Patents by Inventor Hendrikus T. Berendts

Hendrikus T. Berendts has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a single product from integrated circuits received on a lead frame
    Patent number: 5410804
    Abstract: Encapsulated integrated circuits (chips) (2, 3, 4, 5, 6) are manufactured by separating the encapsulated integrated circuits arranged on a lead frame (1), subsequently cutting away the lead-connecting strips (7) of the individual products, then bending the leads and finally cutting them to length. By subjecting the products individually to the above stated method steps, products in a great variety of dimensions can be processed. The method and device according to the invention are particularly suitable for manufacturing pilot series on laboratory scale.
    Type: Grant
    Filed: September 14, 1993
    Date of Patent: May 2, 1995
    Assignee: ASM-Fico Tooling B.V.
    Inventor: Hendrikus T. Berendts