Patents by Inventor Heide Lampas

Heide Lampas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation-polymerizable composition and process for the application of markings to a printed circuit board
    Patent number: 4695527
    Abstract: A photopolymerizable composition is disclosed which comprises: (a) a free-radically polymerizable compound, (b) a polymeric binder, (c) a photopolymerization initiator, (d) a compound which is thermally crosslinkable with the polymeric binder, with a polymerization product of (a) or with itself, and (e) a pigment. The disclosed composition is used for applying markings to printed circuits and preferably is applied to the solder-resist layer using a dry-resist process, is exposed and then developed, either separately or together with the solder-resist layer.
    Type: Grant
    Filed: June 17, 1986
    Date of Patent: September 22, 1987
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Ulrich Geissler, Heide Lampas