Patents by Inventor Heinz Pilz

Heinz Pilz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190366433
    Abstract: Various embodiments include a method for producing a workpiece by means of an additive production method comprising: producing a powder bed slice by slice; smoothing a respective slice being produced with an edge of a slide down to a target level of the respective slice; raising the edge of the slide if an obstacle projects from the target level in the powder bed to a deflection level above the obstacle and, after it has passed the obstacle, lowering the edge of the slide back down to the target level; after the slide has passed the obstacle, smoothing the powder bed in an area of the obstacle using a brush; and building a workpiece slice by slice using local hardening of the powder.
    Type: Application
    Filed: September 13, 2017
    Publication date: December 5, 2019
    Applicant: Siemens Aktiengesellschaft
    Inventors: Ömer Aydin, Heinz Pilz
  • Patent number: 10105758
    Abstract: An arrangement includes a processing chamber, a coating platform located in the processing chamber, and a coating device with a coating element located in the processing chamber for coating a metal or ceramic powder. The arrangement also has an exchanging device for exchanging at least one portion of the coating element with another portion of the same coating element or for exchanging the entire coating element with another coating element within the processing chamber when the processing chamber is closed. The exchanging device can include a multiple head, e.g., a pivoting head or revolving head, an exchanging station, and/or a moving device that allows a coating element portion that is to be exchanged to be moved or pushed away. A part of the coating element can also be rolled on a supply roller, and the coating element portion can be exchanged by unrolling the coating element from the supply roller.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: October 23, 2018
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Omer Aydin, Heinz Pilz, Martin Schaefer
  • Publication number: 20160121397
    Abstract: An arrangement includes a processing chamber, a coating platform located in the processing chamber, and a coating device with a coating element located in the processing chamber for coating a metal or ceramic powder. The arrangement also has an exchanging device for exchanging at least one portion of the coating element with another portion of the same coating element or for exchanging the entire coating element with another coating element within the processing chamber when the processing chamber is closed. The exchanging device can include a multiple head, e.g., a pivoting head or revolving head, an exchanging station, and/or a moving device that allows a coating element portion that is to be exchanged to be moved or pushed away. A part of the coating element can also be rolled on a supply roller, and the coating element portion can be exchanged by unrolling the coating element from the supply roller.
    Type: Application
    Filed: May 13, 2014
    Publication date: May 5, 2016
    Applicant: Siemens Aktiengesellschaft
    Inventors: Omer Aydin, Heinz Pilz, Martin Schaefer
  • Publication number: 20120183701
    Abstract: A method produces a marked object. To be able to create markings in a particularly flexible way, it is provided that the object is produced by an additive production process, at least one marking being formed in the object during the additive production process. The method makes many degrees of freedom possible in the design of the marking. For example, the method makes it possible in a very simple way for two- or three-dimensional structures to be concealed within the object during the additive production process. In addition or as an alternative, production parameters can be varied, whether stochastically or deterministically, to produce variations in density. For example, a porous microstructure may be produced as a marking. It is also possible for basic material in the object to be left untreated or to be differently treated, so that it forms the marking.
    Type: Application
    Filed: September 16, 2010
    Publication date: July 19, 2012
    Inventors: Heinz Pilz, Olaf Rehme, Martin Schäfer
  • Publication number: 20050184246
    Abstract: A detector module for an X-ray computer tomograph, includes a number of sensor arrays provided next to one another on a printed circuit board. Each of the sensor arrays includes a plurality of first contact elements on a top side, averted from the printed circuit board. In order to make contact with the sensor array, the first contact elements are electrically connected to second contact elements with the aid of conductor tracks that are accommodated in or on an electrically insulating flexible carrier.
    Type: Application
    Filed: February 10, 2005
    Publication date: August 25, 2005
    Inventors: Ludwig Danzer, Bjoern Heismann, Richard Matz, Heinz Pilz, Stefan Wirth, Joerg Zapf
  • Patent number: 6653743
    Abstract: A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted on the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice facing away from the electronic component.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: November 25, 2003
    Assignee: Siemens Aktiengesellschaft
    Inventors: Klaus-Peter Galuschki, Heinz Pilz
  • Publication number: 20030003623
    Abstract: A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted on the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice faring away from the electronic component.
    Type: Application
    Filed: August 15, 2002
    Publication date: January 2, 2003
    Inventors: Klaus-Peter Galuschki, Heinz Pilz
  • Patent number: 6445074
    Abstract: A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted n the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice facing away from the electronic component.
    Type: Grant
    Filed: April 3, 2000
    Date of Patent: September 3, 2002
    Assignee: Siemens Aktiengesellschaft
    Inventors: Klaus-Peter Galuschki, Heinz Pilz
  • Patent number: 6057178
    Abstract: A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted on the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice facing away from the electronic component.
    Type: Grant
    Filed: September 25, 1998
    Date of Patent: May 2, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Klaus-Peter Galuschki, Heinz Pilz
  • Patent number: 4338552
    Abstract: A reversible d-c motor, driving a load such as a vehicular radio antenna, has its armature winding connected in a transistorized energizing circuit which is activated by a start circuit and locks operated as long as the motor speed surpasses a certain threshold, i.e. until a major obstacle or a terminal position is encountered. The threshold may be determined by a voltage sensor detecting the counter-e.m.f. induced in the armature winding, by a Hall-effect device in the magnetic field of the stator, or by a speed sensor. The armature winding lies in series with a current limiter which determines the maximum torque applied to the load and may also transmit a no-load signal to a protective circuit when the motor is found idling, the protective circuit including a timer which cuts off the motor after a predetermined idling period. Alternatively, the operating period may be determined by a pulse counter de-energizing the motor after a preferably settable number of rotor revolutions.
    Type: Grant
    Filed: May 28, 1980
    Date of Patent: July 6, 1982
    Assignee: Richard Hirschmann, Radiotechnisches Werk
    Inventors: Karl-Heinz Pilz, Wolfgang Grater, Hans-Dietrich Mayer