at least one contactor formed thereon, a main substrate disposed below the insulation plate, and a flexible signal connector vertically passing through the insulation plate and disposed between the at least one contactor and the main substrate to electrically connect the at least one contactor with the main substrate.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: October 4, 2016
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyu Han Lee, Hee Seok Jung
  • Patent number: 9397390
    Abstract: Provided is a terminal including a high frequency (HF) communication line using a flexible printed circuit board (FPCB). The terminal includes a base board, a main board, an antenna, a battery, and an FPCB connected between the main board and the antenna and formed with an HF communication line for radio frequency (RF) communication. The FPCB includes a first connection formed on one end thereof and electrically connected to the main board, a second connection formed on another end thereof and electrically connected to the antenna, and a connector connecting the first connection with the second connection and bent at the right angle with the first connection and the second connection to vertically stand between the battery and the wall plate of the base board, thereby maximizing an area for the battery.
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: July 19, 2016
    Assignee: GIGALANE CO., LTD.
    Inventors: Yong Goo Lee, Kyung Hun Jung, Kwang Seok Choi, Hee Seok Jung
  • Patent number: D848370
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: May 14, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Jin Uk Lee, Sang Min Seo, Hwa Yoon Song, Chang Hyun Yang, Kyung Hun Jung, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung