Patents by Inventor Henry Iksan

Henry Iksan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cavity chip package
    Patent number: 7339278
    Abstract: A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: March 4, 2008
    Assignee: United Test and Assembly Center Ltd.
    Inventors: Henry Iksan, Seong Kwang Brandon Kim, Susanto Tanary, Hien Boon Tan, Yi Sheng Anthony Sun
  • CAVITY CHIP PACKAGE
    Publication number: 20070069371
    Abstract: A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.
    Type: Application
    Filed: September 28, 2006
    Publication date: March 29, 2007
    Applicant: UNITED TEST AND ASSEMBLY CENTER LTD.
    Inventors: Henry IKSAN, Seong Kwang Brandon KIM, Susanto TANARY, Hien Boon TAN, Yi Sheng Anthony SUN