Patents by Inventor Heiko O. Jacobs

Heiko O. Jacobs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7774929
    Abstract: A method of self-assembly of components on a surface of a substrate includes obtaining a first component and a second component. The first component type is assembled onto the substrate by programming the surface. The second component type is assembled by reprogramming the surface. A third component, next to the first and second components, is assembled following the step of assembling the first and second components. The first, second, and third components are all different types of components. docking sites on the substrate can be used that contain alignment pedestals. One component delivery system employ a liquid-liquid interface to deliver and concentrate components with correct pre-orientation.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: August 17, 2010
    Assignee: Regents of the University of Minnesota
    Inventor: Heiko O. Jacobs
  • Patent number: 7771647
    Abstract: A method and apparatus for providing electric microcontact printing is provided. A stamp is brought into contact with the surface of a substrate to provide high resolution features. Aspects of the invention may be used for data storage, microcontact printing, and for other applications requiring high resolution pattern transfer.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: August 10, 2010
    Assignee: President and Fellows of Harvard College
    Inventors: Heiko O. Jacobs, George M. Whitesides
  • Patent number: 7625780
    Abstract: Self-assembly of components carried in a fluid is provided. A first component and a second component are obtained and self-assembled together. A third component is obtained and assembled with the first and second components, following the step of assembling the first and second components. The first, second and third components are all different types of components.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: December 1, 2009
    Assignee: REgents of the University of Minnesota
    Inventors: Heiko O. Jacobs, Wei Zheng
  • Patent number: 7592269
    Abstract: A method of forming a charge pattern includes treating a stamp layer with a plasma, applying the treated stamp layer to a surface of a substrate to thereby form a charge pattern on the surface of the substrate, and separating the stamp layer from the surface of the substrate. In one aspect, the method includes depositing nanoparticles on the surface of the substrate. An apparatus made in accordance with the method is also provided.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: September 22, 2009
    Assignee: Regents of the University of Minnesota
    Inventor: Heiko O. Jacobs
  • Publication number: 20080160780
    Abstract: A method of forming a charge pattern includes treating a stamp layer with a plasma, applying the treated stamp layer to a surface of a substrate to thereby form a charge pattern on the surface of the substrate, and separating the stamp layer from the surface of the substrate. In one aspect, the method includes depositing nanoparticles on the surface of the substrate. An apparatus made in accordance with the method is also provided.
    Type: Application
    Filed: June 19, 2007
    Publication date: July 3, 2008
    Inventor: Heiko O. Jacobs
  • Patent number: 7232771
    Abstract: A method and apparatus for use in depositing electrical charge and/or nanoparticles is provided. A stamping process is used in which a stamp having a flexible layer such as a flexible semiconductor layer applies a charge pattern on a substrate. Other techniques include lithographic patterning, the use of pre-patterned dissimilar materials, deposition by ions or radiation, the use of differing work functions, the use of liquid phase materials. Deposition monitoring techniques and apparatuses are also provided.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: June 19, 2007
    Assignee: Regents of the University of Minnesota
    Inventors: Heiko O. Jacobs, Chad Barry
  • Publication number: 20030178316
    Abstract: A method and apparatus for providing electric microcontact printing is provided. A stamp is brought into contact with the surface of a substrate to provide high resolution features. Aspects of the invention may be used for data storage, microcontact printing, and for other applications requiring high resolution pattern transfer.
    Type: Application
    Filed: December 11, 2002
    Publication date: September 25, 2003
    Applicant: President and Fellows of Harvard College
    Inventors: Heiko O. Jacobs, George M. Whitesides