Patents by Inventor Henry J. Campbell

Henry J. Campbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of solder reflow assembly
    Patent number: 4334646
    Abstract: A solder reflow assembly technique wherein a substrate with solder pattern is immersed in a hot bath; after reflow of the solder, elements having a solder pattern therein are individually positioned on the substrate solder pattern; and the elements are aligned on the substrate by the surface tension created by the capillary action of the molten solder.
    Type: Grant
    Filed: April 17, 1980
    Date of Patent: June 15, 1982
    Assignee: Harris Corporation
    Inventor: Henry J. Campbell