Patents by Inventor Heng-Chun Huang
Heng-Chun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7878689Abstract: The present invention relates to a light source package structure, which comprises: an accommodating space for accommodating a light source, a first refraction surface, and at least a second refraction surface. The first refraction surface receives light discharging from the light source while refracting the same to form a first refracting light, the upper part of the first refraction surface further comprising a refracting structure for refracting the light emitted from the light source. The second refraction surface receives and refracts the first refracting light to form a discharging light being emitted out of the light source package structure. Wherein, an included angle is formed between the normal vector of a portion of the second refraction surface and the central axis of the light source package structure. It is noted that the aforesaid package structure can be used in various packaging for improving refraction.Type: GrantFiled: February 26, 2010Date of Patent: February 1, 2011Assignee: Industrial Technology Research InstituteInventors: Yi-Ting Sun, Po-Hung Yao, Heng-Chun Huang, Hsiu-Chen Hsu
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Publication number: 20100149821Abstract: The present invention relates to a light source package structure, which comprises: an accommodating space for accommodating a light source, a first refraction surface, and at least a second refraction surface. The first refraction surface receives light discharging from the light source while refracting the same to form a first refracting light, the upper part of the first refraction surface further comprising a refracting structure for refracting the light emitted from the light source. The second refraction surface receives and refracts the first refracting light to form a discharging light being emitted out of the light source package structure. Wherein, an included angle is formed between the normal vector of a portion of the second refraction surface and the central axis of the light source package structure. It is noted that the aforesaid package structure can be used in various packaging for improving refraction.Type: ApplicationFiled: February 26, 2010Publication date: June 17, 2010Applicant: Industrial Technology Research InstituteInventors: Yi-Ting SUN, Po-Hung Yao, Heng-Chun Huang, Hsiu-Chen Hsu
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Patent number: 7699504Abstract: The present invention relates to a light source package structure, which comprises: an accommodating space for accommodating a light source, a first refraction surface, and at least a second refraction surface. The first refraction surface receives light discharging from the light source while refracting the same to form a first refracting light, the upper part of the first refraction surface further comprising a refracting structure for refracting the light emitted from the light source. The second refraction surface receives and refracts the first refracting light to form a discharging light being emitted out of the light source package structure. Wherein, an included angle is formed between the normal vector of a portion of the second refraction surface and the central axis of the light source package structure. It is noted that the aforesaid package structure can be used in various packaging for improving refraction.Type: GrantFiled: September 14, 2006Date of Patent: April 20, 2010Assignee: Industrial Technology Research InstituteInventors: Yi-Ting Sun, Po-Hung Yao, Heng-Chun Huang, Hsiu-Chen Hsu
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Patent number: 7623293Abstract: The present invention discloses an optical element, having a first optical surface and a second optical surface for receiving an incident light, the optical element comprising: at least a transparent diffusion unit, for scattering the incident light, each being placed on the first optical surface; and at least a transparent collimation unit, for collimating the incident light, each being place on the first optical surface abutted and adjacent to the diffusion unit in an alternative manner.Type: GrantFiled: June 3, 2005Date of Patent: November 24, 2009Assignee: Industrial Technology Research InstituteInventors: Po-Hung Yao, Ben-Sheng Lin, Heng-Chun Huang, Yu-Nan Pao, I-Kai Pan, Yi-Ting Sun
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Publication number: 20080310155Abstract: An LED lighting device is disclosed. The LED lighting device includes a lampshade, a circuit board, edge lighting light emitting diodes (LEDs), and an optical film set. The lampshade has a bottom and a side wall connected to the periphery of the bottom. The other end of the side wall opposite to the bottom defines a light outlet section. The circuit board is provided at the lampshade. The edge lighting LEDs are disposed on the bottom of the lampshade and are electrically connected to the circuit board. Light emitted from each of the edge lighting LEDs is reflected by the lampshade and then exits the lighting device through the light outlet section. The optical film set is disposed at the light outlet section of the lampshade.Type: ApplicationFiled: June 3, 2008Publication date: December 18, 2008Applicant: AMA PRECISION INC.Inventors: Heng-Chun Huang, Chien-Hua Liu
