Abstract: The invention is notably directed to an oscillating reaction device. The device basically includes a structured layer of a matrix material and structural elements. Cavities are defined (for example, as blind holes) in the structured layer to allow the cavities to be filled with an oscillating reaction liquid containing nonpolar molecules of a given molecular species, with a view to triggering an oscillating reaction. Centers of the cavities are arranged according to a 2D lattice, whereby pairs of nearest-neighbor cavities of said cavities are, each, separated by a portion of the matrix material. This portion of material is selectively permeable to said nonpolar molecules. This, in operation, yields an inhibitory chemical coupling of the filled cavities of said pairs of nearest-neighbor cavities, where the inhibitory chemical coupling is mediated by said nonpolar molecules. Also, the structural elements connect the cavities to yield a positive chemical coupling of the filled cavities.

Abstract: Approaches presented herein enable a device for trapping nanoparticles. More specifically, the device comprises a dielectric layer, an electrically insulating lid, a plurality of trapping electrodes, and electrical circuit connectors. The dielectric layer has an exposed surface, which is structured to form a set of recesses in the dielectric layer. The recesses are dimensioned so as to allow nanoparticles (e.g. biomolecules) to be trapped. The electrically insulating lid extends above the exposed surface of the dielectric layer. A flow path is defined between the lid and the exposed surface, such that a liquid can be introduced in the flow path. The trapping electrodes are arranged opposite the lid with respect to the exposed surface to face respective ones of the recesses. This arrangement defines pairs, such that each pair associates one of the trapping electrodes with a respective one of the recesses.

Abstract: A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type.

Abstract: A method for manufacturing a filled cavity between a first surface and a second surface. The steps of the method include: providing a first surface and a second surface; applying on the first surface and/or the second surface a filling material that has a carrier fluid and necking particles; providing spacer elements for defining a width of a cavity between the first and second surfaces; bringing the first and second surfaces together to deform the filling material such that at least one spacer element is held between the first and second surfaces; and removing the carrier fluid such that necking particles attach in a contact region of at least one spacer element with the first surface or the second surface to form necks.

Abstract: A method for manufacturing a filled cavity between a first surface and a second surface. The steps of the method include: providing a first surface and a second surface; applying on the first surface and/or the second surface a filling material that has a carrier fluid and necking particles; providing spacer elements for defining a width of a cavity between the first and second surfaces; bringing the first and second surfaces together to deform the filling material such that at least one spacer element is held between the first and second surfaces; and removing the carrier fluid such that necking particles attach in a contact region of at least one spacer element with the first surface or the second surface to form necks.

Abstract: A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type.

Abstract: A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type.

Abstract: The invention notably concerns a method for depositing nano-objects on a surface. The method includes: providing a substrate with surface patterns on one face thereof; providing a transfer layer on said face of the substrate; functionalizing areas on a surface of the transfer layer parallel to said face of the substrate, at locations defined with respect to said surface patterns, such as to exhibit enhanced binding interactions with nano-objects; depositing nano-objects and letting them get captured at the functionalized areas; and thinning down the transfer layer by energetic stimulation to decompose the polymer into evaporating units, until the nano-objects reach the surface of the substrate.

Abstract: The invention notably concerns a method for depositing nano-objects on a surface. The method includes: providing a substrate with surface patterns on one face thereof; providing a transfer layer on said face of the substrate; functionalizing areas on a surface of the transfer layer parallel to said face of the substrate, at locations defined with respect to said surface patterns, such as to exhibit enhanced binding interactions with nano-objects; depositing nano-objects and letting them get captured at the functionalized areas; and thinning down the transfer layer by energetic stimulation to decompose the polymer into evaporating units, until the nano-objects reach the surface of the substrate. The invention also provides a semiconductor device which includes a substrate and nano-objects accurately disposed on the substrate.

Abstract: A method for manufacturing a filling in a gap region between a first surface and a second surface includes applying a suspension comprising a carrier fluid and filler particles in the gap region between the first and the second surface; and withholding filler particles by a barrier element in the gap region to form a path of attached filler particles between the first surface and the second surface.

Abstract: Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.

Abstract: A stamp for transferring a pattern to a substrate in the presence of a third medium, includes a permeable hydrophilic matrix for guiding excess third medium away from the surface of the stamp.

Abstract: A method of manufacturing a filling of a gap region. The method includes the steps of: applying a carrier fluid and filler particles in a gap region between a first surface and a second surface; exposing the filler particles to a force field for driving the filler particles towards a preferred direction; and withholding the filler particles in a gap region by using a barrier element for forming a path of attached filler particles between the first surface and the second surface.

Abstract: The invention notably concerns a method for depositing nano-objects on a surface. The method includes: providing a substrate with surface patterns on one face thereof; providing a transfer layer on said face of the substrate; functionalizing areas on a surface of the transfer layer parallel to said face of the substrate, at locations defined with respect to said surface patterns, such as to exhibit enhanced binding interactions with nano-objects; depositing nano-objects and letting them get captured at the functionalized areas; and thinning down the transfer layer by energetic stimulation to decompose the polymer into evaporating units, until the nano-objects reach the surface of the substrate. The invention also provides a semiconductor device which includes a substrate and nano-objects accurately disposed on the substrate.

Abstract: The invention notably concerns a method for depositing nano-objects on a surface. The method includes: providing a substrate with surface patterns on one face thereof; providing a transfer layer on said face of the substrate; functionalizing areas on a surface of the transfer layer parallel to said face of the substrate, at locations defined with respect to said surface patterns, such as to exhibit enhanced binding interactions with nano-objects; depositing nano-objects and letting them get captured at the functionalized areas; and thinning down the transfer layer by energetic stimulation to decompose the polymer into evaporating units, until the nano-objects reach the surface of the substrate.

Abstract: A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.

Abstract: Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.

Abstract: A method for manufacturing a filling in a gap region between a first surface and a second surface includes applying a suspension comprising a carrier fluid and filler particles in the gap region between the first and the second surface; and withholding filler particles by a barrier element in the gap region to form a path of attached filler particles between the first surface and the second surface.

Abstract: A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type.

Abstract: A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.