Patents by Inventor Hee-Sung Ann

Hee-Sung Ann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180326525
    Abstract: A DED arc 3D alloy metal powder cored printing method, according to an embodiment of the present invention, comprises the steps of: (a) connecting a 3D printing part to a first electrode via a ground line, contacting a second electrode, in which an electrode contact tip is tapped on a peripheral surface of an alloy metal powder cored wire, and then generating an arc by a potential difference between the first electrode and the second electrode to melt the tip of the alloy metal powder cored wire and the surface of the printing part at the same time; (b) forming a monolayer by mixing and solidifying the melt of the alloy metal powder cored wire and the melt of the surface of the printing part; and (c) stacking the monolayer by continuously performing a monolayer overlay, layer-upon-layer.
    Type: Application
    Filed: October 20, 2016
    Publication date: November 15, 2018
    Inventors: Hee-Sung ANN, Youn-Won PARK, Ji-Han LIM
  • Publication number: 20150357089
    Abstract: Disclosed is a method of splicing ReBCO high temperature superconductors (HTSs), which ensures excellent superconductivity after splicing. The method of splicing 2G ReBCO HTSs allows a superconductors-spliced assembly to exhibit excellent superconductivity by direct contact of high temperature superconducting layers of two strands of 2G ReBCO HTSs and solid state atoms diffusion pressurized splicing there between at a ReBCO below peritectic reaction temperature in a vacuum, and enables loss of superconductivity caused by loss of oxygen due to transport and out-diffusion of oxygen to atoms during splicing to be recovered through oxygenation annealing.
    Type: Application
    Filed: February 3, 2014
    Publication date: December 10, 2015
    Applicant: K. JOINS. INC.
    Inventors: Young-Kun OH, Hee-Sung ANN, Myung-Whon LEE
  • Patent number: 8993485
    Abstract: Disclosed is a splicing method of two second-generation ReBCO high temperature superconductor coated conductors (2G ReBCO HTS CCs), in which, with stabilizing layers removed from the two strands of 2G ReBCO HTS CCs through chemical wet etching or plasma dry etching, surfaces of the two high temperature superconducting layers are brought into direct contact with each other and heated in a splicing furnace in a vacuum for micro-melting portions of the surfaces of the high temperature superconducting layers to permit inter-diffusion of ReBCO atoms such that the surfaces of the two superconducting layers can be spliced to each other and oxygenation annealing for recovery of superconductivity which was lost during splicing.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: March 31, 2015
    Assignee: K.Joins
    Inventors: Young-Kun Oh, Hee-Sung Ann, Myung-Whon Lee, Hai-Gun Lee
  • Publication number: 20140296078
    Abstract: Disclosed is a splicing method of two second-generation ReBCO high temperature superconductor coated conductors (2G ReBCO HTS CCs), in which, with stabilizing layers removed from the two strands of 2G ReBCO HTS CCs through chemical wet etching or plasma dry etching, surfaces of the two high temperature superconducting layers are brought into direct contact with each other and heated in a splicing furnace in a vacuum for micro-melting portions of the surfaces of the high temperature superconducting layers to permit inter-diffusion of ReBCO atoms such that the surfaces of the two superconducting layers can be spliced to each other and oxygenation annealing for recovery of superconductivity which was lost during splicing.
    Type: Application
    Filed: October 29, 2012
    Publication date: October 2, 2014
    Inventors: Young-Kun Oh, Hee-Sung Ann, Myung-Whon Lee, Hai-Gun Lee