Patents by Inventor Helmuth Hermann

Helmuth Hermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for Signal Transmission between Semiconductor Substrates, and Semiconductor Component Comprising Such Semiconductor Substrates
    Publication number: 20090153229
    Abstract: An AC voltage signal is transmitted between a semiconductor substrate and a further semiconductor substrate arranged on the first semiconductor substrate by means of an electromagnetic field through one of the two semiconductor substrates by virtue of each semiconductor substrate having a circuit element that serves for transmission. Both circuit elements are directly electrically decoupled.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Inventors: Andre Hanke, Helmuth Hermann, Michael Dunkel
  • Method for Filling Via Holes in Semiconductor Substrates
    Publication number: 20090083977
    Abstract: A method for filling either blind or through via holes in a semiconductor substrate involves the use of dielectric or conductive polymer paste, and a drying and a curing process of the polymer paste.
    Type: Application
    Filed: September 28, 2007
    Publication date: April 2, 2009
    Inventors: Andre Hanke, Helmuth Hermann, Michael Dunkel