Abstract: For adjustment of heat sinks to be applied to a wafer being used to form a plurality of semiconductor diodes, a mask is applied to the wafer. Openings of the mask are offset in rows relative to one another for the electrolytic deposition of the material of the heat sinks such that optimum exploitation of the wafer surface is achieved. Sufficient space remains for placement of scoring lines on the wafer surface to facilitate breaking of the wafer first into individual ingots, and then into separate laser diodes. End faces of the heat sinks are arranged close to minor faces of the diodes by appropriate placement of the scoring lines.

Abstract: A laser diode array has laser diode strips divided into groups which are separated from one another by zones having a damping or attenuation effect for radiation generated in the diodes. A maximum number of laser diode strips provided within each group is determined such that super radiation or oscillatory mode radiation generated within the groups and which deviates from a primary radiating direction of strips within the groups is negligible.

Abstract: A laser diode which can be easily adjusted during assembly of the diode on a heat sink is mounted over a groove in the heat sink which is free of solder. The groove permits adjustment of a light-transmitting glass fiber relative to the radition-emitting zone of the laser diode. The groove and the laser diode in the form of a chip having a strip-shaped radiation emitting zone are aligned so as to be parallel. Because mechanical connection between the body of the heat sink and the chip exists only outside of the groove, mechanical stresses which would otherwise act upon the radiation-emitting zone are relieved.

Abstract: For reduction and uniformity of mechanical stresses and for uniformity of current supply and heat dissipation into or out of a laser active zone of a laser diode, an additional layer preferably restricted to a waveguide region is provided between a contact layer and a solder layer mounting the diode on a heat sink.