Abstract: An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.

Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

Abstract: A system for cooling electronics includes at least two modular thermal energy storage cards stacked in one of a horizontal or a vertical stack, where the stack provides cooling to a portion to electronics. The cards include: a thermally conductive enclosure bounding an interior cavity, a cell wall structure that includes cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure, a phase change material having a melting point where the phase change material disposed within the cells and in thermal communication with cell walls of the cells, and a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics that includes a heat generating surface. The thermally conductive interface extends from the interior cavity a distance beyond the interior cavity of the enclosure and is in contact with the heat generating surface.

Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.

Abstract: According to one embodiment, a thermal management system is provided that includes at least one chassis frame configured to minimize a thermal spreading resistance of the thermal management system. The chassis frame included at least one chassis body, at least one thermal skeleton embedded into the chassis body, and a working fluid contained within the thermal skeleton and used to dissipate heat from the chassis body.

Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.

Abstract: An electronic device includes an outer case defining an internal volume, a circuit board positioned within the internal volume and having a first surface and a second surface, one or more active components mounted on the first surface of the circuit board, and a thermal management system to provide cooling for the active components. The thermal management system includes a first heat spreader in thermal contact with an active component, a second heat spreader in thermal contact with the second surface of the circuit board, thermal carriers coupled to the first and second heat spreaders to remove thermal energy therefrom, and a heat exchanger coupled to the thermal carriers to receive thermal energy therefrom and dissipate the thermal energy, wherein one thermal carrier is routed between the first heat spreader and the heat exchanger and the other thermal carrier is routed between the second heat spreader and the heat exchanger.

Abstract: A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.

Abstract: A thermal management system including a first vapor housing configured to receive a fluid that absorbs thermal energy from a first heat source, and a phase change material (PCM) housing thermally coupled to the first vapor housing, wherein the PCM housing is configured to receive a PCM that absorbs thermal energy from the first vapor housing, wherein the first vapor housing and the PCM housing are one-piece.

Abstract: A cooling system for cooling a temperature-dependent power device includes an active cooling device and a controller to generate and transmit a drive signal thereto to selectively activate the device. The controller receives an input from sensors regarding the cooling device power consumption and measured operational parameters of the power equipment—including the power device output power if the device is a power producing device or the power device input power if the device is a power consuming device. The controller generates and transmits a drive signal to the cooling device based on the cooling device power consumption and the measured power device input or output power in order to cause the active cooling device to selectively cool the heat producing power device. A net system power output or total system power input can be maximized/minimized by controlling an amount of convection cooling provided by the cooling device.

Abstract: A system is disclosed. The system includes a thermally conductive enclosure bounding an interior cavity, a metallic cell wall structure disposed within the cavity, in thermal communication with the enclosure, and defining a plurality of cells, and a phase change material disposed within the cells and in thermal communication with the cell walls. The plurality of cells have a cell width less than about 5 millimeters, and the cell wall thickness of the cell wall structure is in a range from about 0.25 millimeter to about 1 millimeter.

Abstract: A system is disclosed. The system includes a thermally conductive enclosure bounding an interior cavity, a metallic cell wall structure disposed within the cavity, in thermal communication with the enclosure, and defining a plurality of cells, and a phase change material disposed within the cells and in thermal communication with the cell walls. The plurality of cells have a cell width less than about 5 millimeters, and the cell wall thickness of the cell wall structure is in a range from about 0.25 millimeter to about 1 millimeter.

Abstract: An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.

Abstract: A system and method for providing vibration dampening between a synthetic jet and stationary mounting bracket is disclosed. A synthetic jet assembly includes a synthetic jet having a first plate, a second plate spaced apart from the first plate, a spacer element positioned between the first and second plates to maintain the first and second plates in a spaced apart relationship, the spacer element including an orifice formed therein, and an actuator element coupled to at least one of the first and second plates to selectively cause deflection thereof such that a fluid flow is generated and projected out from the orifice. The synthetic jet assembly also includes a mounting bracket positioned about the synthetic jet to support the synthetic jet and a plurality of suspension tabs coupling the synthetic jet to the mounting bracket in a suspended arrangement.

Abstract: An apparatus, such as an electrical machine, is provided. The apparatus can include a rotor defining a rotor bore and a conduit disposed in and extending axially along the rotor bore. The conduit can have an annular conduit body defining a plurality of orifices disposed axially along the conduit and extending through the conduit body. The rotor can have an inner wall that at least partially defines the rotor bore. The orifices can extend through the conduit body along respective orifice directions, and the rotor and conduit can be configured to provide a line of sight along the orifice direction from the respective orifices to the inner wall.

Abstract: A system is disclosed. The system includes a thermally conductive enclosure bounding an interior cavity, a metallic cell wall structure disposed within the cavity, in thermal communication with the enclosure, and defining a plurality of cells, and a phase change material disposed within the cells and in thermal communication with the cell walls. The plurality of cells have a cell width less than about 5 millimeters, and the cell wall thickness of the cell wall structure is in a range from about 0.25 millimeter to about 1 millimeter.

Abstract: A system for cooling electronic components. The system includes tubing having a central portion attachable to a heat source disposed within a sealed enclosure. Distal portions of the tubing extend outside the enclosure through walls thereof. The system also includes fins attachable to the distal portions.

Abstract: A combustor and a method for reducing a temperature gradient of a combustor component are provided. The combustor includes a coating applied to at least a portion thereof with the coating serving to alter the emissivity of the at least a portion to which it is applied. The method includes applying a coating on at least one of a combustor liner and a flow sleeve, wherein the coating alters the emissivity exhibited where applied.

Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.