Patents by Inventor Henk Rijsdijk

Henk Rijsdijk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050113499
    Abstract: The invention is a low-emission dispersion adhesive based on polyacrylates with an addition of a tall oil resin modified by carboxy groups. The adhesive is distinguished by especially low emissions and otherwise its properties are equally as good, especially in terms of spreadability, initial tack and open time, as those of an adhesive containing balsam resin. The adhesive is very suitable for bonding floor coverings.
    Type: Application
    Filed: August 13, 2004
    Publication date: May 26, 2005
    Inventors: Thomas Tamcke, Henk Rijsdijk, Kari Honkanen
  • Patent number: 5952071
    Abstract: Two-component curable adhesive for blocking automotive wiring bundles, the respective components preferably amine-terminated polyamide Part A, and acrylate, anhydride or epoxy Part B, being contained in separate sheets which are inter-leaved with one another. The concentration of the reactive components in the sheets is chosen to cause the adhesive to flow on initial heating and then to cure to resist further flow at elevated temperatures in service. Apparatus, kits and method for blocking cables or wire bundles using the adhesive are also claimed.
    Type: Grant
    Filed: January 9, 1997
    Date of Patent: September 14, 1999
    Assignee: N.V. Raychem S.A.
    Inventors: Henk Rijsdijk, Noel Overbergh, Gerry De Blick, Graham Miles, Aine Kennan