Abstract: The position, velocity and/or acceleration of one portion (22A) of an apparatus relative to another portion (20) of the apparatus is measured with a hermetically enclosed sensor (100) having therein, a moveable armature (104) magnetically coupled to the apparatus through a wall (108) of the hermetic enclosure (102) so as to move in a predetermined direction (116) in response to relative motion (30) of the apparatus, combined with an optical detector (110, 112, 114) extending within the same hermetic enclosure (102) for measuring the position and/or motion (116) of the magnetically coupled armature (104) responding to the relative motion (30) of the apparatus.

Abstract: An improved semiconductor device package and method include, in a first embodiment, a die supporting leadframe having fingers inside the package body which are interleaved with mating fingers of a metallic heat extractor, without touching. A thermally conductive encapsulation fills the spaces between and around the fingers to provide thermal coupling and electrical isolation. The heat extractor extends outside the package body. Alternatively, the heat extractor and the leadframe have large parallel faces inside the package body which are arranged in a face-to-face relationship, without touching. An insulating spacer locks the opposing faces in the spaced-apart, electrically isolated relationship. An encapsulation fills any remaining space between the faces to provide efficient thermal coupling.