Patents by Inventor Helmut Angerer

Helmut Angerer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240091843
    Abstract: A manipulator for components, in particular sheet metal parts, includes a base body mountable stationarily or movable along a guide arrangement, a first pivot arm pivotally coupled to the base body via a horizontal first pivot axis, a second pivot arm pivotally coupled to the first pivot arm via a horizontal second pivot axis and a third pivot arm pivotally coupled to the second pivot arm via a horizontal third pivot axis. A first axis of rotation extending radially to the third pivot axis is formed on the third pivot arm. A gripper support arm is rotatably coupled to the third pivot arm via the first axis of rotation and extends radially to the first axis of rotation. A gripping arrangement is rotatably coupled to the gripper support arm via a second axis of rotation spaced from the first axis of rotation. A bending installation includes the manipulator.
    Type: Application
    Filed: December 21, 2021
    Publication date: March 21, 2024
    Applicant: TRUMPF MASCHINEN AUSTRIA GMBH & CO. KG.
    Inventors: Gerhard ANGERER, Michael SCHERNHAMMER, Florian HAUSMANN, Florian MAIER, Matthias HOERL, Helmut THEIS, Nenad KOVJENIC, Verena STEININGER, Klemens FREUDENTHALER, Richard EDLBAUER, Walter KEPLINGER, Gerhard GUGLER, Alois AUSTALLER
  • Patent number: 9563954
    Abstract: The invention relates to a method for more effectively capturing the three-dimensional surface geometry of objects, particularly for teeth and/or intraoral structures, such as when a scanning processing is interrupted. Depth images are created in which the spatial relationships of points of the depth images to one another remain constant, but an overall spatial orientation of each new depth image is different. Points of the depth image that fulfill a first attribute is verified for every pose. The number of points that have this attribute is then counted. The pose that accordingly has the highest count is thus chosen, and an artificial depth image is then generated, in which the ascertained pose is applied “backwards” to create an artificial depth image. The real new depth image can then be transferred into the artificial depth image in order to create a new pose, which may then be verified by computation.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: February 7, 2017
    Assignee: a.tron3d GmbH
    Inventors: Jurgen Jesenko, Andreas Blassnig, Helmut Angerer
  • Patent number: 9544577
    Abstract: A method of capturing three-dimensional (3D) information on a structure includes obtaining a first image set containing images of the structure with at least one physical camera located at a first position, the first image set comprising one or more images; reconstructing 3D information from the first image set; obtaining 3D information from a virtual camera out of an existing global model of the structure; determining correspondences between the obtained 3D information and the reconstructed 3D information; determining camera motion between the obtained 3D information and the reconstructed 3D information from the correspondences; and updating the existing global model by entering the obtained 3D information using the determined camera motion.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: January 10, 2017
    Assignee: A.TRON3D GMBH
    Inventors: Andreas Blassnig, Helmut Angerer, Engelbert Kelz, Christian Zinner, Stephan Thierjung, Christoph Nowak, Jurgen Jesenko, Horst Koinig
  • Patent number: 9468508
    Abstract: In the case of a method for optical acquisition of the three-dimensional geometry of objects, in particular teeth (4), with a scanner (14), which has a scanning head (13), the three-dimensional geometry that is acquired in a virtual three-dimensional space (1) in the course of scanning is noted. In this case, in the course of scanning, positions of a defined scanner geometry (2) of the scanner (14), in particular of the scanning head (13), are noted relative to the object (4) that is acquired, and, moreover, an area (6) in which the defined scanner geometry (2) is or was located is determined. The determined area (6) is marked, for example as “empty,” in the virtual space (1).
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: October 18, 2016
    Assignee: A.TRON3D GMBH
    Inventors: Jurgen Jesenko, Helmut Angerer, Horst Koinig
  • Patent number: 9363501
    Abstract: A method and system capturing three-dimensional information of a scene on a structure includes operating a light pattern projector to project a known light pattern onto the scene; using at least two cameras, taking images of the scene, the images being two-dimensional images taken chronologically synchronous; using first and second images, and the known position and orientation of the cameras with respect to each other, extracting a first depth map of the scene; using the first image, the known light pattern, and the known position and orientation of the first camera and the light pattern projector with respect to each other, extracting a second depth map of the scene; and using the extracted first depth map and the extracted second depth map of the scene together to make a 3D measurement of the scene.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: June 7, 2016
    Assignee: A. TRON3D GMBH
    Inventors: Andreas Blassnig, Helmut Angerer, Engelbert Kelz, Christian Zinner, Stephan Thierjung, Christoph Nowak, Jurgen Jesenko, Horst Koinig
  • Publication number: 20150178908
    Abstract: Method for capturing the three-dimensional surface geometry of objects, includes: 1) Loading an available TSDF from a storage medium; 2) Capturing a new depth image; 3) Loading available poses to the loaded TSDF; 4) Applying the loaded poses to the loaded TSDF; a) Verifying for each point of the depth image which has been transformed, whether the point has a first defined attribute due to the applied pose and, if applicable, labeling the point; b) Counting all labeled points in the depth image for each pose; 5) Selecting the pose with the most labeled points; 6) Generating an artificial depth image; 7) Applying an ICP method to the new and artificial depth images to gain a new pose; 8) Verifying whether the ICP method leads to a successful registration; 9) If Step 8 is successful, updating the existing TSDF; 10) If unsuccessful, repeating the steps beginning with Step 4).