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Publication number: 20080285273Abstract: An LED table lamp including a base, a holder, and a light emitting device is provided, wherein an end of the holder is connected to the base. The light emitting device includes a lampshade connected to the other end of the holder, multiple Lambertian LED light source assemblies, multiple side-emitting LED light source assemblies, a transparent support provided at the lampshade, and multiple brightness enhancement films (BEF). The lampshade has a side wall and a top wall connected the side wall, and the Lambertian LED light source assemblies and the side-emitting LED light source assemblies are disposed on the top wall. The BEFs are disposed on the transparent supports correspondingly to the Lambertian LED light source assemblies and are suitable to focus the light emitted from the Lambertian LED light source assemblies.Type: ApplicationFiled: May 8, 2008Publication date: November 20, 2008Applicant: AMA PRECISION INC.Inventors: Chien-Hua Liu, Heng-Chun Huang
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Patent number: 7248411Abstract: The present invention discloses an optical film with array of microstructures, having a first optical surface and a second optical surface for receiving an incident light. The optical film comprises at least a transparent microstructure formed on the first optical surface, wherein the microstructure further comprises: a first side for scattering the incident light; and a second side for collimating the incident light.Type: GrantFiled: December 7, 2005Date of Patent: July 24, 2007Assignee: Industrial Technology Research InstituteInventors: Po-Hung Yao, I-Kai Pan, Ben-Sheng Lin, Heng-Chun Huang, Yu-Nan Pao, Yi-Ting Sun
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Publication number: 20070139932Abstract: The present invention relates to a light source package structure, which comprises: an accommodating space for accommodating a light source, a first refraction surface, and at least a second refraction surface. The first refraction surface receives light discharging from the light source while refracting the same to form a first refracting light, the upper part of the first refraction surface further comprising a refracting structure for refracting the light emitted from the light source. The second refraction surface receives and refracts the first refracting light to form a discharging light being emitted out of the light source package structure. Wherein, an included angle is formed between the normal vector of a portion of the second refraction surface and the central axis of the light source package structure. It is noted that the aforesaid package structure can be used in various packaging for improving refraction.Type: ApplicationFiled: September 14, 2006Publication date: June 21, 2007Inventors: Yi-Ting Sun, Po-Hung Yao, Heng-Chun Huang, Hsiu-Chen Hsu
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Patent number: 7199930Abstract: The present invention discloses a light modulation element, having a first optical surface and a second optical surface receiving an incident light, the light modulation element comprising: at least a transparent diffusion unit, for scattering the incident light, each being placed on the first optical surface; and at least a transparent collimation unit, for collimating the incident light, each being formed on top of the diffusion unit.Type: GrantFiled: June 13, 2005Date of Patent: April 3, 2007Assignee: Industrial Technology Research InstituteInventors: Po-Hung Yao, I-Kai Pan, Heng-Chun Huang, Yu-Nan Pao, Yi-Ting Sun
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Publication number: 20060291064Abstract: The present invention discloses an optical film with array of microstructures, having a first optical surface and a second optical surface for receiving an incident light. The optical film comprises at least a transparent microstructure formed on the first optical surface, wherein the microstructure further comprises: a first side for scattering the incident light; and a second side for collimating the incident light.Type: ApplicationFiled: December 7, 2005Publication date: December 28, 2006Inventors: Po-Hung Yao, I-Kai Pan, Ben-Sheng Lin, Heng-Chun Huang, Yu-Nan Pao, Yi-Ting Sun
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Publication number: 20060238874Abstract: The present invention discloses a light modulation element, having a first optical surface and a second optical surface receiving an incident light, the light modulation element comprising: at least a transparent diffusion unit, for scattering the incident light, each being placed on the first optical surface; and at least a transparent collimation unit, for collimating the incident light, each being formed on top of the diffusion unit.Type: ApplicationFiled: June 13, 2005Publication date: October 26, 2006Inventors: Po-Hung Yao, I-Kai Pan, Heng-Chun Huang, Yu-Nan Pao, Yi-Ting Sun
