Abstract: A method and device for treating silicon wafers. In a first step, the silicon wafers (22) are conveyed flat along a continuous, horizontal conveyor belt (12, 32) and nozzles (20) or the like spray an etching solution (21) from the top onto the wafers to texture them, only little etching solution (21) being applied to the silicon wafers (22) from below. In a second step, the silicon wafers (22), which are aligned as in the first step, are wetted exclusively from below with the etching solution (35) to etch-polish them.

Abstract: In the case of a method and an apparatus for treating substrates, resist layers are removed from the substrates by spraying with process solution. The substrates are sprayed with the process solution first in a main stripping module and then in a post-stripping module and the said process solution collects in containers under the modules. At least one container is respectively provided for each module. The process solution is collected in the main stripping module in two containers and first fed directly into a second container, which is largely separated from the first container by a wall, which is liquid-permeable in a region significantly below the surface level of the process solution. Process solution is taken from the first container without froth and returned once again into the cycle of the process for wetting the substrates.

Abstract: A contacting device for a galvanization apparatus comprises contacting rollers with a continuous rigid external face, which is joined to a jacket section. The jacket section is provided with an inner opening that is wider than a rotating shaft on which the contacting roller sits. This allows the contacting roller to be moved in a radial direction, wherein electric contacting and securing of a basic position is obtained via springs in every one of the radially moved positions. The moveability of the contacting roller ensures good contact as the contacting roller rests against substrates also when the substrates are uneven. The contact pressure can be relatively small.

Abstract: The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafer, and at least one conveyor device which wets the surface of the silicon wafer with an aqueous medium on a transport plane which is determined by the transport rollers. The conveyor device is configured such that it can apply the process medium to the surface of the silicon wafer, which is oriented in a downward manner and which is arranged on the transport plane. Several suction pipes for suctioning gaseous or mist-like distributed process mediums from the area surrounding the conveyor device are provided. The suction pipes are arranged in the vertical direction below the transport plane.

Abstract: A method and device for treating silicon wafers. In a first step, the silicon wafers (22) are conveyed flat along a continuous, horizontal conveyor belt (12, 32) and nozzles (20) or the like spray an etching solution (21) from the top onto the wafers to texture them, only little etching solution (21) being applied to the silicon wafers (22) from below. In a second step, the silicon wafers (22), which are aligned as in the first step, are wetted exclusively from below with the etching solution (35) to etch-polish them.

Abstract: A transport system for circuit boards (12) in treatment devices (11) which runs the circuit boards (12) between pairs of rollers (20, 21). The pairs of rollers are arranged in roller tracks (17, 18) running parallel to the edge of the circuit board (12) in a narrowly defined boundary region (16). The rollers are arranged with the axes (22) and shafts (23) thereof arranged at an angle (?) relative to the transport direction (14) or the perpendicular (35) thereof, such as to exert a tensile force on the circuit boards in the transverse direction thereof and thus stiffening the same. Transport through treatment, for example galvanization, etching, cleaning etc., without contact with the useful region (15) of the circuit board (12) is thus possible.

Abstract: The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafers on a transport plane, which is determined by the transport rollers, and at least one conveyor device which wets the silicon wafer with an aqueous process medium. The conveyor device is arranged in such a manner below the transport plane that it touches the transport plane for wetting the substrate surface, which is oriented in the downward direction, with a process medium. The conveyor device is in direct contact with the substrate surface and is a roller with a larger diameter at its two ends for contacting the marginal areas at the underside of the silicon wafers for wetting them with the process medium.

Abstract: A method for processing or treating silicon material in carrying out a cleaning or purification process comprises the following steps: wetting bulk silicon material, facing a first direction with a first liquid process medium, automatic changing of an orientation of the bulk silicon material by turning bulk silicon material with a turning device and wetting the bulk silicon material in the altered orientation with the first liquid medium. After that, the bulk silicon material is cleaned in a corresponding cleaning device.

Abstract: The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafer, and at least one conveyor device which wets the surface of the silicon wafer with an aqueous medium on a transport plane which is determined by the transport rollers. The conveyor device is configured such that it can apply the process medium to the surface of the silicon wafer, which is oriented in a downward manner and which is arranged on the transport plane. Several suction pipes for suctioning gaseous or mist-like distributed process mediums from the area surrounding the conveyor device are provided. The suction pipes are arranged in the vertical direction below the transport plane.

Abstract: A contacting device for a galvanization apparatus comprises contacting rollers with a continuous rigid external face, which is joined to a jacket section. The jacket section is provided with an inner opening that is wider than a rotating shaft on which the contacting roller sits. This allows the contacting roller to be moved in a radial direction, wherein electric contacting and securing of a basic position is obtained via springs in every one of the radially moved positions. The moveability of the contacting roller ensures good contact as the contacting roller rests against substrates also when the substrates are uneven. The contact pressure can be relatively small.

Abstract: One embodiment of the invention is a method for placing circuit boards in a receiving container, comprising the following steps: a) gripping and lifting a circuit board with a first grappling device, b) moving the first grappling device and the receiving container relative to each other, such that the receiving container is located below the first grappling device, c) the first grappling device lowers the circuit board into the receiving container, d) gripping and lifting a partition layer from a dispenser with a second grappling device, e) reversion to step b), such that the receiving container is accessible from above and is below the second grappling device, f) the partition layer is placed in the receiving container on top of the previously placed circuit board and g) start the process at a).

Abstract: One embodiment of the invention is a method for placing circuit boards in a receiving container, comprising the following steps: a) gripping and lifting a circuit board with a first grappling device, b) moving the first grappling device and the receiving container relative to each other, such that the receiving container is located below the first grappling device, c) the first grappling device lowers the circuit board into the receiving container, d) gripping and lifting a partition layer from a dispenser with a second grappling device, e) reversion to step b), such that the receiving container is accessible from above and is below the second grappling device, f) the partition layer is placed in the receiving container on top of the previously placed circuit board and g) start the process at a).

Abstract: A transport system for circuit boards (12) in treatment devices (11) is disclosed, which runs the circuit boards (12) between pairs of rollers (20, 21). The pairs of rollers are arranged in roller tracks (17, 18), running parallel to the edge of the circuit board (12) in a narrowly defined boundary region (16). The rollers are arranged with the axes (22) and shafts (23) thereof arranged at an angle (?) relative to the transport direction (14) or the perpendicular (35) thereof, such as to exert a tensile force on the circuit boards in the transverse direction thereof and thus stiffening the same. A transport through the treatment devices, for example galvanization, etching, cleaning etc., without contact with the useful region (15) of the circuit board (12) is thus possible.

Abstract: In an apparatus for the treatment of board-shaped articles, particularly printed circuit boards, with a liquid treatment medium, particularly a cleaning, etching, metallizing or rinsing liquid, along a substantially horizontal conveying path defined by a conveying means, for improving the handling of thin circuit boards it is proposed that the conveying means on either side of the conveying path and both above and below the conveying plane comprises elements guiding the longitudinal edges of the boards.