    Type: Application
    Filed: December 22, 2014
    Publication date: June 25, 2015
    Inventors: Jurgen JESENKO, Andreas BLASSNIG, Helmut ANGERER
  • Publication number: 20150024336
    Abstract: A method and system capturing three-dimensional information of a scene on a structure includes operating a light pattern projector to project a known light pattern onto the scene; using at least two cameras, taking images of the scene, the images being two-dimensional images taken chronologically synchronous; using first and second images, and the known position and orientation of the cameras with respect to each other, extracting a first depth map of the scene; using the first image, the known light pattern, and the known position and orientation of the first camera and the light pattern projector with respect to each other, extracting a second depth map of the scene; and using the extracted first depth map and the extracted second depth map of the scene together to make a 3D measurement of the scene.
    Type: Application
    Filed: July 18, 2014
    Publication date: January 22, 2015
    Applicant: A.TRON3D GMBH
    Inventors: Andreas BLASSNIG, Helmut ANGERER, Engelbert KELZ, Christian ZINNER, Stefan THIERJUNG, Christoph NOWAK, Jurgen JESENKO, Horst KOINIG
  • Publication number: 20150022639
    Abstract: A method of capturing three-dimensional (3D) information on a structure includes obtaining a first image set containing images of the structure with at least one physical camera located at a first position, the first image set comprising one or more images; reconstructing 3D information from the first image set; obtaining 3D information from a virtual camera out of an existing global model of the structure; determining correspondences between the obtained 3D information and the reconstructed 3D information; determining camera motion between the obtained 3D information and the reconstructed 3D information from the correspondences; and updating the existing global model by entering the obtained 3D information using the determined camera motion.
    Type: Application
    Filed: July 18, 2014
    Publication date: January 22, 2015
    Applicant: A.TRON3D GMBH
    Inventors: Andreas BLASSNIG, Helmut ANGERER, Engelbert KELZ, Christian ZINNER, Stefan THIERJUNG, Christoph NOWAK, Jurgen JESENKO, Horst KOINIG
  • Publication number: 20150024337
    Abstract: A method of integrating new information from depth maps into an existing three-dimensional representation of an object surface, the representation being a truncated signed distance function (TSDF) noted in individual voxels, the TSDF indicating, to respective coordinates within a defined volume, a distance to a next surface, includes obtaining a depth map showing the object, the depth map containing values from measurements; and integrating new information from the depth map into the existing TSDF, wherein each individual voxel affected by the depth map within the TSDF is updated and the update for each updated voxel is selected from the group of a front update if said voxel is near the outer side, a rear update if the voxel is near the inner side, and an ambiguous update, each kind of update leads to a different weighting for the updated value within the voxel.
    Type: Application
    Filed: July 18, 2014
    Publication date: January 22, 2015
    Applicant: A.TRON3D GMBH
    Inventors: Andreas BLASSNIG, Helmut ANGERER, Engelbert KELZ, Christian ZINNER, Stefan THIERJUNG, Christoph NOWAK, Jurgen JESENKO, Horst KOINIG
  • Patent number: 8907340
    Abstract: A semiconductor arrangement includes a semiconductor body and a semiconductor device, the semiconductor device including first and second load terminals arranged distant to each other in a first direction of the semiconductor body and a load path arranged in the semiconductor body between the first and second load terminals. The semiconductor arrangement further includes at least one Hall sensor arranged in the semiconductor body distant to the semiconductor device in a second direction perpendicular to the first direction. The Hall sensor includes two current supply terminals and two measurement terminals.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: December 9, 2014
    Assignee: Infineon Technologies Austria AG
    Inventors: Franz Hirler, Walter Rieger, Lutz Goergens, Helmut Angerer, Gianmauro Pozzovivo, Markus Zundel
  • Publication number: 20140255878
    Abstract: In the case of a method for optical acquisition of the three-dimensional geometry of objects, in particular teeth (4), with a scanner (14), which has a scanning head (13), the three-dimensional geometry that is acquired in a virtual three-dimensional space (1) in the course of scanning is noted. In this case, in the course of scanning, positions of a defined scanner geometry (2) of the scanner (14), in particular of the scanning head (13), are noted relative to the object (4) that is acquired, and, moreover, an area (6) in which the defined scanner geometry (2) is or was located is determined. The determined area (6) is marked, for example as “empty,” in the virtual space (1).
    Type: Application
    Filed: March 7, 2014
    Publication date: September 11, 2014
    Applicant: a.tron3d GmbH
    Inventors: Jurgen JESENKO, Helmut ANGERER, Horst KOINIG
  • Publication number: 20130075724
    Abstract: A semiconductor arrangement includes a semiconductor body and a semiconductor device, the semiconductor device including first and second load terminals arranged distant to each other in a first direction of the semiconductor body and a load path arranged in the semiconductor body between the first and second load terminals. The semiconductor arrangement further includes at least one Hall sensor arranged in the semiconductor body distant to the semiconductor device in a second direction perpendicular to the first direction. The Hall sensor includes two current supply terminals and two measurement terminals.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 28, 2013
    Applicant: INFINEON TECHNOLOGIES AUSTRIA AG
    Inventors: Franz Hirler, Walter Rieger, Lutz Goergens, Helmut Angerer, Gianmauro Pozzovivo, Markus Zundel