Abstract: The application describes a soldering device comprising a soldering chamber for receiving a liquid and having a soldering chamber opening, an intermediate chamber arranged at the soldering chamber opening and having a substrate changing opening for supplying and removing items to be soldered, and a closure device for opening and closing the soldering chamber opening and the substrate changing opening. The closure device is designed as a unit such that, when the substrate changing opening is being closed, the soldering chamber opening is opened at the same time and vice versa. This soldering device is cost-effective in both production and operation.

Abstract: The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase comprising a first chamber containing the vapor phase and, inside the first chamber within the vapor phase, a second chamber in which a vacuum can be generated and into which the item to be soldered can be introduced. A third chamber communicates with the first chamber to allow the item to be soldered to be transferred into the first chamber by means of a transporting system. The process and device according to the invention are advantageous in that they ensure soldered joints having a higher quality than those of the prior art.

Abstract: The invention relates to a process for controlling the heat transfer to a workpiece during vapor phase soldering. According to said process, a workpiece placed in a vapor phase is first rapidly heated to a predetermined temperature, and then the temperature is controlled by changing the vapor volume on the workpiece surface. Preferably, a workpiece in the vapor phase is heated to a temperature lower than the melting point of the solder, and then the workpiece is heated at the boundary between the vapor phase and the vapor-free space more slowly to the melting point of the solder. This invention is advantageous in that it provides a process for rapid vapor phase soldering with no undesirable side effects, such as, e.g., formation of solder pearls.

Abstract: A process for cooling soldered objects, according to which a liquid is applied onto the soldered object and is evaporated in an accelerated manner. According to a preferred embodiment the soldered object is cooled in a vapor phase soldering apparatus directly after removal from the vapor phase using the vapor phase soldering liquid. The advantages of the process consist in a greatly increased cooling rate of the soldered object and in an improved quality of the soldered joints.

Abstract: Disclosed is a device for separating components (3, 20), in particular electronic components which are connected to a support such as a circuit board (1) by a fixing material such as solder and can be lifted from the support with the aid of a gripping element (17) under a preloaded force acting in the direction in which the components (3, 20) are to be lifted from the support. A lifting device (13) connected to the gripping element (17) causes the preloaded force to become effective when the fixing material reaches its melting temperature. The lifting device (17) is provided with a retaining member (9, 25, 31, 33) whose melting temperature is equal to or higher than that of the fixing material and which triggers the action of lifting the component (3, 20) when the fusible material melts.

Abstract: The invention relates to a transport device and process for loading and removing the part to be soldered in a vapor-phase soldering equipment, in which a support for the part to be soldered is taken in its original direction into and out of a medium container for vapor-phase soldering and a plurality of sealing doors prevent soldering vapor from escaping. The advantages of the invention lie in the simple and economical manufacture of the transport device and low soldering medium consumption.

Abstract: The description relates to a process for soldering printed circuit boards or sets of components in electronics or metals in engineering work. The heat required for the soldering process is at least partly transmitted to the soldering points by wetting with a heated liquid.

Abstract: The described cleaning of work pieces, in particular printed circuit boards or assemblies, after the soldering, is performed by washing with an inert cleansing fluid which is maintained at a temperature slightly below the melting point of the solder. As a result, solvents for dissolving the impurities and soldering fluxes which are harmful to the environment can be dispensed with. This cleaning is particularly advantageous subsequent to the vapor phase soldering since the same fluid can be used for the cleansing fluid as for the heat transfer medium in the vapor phase soldering apparatus. Therefore, the problem of an unwanted mixing of different treatment media (on the one hand heat transfer medium and on the other hand cleansing fluid) does not arise.