Abstract: A method of forming a nozzle and an ink chamber of an ink jet device, includes forming a nozzle passage by subjecting a substrate to a directional first etch process from one side of the substrate; applying a second etch process from the same side of the substrate for widening an internal part of the nozzle passage, to form a cavity forming at least a portion of the ink chamber adjacent to the nozzle; and controlling the shape of the cavity by providing, on the opposite side of the substrate, an etch accelerating layer buried under an etch stop layer and by allowing the second etch process to proceed into the etch accelerating layer. The following steps precede the first etch process: forming an annular trench in the substrate on the side of the substrate where the nozzle is to be formed; and passivating the walls of the trench so as to become resistant against the second etch process. The material surrounded by the trench is removed in the first etch process.

Abstract: A method of forming a nozzle and an ink chamber of an ink jet device, includes forming a nozzle passage by subjecting a substrate to a directional first etch process from one side of the substrate; applying a second etch process from the same side of the substrate for widening an internal part of the nozzle passage, to form a cavity forming at least a portion of the ink chamber adjacent to the nozzle; and controlling the shape of the cavity by providing, on the opposite side of the substrate, an etch accelerating layer buried under an etch stop layer and by allowing the second etch process to proceed into the etch accelerating layer. The following steps precede the first etch process: forming an annular trench in the substrate on the side of the substrate where the nozzle is to be formed; and passivating the walls of the trench so as to become resistant against the second etch process. The material surrounded by the trench is removed in the first etch process.

Abstract: The present invention relates to a lithographic projection apparatus with a supporting structure to support and move an object, like a substrate. The supporting structure may be a robot having a robotic arm with a support frame for supporting, e.g. the substrate. The support frame includes a clamping structure having one or more clamps for holding the substrate during movement. The robot arm comprises one or more compliant parts. The clamp may be a Johnson-Raybeck effect type clamp with an oxidized upper surface. For better de-clamping, a RF AC decaying de-clamping voltage may be provided to the clamp. The apparatus may be cleaned with one single substrate only.

Abstract: The invention relates to a transfer apparatus for transferring an object (W). the transfer apparatus comprises a gripper (15) for at least one of gripping the object (W) at a first position and then releasing the object (W) at a second position proximate to a receiver (20) and releasing the object (W) at a first position after gripping the object at a second position proximate to the receiver (20). The transfer apparatus is further provided with a measurement device (22) arranged to measure the relative position of the gripper (15) with respect to the receiver (20) in at least one dimension. Further, a relative position error is defined with respect to a desired relative position based on the relative position measured. The relative position of the gripper (15) and the receiver (20) are adjusted for minimizing the relative position error in the second position.

Abstract: A system for use in for example the production of semiconductors comprises a chamber (10) having a sealed inner space (11), such as a vacuum chamber. A heavy mass (14), such as a table, is arranged within the vacuum chamber and is supported or carried by one or more vibration dampers or isolators (15). Each vibration isolator comprises a hollow or tubular member (18) having an open inner end portion, which extends into the sealed space of the chamber (10). A support structure (21) is arranged at the inner end of the hollow member for supporting the mass or table (14). The opposite ends of a bellows (24) are sealingly connected to the hollow member (18) and the support structure (21), respectively, so as to seal the inner space (26) of the hollow member (18) from the inner space (11) of the chamber (10).

Abstract: The present invention relates to a lithographic projection apparatus with a supporting structure to support and move an object, like a substrate. The supporting structure may be a robot having a robotic arm with a support frame for supporting, e.g. the substrate. The support frame includes a clamping structure having one or more clamps for holding the substrate during movement. The robot arm comprises one or more compliant parts. The clamp may be a Johnson-Raybeck effect type clamp with an oxidized upper surface. For better de-clamping, a RF AC decaying de-clamping voltage may be provided to the clamp. The apparatus may be cleaned with one single substrate only.