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Publication number: 20060239028Abstract: The present invention discloses an optical element, having a first optical surface and a second optical surface for receiving an incident light, the optical element comprising: at least a transparent diffusion unit, for scattering the incident light, each being placed on the first optical surface; and at least a transparent collimation unit, for collimating the incident light, each being place on the first optical surface abutted and adjacent to the diffusion unit in an alternative manner.Type: ApplicationFiled: June 3, 2005Publication date: October 26, 2006Inventors: Po-Hung Yao, Ben-Sheng Lin, Heng-Chun Huang, Yu-Nan Pao, I-Kai Pan, Yi-Ting Sun
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Patent number: 7046441Abstract: The present invention relates to a high-transmission polarization module composed of sub-wavelength structures, which comprises: a transmission substrate and a plurality of collimation units. The transmission substrate possesses a top and a bottom surfaces. The top surface has a plurality of projecting and sunken parts, wherein the sunken part has a first sub-wavelength structure while the projecting part has a second sub-wavelength structure. The collimation units are arranged on the bottom surface according to the positions of the sunken parts capable of guiding the light into the sunken part. The first sub-wavelength structure is capable of separating the light with different polarizations while the second sub-wavelength structure is capable of shifting the phase of the light so that the light can pass the polarization module with a high efficiency and producing a light with a specific polarization.Type: GrantFiled: March 31, 2004Date of Patent: May 16, 2006Assignee: Industrial Technology Research InstituteInventors: Heng-Chun Huang, Jauh-Jung Yang, Jung-Yan Huang, Ming-Yueh Liu, Chuan-Kang Mu
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Patent number: 6962772Abstract: A method for manufacturing a 3-D high aspect-ratio microneedle array device, comprising steps of: providing a substrate, with a photoresist layer coated thereon; performing photolithography on the photoresist layer by using a gray-tone mask so as to form a patterned photoresist layer; performing high-selectivity etching on the patterned photoresist layer and the substrate by using inductively coupled plasma etching so as to transfer the pattern onto the substrate and form a structure; applying a material on the structure; and de-molding the structure from the substrate.Type: GrantFiled: December 27, 2002Date of Patent: November 8, 2005Assignee: Industrial Technology Research Inst.Inventors: Ming-Yueh Liu, Heng-Chun Huang, Jauh-Jung Yang, Kun-Chih Pan
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Publication number: 20050141090Abstract: The present invention relates to a high-transmission polarization module composed of sub-wavelength structures, which comprises: a transmission substrate and a plurality of collimation units. The transmission substrate possesses a top and a bottom surfaces. The top surface has a plurality of projecting and sunken parts, wherein the sunken part has a first sub-wavelength structure while the projecting part has a second sub-wavelength structure. The collimation units are arranged on the bottom surface according to the positions of the sunken parts capable of guiding the light into the sunken part. The first sub-wavelength structure is capable of separating the light with different polarizations while the second sub-wavelength structure is capable of shifting the phase of the light so that the light can pass the polarization module with a high efficiency and producing a light with a specific polarization.Type: ApplicationFiled: March 31, 2004Publication date: June 30, 2005Inventors: Heng-Chun Huang, Jauh-Jung Yang, Jung-Yan Huang, Ming-Yueh Liu, Chuan-Kang Mu
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Publication number: 20040126707Abstract: A method for manufacturing a 3-D high aspect-ratio microneedle array device, comprising steps of: providing a substrate, with a photoresist layer coated thereon; performing photolithography on the photoresist layer by using a gray-tone mask so as to form a patterned photoresist layer; performing high-selectivity etching on the patterned photoresist layer and the substrate by using inductively coupled plasma etching so as to transfer the pattern onto the substrate and form a structure; applying a material on the structure; and de-molding the structure from the substrate.Type: ApplicationFiled: December 27, 2002Publication date: July 1, 2004Applicant: Industrial Technology Research InstituteInventors: Ming-Yueh Liu, Heng-Chun Huang, Jauh-Jung Yang, Kun-Chih Pan