Patents by Inventor Heidi Lee Baks

Heidi Lee Baks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF FORMING AN INTERCONNECT STRUCTURE
    Publication number: 20080146029
    Abstract: A method of forming damascene interconnect structure in an organo-silicate glass layer without causing damage to the organo-silicate glass material. The method includes forming a stack of hardmask layers over the organo-silicate glass layer, defining openings in the hardmask and organo-silicate glass layers using a combination of plasma etch and plasma photoresist removal processes and performing one or more additional plasma etch processes that do not include oxygen containing species to etch the openings to depths required for forming the damascene interconnect structures and to remove any organo-silicate material damaged by the combination of plasma etch and plasma photoresist removal processes.
    Type: Application
    Filed: February 20, 2008
    Publication date: June 19, 2008
    Inventors: Heidi Lee Baks, Shyng-Tsong Chen, Timothy Joseph Dalton, Nicholas Colvin Masi Fuller
  • Method of forming an interconnect structure
    Patent number: 7358182
    Abstract: A method of forming damascene interconnect structure in an organo-silicate glass layer without causing damage to the organo-silicate glass material. The method includes forming a stack of hardmask layers over the organo-silicate glass layer, defining openings in the hardmask and organo-silicate glass layers using a combination of plasma etch and plasma photoresist removal processes and performing one or more additional plasma etch processes that do not include oxygen containing species to etch the openings to depths required for forming the damascene interconnect structures and to remove any organo-silicate material damaged by the combination of plasma etch and plasma photoresist removal processes.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: April 15, 2008
    Assignee: International Business Machines Corporation
    Inventors: Heidi Lee Baks, Shyng-Tsong Chen, Timothy Joseph Dalton, Nicholas Colvin Masi Fuller, Kaushik Arun Kumar