Patents by Inventor Henry G. Heck

Henry G. Heck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8921491
    Abstract: Embodiments of the invention provide an impact modified composition comprising ethylene/?-olefin interpolymers. The ethylene/?-olefin interpolymers are characterized by an average block index, ABI, which is greater than zero and up to about 1.0 and a molecular weight distribution, Mw/Mn, greater than about 1.3. In addition or alternatively, the block ethylene/?-olefin interpolymer is characterized by having at least one fraction obtained by Temperature Rising Elution Fractionation (“TREF”), wherein the fraction has a block index greater than about 0.3 and up to about 1.0 and the ethylene/?-olefin interpolymer has a molecular weight distribution, Mw/Mn, greater than about 1.4.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: December 30, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Kim L. Walton, Theresa J. Hermel-Davidock, Henry G. Heck, Phillip D. Hustad, Mark T. Berard
  • Patent number: 8710125
    Abstract: The invention provides a polyolefin composition comprising: A) a propylene-based polymer having a flex modulus of greater than 1500 MPa and an HDT of greater than 100° C.; B) an ethylene/?-olefin interpolymer having Tg of less than ?30° C., a tan delta, measured at 0.1 radians/s at 190° C., of less than 3, an HDT that is greater than, or equal to, the peak melting temperature of the ethylene/?-olefin interpolymer, measured by differential scanning calorimetry; and C) a fiber filler; and D) a nitrogen source and/or a phosphorus source, wherein at least one source is derived from at least one organic compound, or salt thereof; and wherein the weight ratio of the propylene-based polmer:ethylene/?-olefin interpolymer (A:B) is from 9:1 to 6:4.
    Type: Grant
    Filed: July 1, 2010
    Date of Patent: April 29, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Anteneh Z. Worku, Kim L. Walton, Henry G. Heck
  • Patent number: 8283399
    Abstract: Filled, thermoplastic polyolefin (TPO) compositions having a total energy absorption during impact at ?30° C. of at least 20 ft-lb-f as measured by an Instrumented Dart Impact Test (ASTM D3763) at 6.7 m/s and a peak tangent flexural modulus of>2100 MPa (305,000 psi as measured by ASTM D-790, the composition comprising based on the total weight of the TPO composition; A) 36-56 wt % of a crystalline polypropylene having a MFR of at least 1 and a melting point of at least 160° C. as measured by DSC; and B) 64-44 wt % of an elastomer/filler composition comprising (1) an EAO elastomer having a (1) Tg of less than ?50° C. as measured by DSC, (b) tan delta between >2 and 3 as measured at 0.1 rad/s and 190° C. with an Advanced Rheometrie Expansion Systems rheometer. and (c) HDT greater than or equal to the peak melting temperature of the elastomer as measured by DSC, and (2) a platy filler, e.g.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: October 9, 2012
    Assignee: Dow Global Technologies LLC
    Inventor: Henry G. Heck
  • Publication number: 20120088868
    Abstract: The invention provides a polyolefin composition comprising: A) a propylene-based polymer having a flex modulus of greater than 1500 MPa and an HDT of greater than 100° C.; B) an ethylene/?-olefin interpolymer having Tg of less than ?30° C., a tan delta, measured at 0.1 radians/s at 190° C., of less than 3, an HDT that is greater than, or equal to, the peak melting temperature of the ethylene/?-olefin interpolymer, measured by differential scanning calorimetry; and C) a fiber filler; and D) a nitrogen source and/or a phosphorus source, wherein at least one source is derived from at least one organic compound, or salt thereof; and wherein the weight ratio of the propylene-based polmer:ethylene/?-olefin interpolymer (A:B) is from 9:1 to 6:4.
    Type: Application
    Filed: July 1, 2010
    Publication date: April 12, 2012
    Applicant: Dow Global Technlogies LLC
    Inventors: Anteneh Z. Worku, Kim L. Walton, Henry G. Heck
  • Publication number: 20100204381
    Abstract: Filled, thermoplastic polyolefin (TPO) compositions having a total energy absorption during impact at ?3O° C. of at least 20 ft-lb-f as measured by an Instrumented Dart Impact Test (ASTM D3763) at 6.7 m/s and a peak tangent flexural modulus of >2100 MPa (305,000 psi as measured by ASTM D-790, the composition comprising based on the total weight of the TPO composition; A) 36-56 wt % of a crystalline polypropylene having a MFR of at least 1 and a melting point of at least 160° C. as measured by DSC; and B) 64-44 wt % of an elastomer/filler composition comprising (1) an EAO elastomer having a (1) Tg of less than ?50° C. as measured by DSC, (b) tan delta between >2 and 3 as measured at 0.1 rad/s and 190° C. with an Advanced Rheometrie Expansion Systems rheometer. and (c) HDT greater than or equal to the peak melting temperature of the elastomer as measured by DSC, and (2) a platy filler, e.g.
