Abstract: The invention relates to a plunger for feeding encapsulating material to a mould cavity, comprising at least one peripheral groove recessed into the cylinder casing of the plunger whereby a material part is placed in the groove which only partly fills the groove. The invention also related to a device for encapsulating electronic components mounted on a carrier. In addition, the invention also relates to a method for sealing a fitting of a plunger housing, which plunger is adapted to feed encapsulating material under pressure to a mould cavity.

Abstract: The invention relates to a method for encapsulating electronic components in a mold by the processing steps of: A) placing the electronic component for encapsulating in a mold cavity, and B) feeding an encapsulating material to the mold cavity, wherein at least a part of the mold surface defining the mold cavity is brought into contact with a conditioning gas containing a decreased oxygen concentration relative to the atmosphere. The invention also relates to a device for encapsulating an electronic component, in particular a semiconductor, with encapsulating material.

Abstract: The invention relates to a plunger for feeding encapsulating material to a mould cavity, comprising at least one peripheral groove recessed into the cylinder casing of the plunger whereby a material part is placed in the groove which only partly fills the groove. The invention also related to a device for encapsulating electronic components mounted on a carrier. In addition, the invention also relates to a method for sealing a fitting of a plunger housing, which plunger is adapted to feed encapsulating material under pressure to a mould cavity.

Abstract: The invention relates to a mould part of a mould for encapsulating electronic components mounted on a carrier, composing at least one mould cavity provided in said mould part and at least one runner for moulding material connecting to said mould cavity, wherein the gate from said runner to said mould cavity has an oblong shape. The invention also relates to a mould with at least one such mould part. The invention also provides a method for encapsulating electronic components mounted on a carrier, wherein the liquid moulding material is fed into the mould cavity through a wide supply opening. Finally, the invention also provides an encapsulated electronic component mounted on a carrier, which component is manufactured by this method.

Abstract: An apparatus for encapsulating with plastic lead frames carrying chips includes mutually movable halves. In the closed position the movable halves bound a mold cavity for receiving a lead frame, a feed runner connecting onto the mold cavity for supplying encapsulating material, a pot for receiving an encapsulating material and a plunger reciprocating in the pot, connected onto said feed runner for carrying up encapsulating material under pressure. At a distance from a head end of the plunger a peripheral groove is arranged which is connected to the head end by at least one flow channel. The outer wall of the plunger is provided with helically running grooves and the depth of the grooves increases as seen from the drive side of the plunger.