Patents by Inventor Hee-Sung GO

Hee-Sung GO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PCB mounting method
    Patent number: 9254531
    Abstract: Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: February 9, 2016
    Assignee: KMW Inc.
    Inventors: Duk-Yong Kim, Yoon-Yong Kim, Hee-Sung Go
  • PCB Mounting Method
    Publication number: 20090184155
    Abstract: Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.
    Type: Application
    Filed: January 21, 2009
    Publication date: July 23, 2009
    Applicant: KMW INC.
    Inventors: Duk-Yong KIM, Yoon-Yong KIM, Hee-Sung GO