    Type: Application
    Filed: August 27, 2008
    Publication date: August 12, 2010
    Inventor: Henry G. Heck
  • Patent number: 7741398
    Abstract: Compositions comprising (i) a crystalline, isotactic propylene homopolymer, (ii) an ethylene/?-olefin elastomeric impact modifier, and (iii) a reinforcing grade of filler, for example, talc. The crystalline isotactic propylene homopolymer has a flex modulus of greater than about 1930 MPa and a heat deflection temperature (HDT) of greater than about 100° C.; the ethylene/?-olefin interpolymer has a Tg of less than about ?30° C., and a tan delta measured at 0.1 radians/s at 190° C. of less than about 2; and the filler has a HDT reinforcing efficiency of at least about 2. The composition has an HDT of greater than about 100° C. and a flex modulus of greater than about 1930 MPa.
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: June 22, 2010
    Assignee: Dow Global Technologies Inc
    Inventor: Henry G. Heck
  • Publication number: 20100143676
    Abstract: The invention includes an interlayer film and composition comprising a polymer composition obtainable from (a) at least one low crystallinity propylene polymer, and at least one (b) internal adhesion enhancer, (c) at least one clarity enhancer or (d), more preferably, both (b) and (c). The invention also includes a process of preparing a film comprising (a) supplying at least one first component, a low crystallinity propylene polymer, (b) supplying at least one second component, selected from at least one an internal adhesion enhancer, at least one clarity enhancer or a combination thereof; and, (d) admixing the first and second components and optional additives.
    Type: Application
    Filed: September 17, 2007
    Publication date: June 10, 2010
    Applicant: DOW GLOBAL TECHNOLOGIES INC.
    Inventors: Stephen F. Hahn, Henry G. Heck, Pankaj Gupta, Steven R. Jenkins, Seema V. Karande, Shaun Parkinson, Jesus Nieto, Rajen M. Patel, Stephen J. Skapik, III
  • Patent number: 7714057
    Abstract: An automotive part containing at least one component formed from a composition comprising the following: (i) a crystalline, isotactic propylene homopolymer, (ii) an ethylene/?-olefin elastomeric impact modifier, and (iii) a reinforcing grade of filler, for example, talc. The crystalline isotactic propylene homopolymer has a flex modulus of greater than about 1930 MPa and a heat deflection temperature (HDT) of greater than about 100° C.; the ethylene/?-olefin interpolymer has a Tg of less than about ?30° C., and a tan delta measured at 0.1 radians/s at 190° C. of less than about 2; and the filler has a HDT reinforcing efficiency of at least about 2. The automotive part has an HDT of greater than about 100° C. and a flex modulus of greater than about 1930 MPa.
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: May 11, 2010
    Assignees: Dow Global Technologies Inc., Inteva Products, LLC
    Inventors: Henry G. Heck, Srimannarayana Kakarala
  • Publication number: 20100113698
    Abstract: Embodiments of the invention provide an impact modified composition comprising ethylene/?-olefin interpolymers. The ethylene/?-olefin interpolymers are characterized by an average block index, ABI, which is greater than zero and up to about 1.0 and a molecular weight distribution, Mw/Mn, greater than about 1.3. In addition or alternatively, the block ethylene/?-olefin interpolymer is characterized by having at least one fraction obtained by Temperature Rising Elution Fractionation (“TREF”), wherein the fraction has a block index greater than about 0.3 and up to about 1.0 and the ethylene/?-olefin interpolymer has a molecular weight distribution, Mw/Mn, greater than about 1.4.
