Abstract: A method of and a device for placing chip-type components on a substrate, in which a number of components are simultaneously picked up in presentation positions by means of a pick-up device which has a number of pick-up elements, after which the pick-up device is moved to a position over the substrate and each of the pick-up elements in succession is moved to a position over the desired position on the substrate by movement of the pick-up device and/or the substrate with respect to one another, after which the relevant component is deposited and released in the relevant position by the pick-up element.

Abstract: A method for feeding chip components to positions in which they can be picked up by transfer members, in which the chips are pushed out of a feed channel while being held between an ejection pin and a transfer member part. An elongated part of a transfer member is advanced into a feed channel into contact with one side of a chip, an ejection pin then advances to the other side of the chip and pushes the chip and transfer member out of the feed channel through a removal opening, and the chip is then held by the transfer member while the ejection pin retracts. Preferably, a cover plate prevents movement of the chips toward the transfer member until the member is in contact with the side of the chip.

Abstract: A magnetic tape cassette of the "flip-over" type having side-by-side reels in a housing between two parallel main walls, an exposed run of tape along a front of the cassette housing, and a pivoting cover for the exposed run of tape. A single cassette cover covers the entire front of the housing, and has a pivoting arm at each side which is journalled to the cassette housing sidewalls such that the cover can be opened from its closed position in either direction to two different open positions, by pivoting toward the one or toward the other main wall of the housing. A movable slide may also cover openings which provide access behind the stretch of tape.