Patents by Inventor Heng-Chih Liu

Heng-Chih Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Memory module
    Patent number: 6343020
    Abstract: A memory module includes a circuit board on which memory chips are mounted and a metal casing attached to the circuit board for shielding the memory chips. Conductive traces are formed on the circuit board for electrically engaging corresponding portions of the casing to ground the casing. The casing forms a raised portion defining a space for accommodating the memory chips. A recess is formed on the raised portion and a bottom surface of the recess contacts the memory chips to conduct and remove heat from the memory chips. Ventilation holes are defined in the raised portion for facilitating heat removal. The casing forms two positioning pins inserted into corresponding positioning holes defined in the circuit board for properly positioning the casing with respect to the circuit board. The casing also forms two latching arms engaging with corresponding latching holes defined in the circuit board for securing the casing to the circuit board.
    Type: Grant
    Filed: July 19, 1999
    Date of Patent: January 29, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Pao-Lung Lin, Nien-Tien Cheng, Heng-Chih Liu