Abstract: A lighting unit comprising a tapering cavity surrounded by a circumferential reflective wall and extending between a light emission window and a light entrance surface where a light source is (to be) mounted. An optical plate having a light outcoupling structure is provided at the light emission window for redirecting and issuing light as a uniform lighting unit light beam. Said uniform lighting unit light beam has a first beam emission angle ? in a first direction and optionally, for example for a rectangular shaped light emission window, a second beam emission angle ? in a second direction transverse to the first direction. The tapering cavity having a first cut-off angle ? in said first direction, wherein ?=?+2*? with 0°<?<=10°, and optionally a second cut-off angles ? in the second direction transverse to the first direction wherein ?=?+? with 0°<=?<=10°.

Abstract: The invention relates to a light emitting device, comprising at least one light source (101) and a closed container, the container comprising a first area (105) and a second area (107) that is arranged opposite to the first area (105), the closed container being filled with a heat conducting fluid (111) that is thermally coupled to an inside surface of the closed container, wherein the at least one light source (101) is arranged on an outside surface (115) of the first area of the closed container and thermally coupled to the inside surface (113) of the closed container.

Abstract: A light emitting device (1) comprising at least one light source (2) adapted for, in operation, emitting first light (13) with a first spectral distribution, a light guide (4) made of a luminescent material and comprising a light input surface (41) and a light exit surface (42) extending in an angle different from zero to one another, the light guide further comprising a first further surface (46) extending parallel to and arranged opposite to the light exit surface, wherein the light guide is adapted for receiving the first light (13) with the first spectral distribution at the light input surface, converting at least a part of the first light with the first spectral distribution to second light (14) with a second spectral distribution, guiding the second light with the second spectral distribution to the light exit surface and coupling the second light with the second spectral distribution out of the light exit surface.

Abstract: An LED light bulb has LEDs (32) mounted on a tubular carrier (22) with open ends. The tube (22) functions as a chimney to promote cooling by creating convection currents through the chimney. The cooling can be entirely passive or it may be active by incorporating a fan (50).

Abstract: A lighting unit comprising a tapering cavity surrounded by a circumferential reflective wall and extending between a light emission window and a light entrance surface where a light source is (to be) mounted. An optical plate having a light outcoupling structure is provided at the light emission window for redirecting and issuing light as a uniform lighting unit light beam. Said uniform lighting unit light beam has a first beam emission angle ? in a first direction and optionally, for example for a rectangular shaped light emission window, a second beam emission angle ? in a second direction transverse to the first direction. The tapering cavity having a first cut-off angle ? in said first direction, wherein ?=?+2*? with 0°<?<=10°, and optionally a second cut-off angles in the second direction transverse to the first direction wherein ?=?+? with 0°<=?<=10°.

Abstract: The invention provides a lighting unit (100) comprising (a) a lighting unit cavity (130), (b) a light source unit (110), for light source unit light (111), wherein the light source unit (110) comprises a light source (1100) and a collimator (1200), and (c) a light exit window (120), configured to enclose at least part of the lighting unit cavity (130) and configured to allow transmission of at least part of the light source unit light (111) as a beam of light (101), wherein the light exit window (120) comprises an upstream face (125) and a downstream face (126), with the upstream face (125) directed to the lighting unit cavity (130); wherein the upstream face (125) comprises light outcoupling structures (140), configured to couple the light source unit light (111) via the light exit window (120) out of the lighting unit (100).

Abstract: There is provided a lighting device (10) which is suitable for a retrofit LED lamp, and which comprises an envelope (15) surrounding an inner volume (16), of which envelope an outer surface (12a) is arranged for distributing light from a multiple of light sources (19) of the lighting device. An inner surface (12b) of the envelope is utilized for providing a low thermal resistance of the lighting device on a system level by being at least partly covered by a sheet metal element (13). Driver electronics (17) of the light sources are arranged within the inner volume.

Abstract: A light source assembly, a method for producing a light source assembly, and a lamp are provided. In one example, the light source assembly comprises a substrate comprising first and second substrate portions being arranged at a tilt angle (?) to each other forming a V-shaped structure, wherein, at the tip of the V-shaped structure, the first portion comprises a first electrical terminal and the second portion comprises a second electrical terminal. The light source assembly further comprises a light source arranged to bridge a terminal gap between the first and second electrical terminals such that the light source is in electrical connection with the first and second electrical terminals.

Abstract: The disclosed embodiments relate to a lighting device (1) comprising an exit window (2) and a light source substrate (3) arranged to carry at least one solid-state light source (4), the at least one light source (4) being arranged to emit light through the exit window (2). The exit window (2) is shaped to allow a front surface of the light source substrate (3) to be brought into physical contact with a surface of the exit window facing the light source substrate (3), and in that the light source substrate (3) is held in physical contact with the exit window (2), thereby enabling thermal contact between the light source substrate (3) and the exit window (2). Since thermal contact between the exit window and the light source substrate is secured, the heat transfer of the lighting device will be improved.