    Type: Application
    Filed: September 28, 2009
    Publication date: May 6, 2010
    Inventors: Kim L Walton, Theresa J. Hermel-Davidock, Henry G. Heck, Phillip D. Hustad, Mark T. Berard
  • Publication number: 20100016482
    Abstract: Compositions comprising: A) a crystalline isotactic propylene homopolymer having a flex modulus of greater than 1930 MPa and an HDT of greater than 100° C.; B) an ethylene/?-olefin interpolymer having Tg of less than ?30° C., a tan delta measured at 0.1 radians/s at 190° C. of less than 2, an HDT that is greater than, or equal to, the peak melting temperature of the ethylene/?-olefin interpolymer, measured by differential scanning calorimetry, and C) a platy filler, and D) a nitrogen source and a phosphorus source, where at least one source is derived from at least one organic compound, or salt thereof, and wherein the weight ratio of homopolymer?interpolymer (A:B) is between 9:1 and 6:4. The invention provides other compositions, articles formed from compositions, and methods of making the same.
    Type: Application
    Filed: December 20, 2007
    Publication date: January 21, 2010
    Applicant: Dow Global Technologies Inc.
    Inventors: Henry G. Heck, Anteneh Z. Worku
  • Publication number: 20080132595
    Abstract: A composition comprising: (a) a high melt strength material, comprising a first polymer selected from the group consisting of an elastomeric ethylene/?-olefin polymer and a polypropylene polymer, and (b) a high flow material, comprising a second polymer selected from the group consisting of an elastomeric ethylene/?-olefin polymer and a polypropylene polymer. The high melt strength material has a dynamic complex viscosity greater than, or equal to, 175,000 Poise (17,500 Pa-s), measured using parallel plate rheometry at 1 radians per second and 190 degrees Centigrade, and the high flow material has a ratio, ?*/td, less than 2500, where ?* is the dynamic complex viscosity and td is the tan delta, both measured at 1 radian per second at 190 degrees Centigrade. The composition exhibits minimal necking when extruded at high speeds and is particularly useful for making sheets via high speed extrusion.
    Type: Application
    Filed: November 16, 2005
    Publication date: June 5, 2008
    Inventor: Henry G. Heck
  • Patent number: 6559230
    Abstract: Safety glass interlayers are prepared from a composition comprising: A. A homogeneously linear or substantially linear ethylene/&agr;-olefin interpolymer, e.g., ethylene/1-octene; B. A coagent containing at least two vinyl groups, e.g., trimethyol propane tri(meth)acrylate; and C. A peroxide, e.g., Luperox™ 101. The interlayer films exhibit an excellent combination of tear strength and clarity.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: May 6, 2003
    Assignee: DuPont Dow Elastomers L.L.C.
    Inventors: Henry G. Heck, Douglas P. Waszeciak
  • Publication number: 20020099145
    Abstract: Safety glass interlayers are prepared from a composition comprising:
    Type: Application
    Filed: September 21, 2001
    Publication date: July 25, 2002
    Inventors: Henry G. Heck, Douglas P. Waszeciak
  • Patent number: 5071711
    Abstract: Preforms for molding processes such as resin transfer molding processes are prepared by melting a solid, non-sintering, thermoplastic-like resinous compound on the surface of a substrate material. After cooling, assembling one or more plies of the coated substrate material into the desired shape; heating the shaped substrate material to a temperature above the melting temperature of the resinous compound and subsequently cooling to a temperature below the melting point of the resinous compound.
    Type: Grant
    Filed: January 25, 1991
    Date of Patent: December 10, 1991
    Assignee: The Dow Chemical Company
    Inventors: Henry G. Heck, Warren D. White
  • Patent number: 4992228
    Abstract: Preforms for molding processes such as resin transfer molding processes are prepared by melting a solid, non-sintering, thermoplastic-like resinous compound on the surface of a substrate material; after cooling, assembling one or more plies of the coated substrate material into the desired shape; heating the thus shaped substrate material to a temperature above the melting temperature of resinous compound and subsequently cooling to a temperature below the melting point of the resinous compound.
    Type: Grant
    Filed: September 28, 1989
    Date of Patent: February 12, 1991
    Assignee: The Dow Chemical Company
    Inventors: Henry G. Heck, Warren D. White
  • Patent number: 4581393
    Abstract: Compositions of a vinylized epoxy resin, sized glass fibers and a complexing agent exhibit reduced fiber prominence upon curing with a metal composition than when employing no complexing agent.
    Type: Grant
    Filed: February 22, 1985
    Date of Patent: April 8, 1986
    Assignee: The Dow Chemical Company
    Inventors: Lorraine J. Fortier, Henry G. Heck