Patents by Inventor Henner W. Meinhold

Henner W. Meinhold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature controlled showerhead
    Patent number: 10221484
    Abstract: A temperature controlled showerhead for chemical vapor deposition (CVD) chambers enhances heat dissipation to enable accurate temperature control with an electric heater. Heat dissipates by conduction through a showerhead stem and fluid passageway and radiation from a back plate. A temperature control system includes one or more temperature controlled showerheads in a CVD chamber with fluid passageways serially connected to a heat exchanger.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: March 5, 2019
    Assignee: Novellus Systems, Inc.
    Inventors: Henner W. Meinhold, Dan M. Doble, Stephen Yu-Hong Lau, Vince Wilson, Easwar Srinivasan
  • TEMPERATURE CONTROLLED SHOWERHEAD
    Publication number: 20170009344
    Abstract: A temperature controlled showerhead for chemical vapor deposition (CVD) chambers enhances heat dissipation to enable accurate temperature control with an electric heater. Heat dissipates by conduction through a showerhead stem and fluid passageway and radiation from a back plate. A temperature control system includes one or more temperature controlled showerheads in a CVD chamber with fluid passageways serially connected to a heat exchanger.
    Type: Application
    Filed: September 23, 2016
    Publication date: January 12, 2017
    Inventors: Henner W. Meinhold, Dan M. Doble, Stephen Yu-Hong Lau, Vince Wilson, Easwar Srinivasan
  • Method for planar electroplating
    Patent number: 7449098
    Abstract: A disclosed form of mechanically assisted electroplating leads to a flat, thin, overburden. In one example, an accelerator is deposited on a copper surface and mechanically removed in a simplified CMP-like apparatus. The wafer is then plated in an electrolyte containing little or no accelerating additives.
    Type: Grant
    Filed: December 17, 2003
    Date of Patent: November 11, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Jonathan D. Reid, Mark L. Rea, Ismail T. Emesh, Henner W. Meinhold, John S. Drewery
  • Deposition of integrated circuit fabrication materials using a print head
    Patent number: 7091134
    Abstract: In one embodiment, an integrated circuit (IC) fabrication material is dispensed from a print head by dividing its nozzles into several groups, and sequentially allowing each group to fire. The nozzles may be grouped based on the amounts of material they dispense. For example, the nozzles may be grouped by drop volume or drop mass. In one embodiment, an IC fabrication material is dispensed on a substrate by controlling a firing sequence of a nozzle to promote merging of material on the substrate. The firing sequence may also be altered to take into account the firing sequence of adjacent nozzles.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: August 15, 2006
    Assignee: Novellus Systems, Inc.
    Inventors: Henner W. Meinhold, Wayne Cai, Mark L. Rea, Sachin M. Chinchwadkar
  • Sensor for detecting droplet characteristics
    Patent number: 6764168
    Abstract: In one embodiment, a sensor includes two plates that form a capacitor. A droplet passing between the plates changes the capacitance of the sensor, thereby triggering an amplifier coupled to the sensor to generate an output signal. The output signal is indicative of droplet characteristics and may be used to calibrate a mechanism that dispensed the droplet.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: July 20, 2004
    Assignee: Novellus Systems, Inc.
    Inventors: Henner W. Meinhold, Mark L. Rea, Sachin M. Chinchwadkar, Fred J. Chetcuti, John S. Drewery