Abstract: The invention provides a lighting unit (100) comprising (a) a lighting unit cavity (130), (b) a light source unit (110), for light source unit light (111), wherein the light source unit (110) comprises a light source (1100) and a collimator (1200), and (c) a light exit window (120), configured to enclose at least part of the lighting unit cavity (130) and configured to allow transmission of at least part of the light source unit light (111) as a beam of light (101), wherein the light exit window (120) comprises an upstream face (125) and a downstream face (126), with the upstream face (125) directed to the lighting unit cavity (130); wherein the upstream face (125) comprises light outcoupling structures (140), configured to couple the light source unit light (111) via the light exit window (120) out of the lighting unit (100).

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: In summary, the present invention relates to a device, a system, a method and a computer program enabling a thermally improved packaging of a plurality of light emitting diodes (110, 112, 114) and at least one integrated circuit (116). A most temperature sensitive light emitting diode (110) of the plurality of light emitting diodes is located between less temperature sensitive light emitting diodes (112, 114) of the plurality of light emitting diodes and the at least one integrated circuit. Further, various additional measures such as e.g. varying at least one mounting area (102, 104, 106) of at least one light emitting diode, providing at least one thermal shielding (118), etc. can be taken in order to thermally optimize the packaging.

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: A temperature regulation method and system (100) includes a reservoir (112) having a fluid with a temperature of a value such that, within a control range of a local temperature controller, a local set point temperature is achievable. A piping system (101) delivers the fluid from the reservoir to one or more elements needing temperature control. A heat generator/removal device (110) in one of the fluid paths is disposed at or near an element needing temperature control. For each heat generator/removal device, a local temperature controller (116) and a feedback sensor (114) are configured to control the heat generator/removal device such that an amount of heat exchanged with the fluid, at or near the element needing temperature control, results in a local temperature, monitored by the control feedback sensor to be locally and accurately maintained at the local set point temperature.

Abstract: A precision apparatus has a movable member (A), moving in a bridge element (2) arranged perpendicular to the movement of the moveable element. The bridge element comprising an air slit (S) and a exhaust (E). The bridge element (2) comprises a primary air duct (21), substantially extending along the length of the bridge element, which primary air duct is provided with apertures (21a, 21b), The apertures (21a, 21b) are evenly distributed along the length of the bridge element, and form an air flow passage to a secondary air duct (22), also substantially extending along the length of the bridge element Through the secondary air duct in operation air is drawn through the air slit (S).

Abstract: A lithographic apparatus includes an illumination system for projecting a beam of radiation onto a substrate. The lithographic apparatus further has a chuck assembly for supporting at least one of the substrate or a patterning device, the patterning device serving to impart the beam with a pattern in its cross-section. A heat transfer system is operable between a first surface and a second surface. The heat transfer system is capable of transferring heat between the first surface and the second surface. The first surface is at least partially formed by at least a part of the chuck assembly. The second surface is at least partially formed by at least a part of a component spaced a distance from the chuck. The second surface is mechanically isolated from and thermally coupled to the first surface.

Abstract: The present invention relates to a lamp unit, especially to a UHP lamp unit, comprising a housing, a lamp positioned within said housing, a reflector assigned to said lamp for reflecting light emitted by said lamp through a transmission window, and at least one thermal bridge and/or heat sink unit being assigned to the reflector and/or to the lamp and/or to the housing. The or each thermal bridge and/or heat sink unit is preferably made from a material having a good thermal conductivity, e.g. the or each thermal bridge and/or heat sink is made from metal or ceramics.

Abstract: A light emitting device, comprising a flexible substrate (2) with a single, structured conductive layer (5), and a plurality of LEDs (3) arranged on said substrate (2), said structured conductive layer (5) forming electrodes for driving said LEDs (3). The structured conductive layer comprises a plurality of heat dissipating pads (8), each having an area significantly larger than the area of each LED (3), and each LED (3a) is thermally connected to at least one of said pads (8a), and electrically connected in series between two pads (8a, 8b). Through this design, each LED is thermally connected to a relatively large heat dissipating area, and the thermal energy built up in the LED will be distributed over this area, and then dissipated upwards and downwards from this area. As the addressing can be handled by a single conducting layer, the flexibility of the substrate is improved compared to multilayer substrates.

Abstract: Coil assemblies (2) of electric motors (1) produce heat that can be a disadvantage when needing the electric motor (1) for high precision positioning applications. To reduce the negative impact of the heat, the coils (26a, 26b, 26c) are arranged in an internally cooled housing (21). The housing (21) has an outermost layer (25) at least on the side lacing the magnet assembly (3) of the electric motor (1), the outermost layer (25) being made of low or non-electrically conductive, non-magnetic or nearly non-magnetic material. The outermost layer (25) prevents heat radiation to the environment.