Abstract: An electronic cigarette, an atomization assembly and an atomization component for the same. The atomization component comprises a porous base, a first film, and a second film. The porous base material comprises an atomization surface. The first film and the second film are sequentially formed on the atomization surface. At least one of the first film or the second film is used for generating heat when charged, so as to heat and atomize an e-liquid on the atomization surface.

Abstract: A power decentralized electric locomotive apparatus includes an electric locomotive and a plurality of muck trucks. The electric locomotive and the plurality of muck trucks are connected in sequence, and a mater drive motor is fixedly mounted on the electric locomotive. A slave drive motor is fixedly mounted on at least one of the muck trucks; a torque of the slave drive motor is smaller than a torque of the mater drive motor; and the slave drive motor cooperates with the mater drive motor, to enable the muck truck to travel on rails and reduce drive power and self-weight of the electric locomotive.

Abstract: An inflatable active packer includes: an inner steel pile; and a sleeve coaxially disposed outside the inner steel pile. The inner diameter of the sleeve is larger than the outer diameter of the inner steel pile. The length of the sleeve is less than or equal to the length of the inner steel pile. The sleeve includes an inner wall, and one end of the inner wall is provided with a guide lug. A strengthened clamping layer is attached to the inner wall of the sleeve. A rubber capsule is fixedly disposed in the middle of the strengthened clamping layer; two ends of the strengthened clamping layer are fixedly connected to the sleeve through a compression member. A mounting hole is disposed in the middle of the strengthened clamping layer. The sleeve includes a through hole coaxially with the mounting hole.

Abstract: This application relates to the field of lighting, and discloses an LED filament. The LED filament includes an LED chip unit, a light conversion layer, and an electrode. The light conversion layer covers the LED chip unit and part of the electrode, and a color of a light emitted by the LED filament after lighting is different from a color of the light conversion layer. This application has the characteristics of uniform light emission and good heat dissipation effect.

Abstract: A composition containing recombinant collagen with repairing and soothing effects, eye cream containing the composition and preparation method thereof are provided. The composition contains the following raw materials in parts by weight: 1 to 10 parts of recombinant collagen, 1 to 10 parts of sodium hyaluronate, 1 to 5 parts of bifida ferment lysate, 1 to 15 parts of glucosylglycerol, 1 to 10 parts of bisabolol, 1 to 15 parts eight-treasure essence stock solution, and 1 to 15 parts of pink red plum rechecking essence. The composition features with good skin permeability, contributing to its significant effects on repairing skin barriers and relieving skin inflammation, as well as its advantages of low irritation and high safety. Thus, the composition is suitable for people with damaged eye skin and has good market application prospects.

Abstract: An isocyanate electrolyte solution additive containing a sulfamide structural group has a structure of formula I: where R1 and R2 are identical or different, R1 and R2 are each independently selected from methyl, ethyl, butyl, methoxy, methanesulfonyl, ethanesulfonyl, fluorosulfonyl, trifluoromethanesulfonyl, perfluoroethylsulfonyl, benzenesulfonyl, alkyl-containing benzenesulfonyl, cyano/fluorobenzenesulfonyl and alkoxy-containing benzenesulfonyl, and R1 and R2 can be linked to form one of five-membered ring or six-membered ring. In the electrolyte solution additive, sulfonyl and the isocyanate structural group are organically linked, so the electrolyte solution additive has good thermostability, can function as an electrolyte solution stabilizing agent and avoids high temperature discoloration and acid value increase of the electrolyte solution.

Abstract: The present disclosure provides an optical lens, which includes a first lens member, a second lens member and a first adhesive. The first lens member includes at least one first lens. The second lens member includes a second lens barrel and at least one second lens mounted in the second lens barrel. The at least one second lens and the at least one first lens together forms an imaging optical system. The second lens member has a second optical region and a second structural region surrounding the second optical region. The second structural region has a second top surface and the second top surface has a groove. The first adhesive locates in a first gap between the first lens member and the second lens member, and the first adhesive is accommodated in the groove. The first adhesive is adapted to flow in the groove when uncured.

Abstract: The present disclosure relates to an isocyanate electrolyte solution additive based on an imidazole structural group, belonging to the technical field of non-aqueous electrolyte solution additives of lithium batteries. The structural formula of the electrolyte solution additive is represented by formula I: R1, R2 and R3 are identical or different, the R1, R2 and R3 are each independently selected from one of hydrogen, methyl, ethyl, propyl, tert-butyl, trifluoromethyl, trifluoroethyl, perfluoroethyl, perfluoropropyl, cyanoethyl, phenyl, fluorophenyl, cyano-containing fluorophenyl, alkoxy-containing phenyl and alkyl-containing phenyl. The electrolyte solution additive is used for lithium ion batteries, which effectively inhibits the reduction in battery capacity, restricts the production of a gas caused by decomposition of an electrolyte solution and significant improvement in the service life of the battery during the high temperature cycle and high temperature storage.

Abstract: An optical lens, comprising: a first lens component (100) comprising a first lens barrel (101) and at least one first lens sheet (102) mounted in the first lens barrel; a second lens component (200) comprising a second lens barrel (201) and at least one second lens sheet (202) mounted in the second lens barrel, the at least one second lens sheet and the at least one first lens sheet together constituting an imageable optical system; and an adhesive bonding the first lens component and the second lens component together, at least a part of the adhesive being interposed between a lens barrel and a lens sheet, wherein the statement of between the lens barrel and the lens sheet specifically means between the second lens barrel and the first lens sheet or between the first lens barrel and the second lens sheet. A corresponding assembly method for optical lens, a camera module, an optical lens and assembly method for camera module are further provided.

Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.

Abstract: A split lens assembly module, comprising: a focusing mechanism; and a lens assembly, wherein the lens assembly comprises at least two optical lenses, at least one lens barrel member and a bearing structure, each of the at least one lens barrel member holds at least one optical lens to form at least one to-be-adjusted lens assembly, the bearing structure holds at least one optical lens to form a fixing lens assembly, the to-be-adjusted lens assembly is pre-assembled on the fixing lens assembly, the to-be-adjusted lens assembly is suitable for being adjusted relative to an assembly position of the fixing lens assembly, the fixing lens assembly is mounted inside the focusing mechanism through the bearing structure, and moves as the focusing mechanism is powered on, which is suitable for focusing.

Abstract: An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module.

Abstract: An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.

Abstract: An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.

Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.