Patents by Inventor Henrik Gradin

Henrik Gradin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • A REAL-TIME TRUST DISTRIBUTED MULTI ASSET CONVERTER
    Publication number: 20220351289
    Abstract: A method and a system of exchanging assets between a plurality of parties, each party having an asset to exchange for a target asset, comprising: converting assets of each of the parties into bridge assets owned by the respective parties and represented in a transaction system, converting said system bridge assets of the respective parties to target assets requested by said parties.
    Type: Application
    Filed: September 29, 2020
    Publication date: November 3, 2022
    Inventors: Henrik GRADIN, Henrik WESTERBERG
  • A SYSTEM AND A METHOD FOR ACHIEVING CONSENSUS BETWEEN MULTIPLE PARTIES ON AN EVENT
    Publication number: 20210209885
    Abstract: The present invention relates to a system and a method for achieving consensus between multiple parties (A, B, C) on an event and/or order of events (1 . . . 5) at high speed by verifying and voting on events by creating a voting event referencing one or multiple other events individually or as a group of events.
    Type: Application
    Filed: May 17, 2019
    Publication date: July 8, 2021
    Inventors: Filip LUNDIN, Simon NORELL, Sigge AHLQVIST, Daniel FREDÉN, Hampus LARSSON, Ivar BENGTSSON, Michael FICHTER, Lukas GRANNAS, Henrik GRADIN, Felix MIR, Fredrik RAHM
  • Method for the wafer-level integration of shape memory alloy wires
    Patent number: 9054224
    Abstract: The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: June 9, 2015
    Assignee: SENSEAIR AB
    Inventors: Stefan Braun, Frank Niklaus, Andreas Fischer, Henrik Gradin
  • METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES
    Publication number: 20130292856
    Abstract: The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.
    Type: Application
    Filed: November 22, 2011
    Publication date: November 7, 2013
    Applicant: SENSEAIR AB
    Inventors: Stefan Braun, Frank Niklaus, Andreas Fischer, Henrik Gradin
  • METHOD FOR MECHANICAL AND ELECTRICAL INTEGRATION OF SMA WIRES TO MICROSYSTEMS
    Publication number: 20120174572
    Abstract: The present invention relates to methods for the batch fixation and electrical connection of pre-strained SMA wires on a microstructured substrate using electroplating, providing high bond strength and electrical connections in one processing step. The integration process here developed relies on conventional micro machining techniques and it provides an efficient solution to some problems that have hindered the widespread diffusion of bulk SMA to MEMS, such as the lack of cost-efficient integration methods of bulk SMA and the difficult electrical contacting of the actuator material at small scale. Also disclosed herein is a Joule-heated SMA wire actuator on silicon MEMS.
    Type: Application
    Filed: January 9, 2012
    Publication date: July 12, 2012
    Inventors: Donato Clausi, Jan Piers, Dominiek Reynaerts, Stefan Braun, Henrik Gradin, Wouter van der Wijngaart