Patents by Inventor Helen J. Walter

Helen J. Walter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer circuit board bonding method utilizing noble metal coated surfaces
    Patent number: 4685210
    Abstract: An electrically and mechanically sound conductive bond between layers of a multi-layer plated through hole circuit board is produced by depositing a layer of noble metal over the surfaces to be joined, juxtaposing the noble metal coated layers and subjecting them to a combination of pressure and heat for a sufficient period of time. Excellent results have been obtained in a multi-layer circuit board for a microstrip microwave antenna with 0.002 inch thick polished silver layers at bonding pressures of 490 to 575 psi and temperatures of 560 to 580 degrees F. for time periods of 20 to 30 minutes.
    Type: Grant
    Filed: March 13, 1985
    Date of Patent: August 11, 1987
    Assignee: The Boeing Company
    Inventors: Michael M. King, Helen J. Walter