Abstract: A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.

Abstract: A variable inductor is made from two elements separated by an insulating layer. The first element is elastic and serves as a coil shaped support for the inductive element. This elastic element is made with a memory and can be made to change its size by the application of heat. The inductive element is formed over the coil shaped support by layering a thin layer of a highly conductive material such as gold over the insulator layered on the elastic element. As heat is applied to the coil or as an electric current is applied to the elastic element, the size of the coil shaped support is changed which changes the inductive value of the inductive element formed by the conductive layer.

Abstract: An evaporative cooling vessel (100) for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The evaporative cooling vessel (100) includes a cavity (105) for holding a fugitive material (107) at the housing (111) of an electronic part to maintain the housing at or below a specified temperature. As heat is applied during solder reflow, the electronic part is subjected to a high temperature capable of allowing solder to melt. Thus, the part housing (111) of the electronic part can be controlled at a substantially lower temperature than the reflow temperature. This allows the evaporative cooling vessel (110) to use the evaporative cooling properties of the fugitive material to prevent damage to the electronic part.

Abstract: An electrical circuit board (100) includes a substrate (101) on which a metallized bar code pattern (104) is disposed. The substrate (101) further includes an electrical circuit metallization pattern (103) which incorporates at least a portion of the metallized bar code pattern (104).

Abstract: A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material containing a fugitive material (109) to a predetermined portion of an electronic part which must be kept below the solder reflow temperature to prevent damage. Heat is then applied and the electronic part is subjected to a high reflow temperature capable of allowing solder to melt. The predetermined portion of the electronic part is controlled (113) at a substantially lower temperature than the high temperature due to evaporative cooling properties of the fugitive material avoiding damage to the electronic part.

Abstract: A soldering process using two different types of solder alloys is disclosed. The first solder alloy (115) undergoes a solid-to-liquid transition at a first temperature. The second solder alloy (120) undergoes this solid-to-liquid transition at a second temperature, the second temperature being greater than the first temperature. The soldering composition is deposited (20) on a substrate (100) having solderable portions (105) and is heated to a temperature that is above the first temperature but below the second temperature (32). During this time, the first solder alloy liquifies, while the second solder alloy remains solid. The soldering composition is subsequently cooled (40) to solidify the first solder material. A part or electronic component is added (80) to the solidified solder material and the solder materials is again heated above the second temperature (30) in order to reflow the solder and form a metallurgical bond between the substrate and the electronic component.

Abstract: A device (100) for use in a test fixture system which uses a plurality of ultrasonic transducers (103,105,107) to transfer energy to a plurality of contact probes (109). The ultrasonic energy enables the pins (111) to pierce and move obstructing materials to insure adequate electrical contact between the contact probe and an electrical connector on a device under test.

Abstract: A pad arrangement (100) for aligning and attaching a surface mount component (402) with other circuitry includes a substrate (102) upon which opposing pads (108) are attached. Each of the pads occupies a substantially rectangular area (110) having four sides. In order to facilitate alignment of the surface mount component the substantially rectangular area has two opposing flat sides an outwardly extending arcuate area (112) along at least one of the other two sides.

Abstract: A strip line component suitable for transporting radio frequency signals from point to point in an electronic assembly, including a first conductive element (13) having a first and a second termination contact (23 and 33), disposed in a planar fashion with a first or length dimension (15) and a second or width dimension (27), a dielectric material (17) suitable as a printed circuit board substrate and having a first planar surface (19), disposed around the first conductive element along the length dimension, where the first termination contact is preferably disposed on the first planar surface, and a second conductive element (21) having a plurality of contacts some of which are preferably on the first planar surface, disposed adjacent to and enclosing the dielectric material along the length dimension and spaced from the first conductive element by a third or height dimension (29) that is perpendicular to the width dimension.

Abstract: A solder-clad printed circuit board (100) has solder particles of one alloy (120) arranged within a matrix of a second solder alloy (115). This arrangement forms a flat structure that is alloyed to the solder pads (105) on the substrate. The solder particles (120) have a predetermined melting temperature and are made from one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The second solder alloy (115) is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight, and the second solder alloy may comprise about 12% by weight of the solder cladding.

Abstract: A method for attaching a shield (102) to a an electronic assembly (116) having a heat sink (110) includes applying solder on the inner walls (104) of the shield (102). Next, the shield (102) is placed over the electronic assembly (116) such that the electronic assembly (116) is covered by the shield (102) and the shield (102) is in mechanical contact with the heat sink (110). Then, the shield (102) and heat sink (110) are heated so that the solder on the inner walls (104) of shield (102) flows and solders the shield (102) to the heat sink (110).

Abstract: The method for dispensing liquid on a substrate includes providing a plate (108) having a plurality apertures (110). These apertures (110) conform to the pattern of a plurality of pads (104, 106) of at least one component of a substrate (102). The apertures (110) are filled with the liquid to be dispensed, and are then aligned with the plurality of pads (104, 106) on the substrate (102). The liquid is simultaneously transferred out of the apertures (110)and onto the plurality of pads (104, 106) using a blower (112 ).

Abstract: A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702) portions for attaching to a corresponding pad on a substrate (102) by a reflow solder process (1200). A pad arrangement (100) is formed including two opposite pads (108), each pad (108) occupying a tri-oval-shaped area. The tri-oval-shaped area includes an elliptical area (110) substantially centered under the bottom portion (704) of the corresponding termination of the component (402) when the component (402) is aligned with the pad arrangement (100), and an arcuate area (112) contiguous with the elliptical area (110) and extending towards the opposite pad (108) in a central lengthwise direction.

Abstract: A method of forming flat solder bumps (16 and 18) on contact areas (12 and 14) of a first side and second side of a printed circuit board (12, 14 and 10) comprises the steps of applying solder paste in a predetermined pattern and a predetermined thickness on the contact areas of the first side and the second side of the printed circuit board forming joint areas. Next, the solder paste is reflowed. Then, the solder joints on the first side are flattened (17). Before surface mounted components (20 and 26) are mounted on the printed circuit board, tack media (32) is dispensed onto the joint areas. Subsequently, the printed circuit boards is reflowed. Now the second side of the printed circuit board is flattened (19). As with the first side, tack media (34) is dispensed on the solder joints on the second side before surface mounted components (40 and 46) are mounted on the second side. Finally, the printed circuit board is reflowed again.