Patents by Inventor Helmut Kölker

Helmut Kölker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece
    Patent number: 6295977
    Abstract: A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a translational relative movement, directed perpendicular to the longitudinal axis, between the workpiece and a wire web of a wire saw with the aid of a feed device, through the wire web which is formed by a sawing wire. The workpiece is rotated about the longitudinal axis while the wafers are being cut off. There is also a wire saw which is suitable for carrying out the method and has a device for holding and for rotating the workpiece about the longitudinal axis.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: October 2, 2001
    Assignees: Wacker Chemie GmbH, Wacker Siltronic Gesellschaft für Halbleitermaterialien AG
    Inventors: Bert Ripper, Christian Andrae, Karl Egglhuber, Holger Lundt, Helmut Kölker, Jochen Greim