Patents by Inventor Henry Meyer

Henry Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11771707
    Abstract: Embodiments of the present invention are directed to a plurality of substantially spherical microspheres comprising at least one API substantially dispersed in at least one polymer and a lyoprotectant on an outside surface of the plurality of substantially spherical microspheres, wherein the plurality of substantially spherical microspheres have a D99[num] particle diameter of less than about 10 ?m; a D90[num] circularity value of from about 0.8 to about 1.0; and comprise API in a weight of about 20 to about 40 wt. % of the polymer. Other embodiments relate to injectable compositions comprising such microspheres and methods of treating a number of conditions by administering such injectable compositions to a subject.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: October 3, 2023
    Assignee: SPINETHERA
    Inventors: Jeffrey Missling, Emily R. Rolfes Meyering, Henry Meyer, Celeste Ondich
  • Patent number: 11688821
    Abstract: In an example, a wireless gamma and or hard X-ray radiation detector includes a bulk semiconductor crystal, electrical contacts, a bias circuit, and a terahertz (THz) electromagnetic (EM) wave receiver. The bulk semiconductor crystal and includes indium antimonide (InSb), cadmium telluride (CdTe), or cadmium zinc telluride (CdZnTe). The electrical contacts are coupled to two facets of the bulk semiconductor crystal. The bias circuit is electrically coupled to the bulk semiconductor crystal through the electrical contacts. The THz EM wave receiver is positioned to detect THz radiation emitted by the bulk semiconductor crystal.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: June 27, 2023
    Inventor: Henry Meyer Daghighian
  • Publication number: 20230041758
    Abstract: In an example, a wireless gamma and or hard X-ray radiation detector includes a bulk semiconductor crystal, electrical contacts, a bias circuit, and a terahertz (THz) electromagnetic (EM) wave receiver. The bulk semiconductor crystal and includes indium antimonide (InSb), cadmium telluride (CdTe), or cadmium zinc telluride (CdZnTe). The electrical contacts are coupled to two facets of the bulk semiconductor crystal. The bias circuit is electrically coupled to the bulk semiconductor crystal through the electrical contacts. The THz EM wave receiver is positioned to detect THz radiation emitted by the bulk semiconductor crystal.
    Type: Application
    Filed: September 29, 2021
    Publication date: February 9, 2023
    Inventor: Henry Meyer Daghighian
  • Patent number: 11271657
    Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: March 8, 2022
    Assignee: II-VI DELAWARE, INC.
    Inventors: Giuliano Coli, Stephen Nelson, Henry Meyer Daghighian
  • Patent number: 11057984
    Abstract: A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: July 6, 2021
    Assignee: II-VI DELAWARE, INC.
    Inventors: Steven C. Bird, Henry Meyer Daghighian
  • Publication number: 20210186988
    Abstract: Embodiments of the present invention are directed to a plurality of substantially spherical microspheres comprising at least one API substantially dispersed in at least one polymer and a lyoprotectant on an outside surface of the plurality of substantially spherical microspheres, wherein the plurality of substantially spherical microspheres have a D99[num] particle diameter of less than about 10 ?m; a D90[num] circularity value of from about 0.8 to about 1.0; and comprise API in a weight of about 20 to about 40 wt. % of the polymer. Other embodiments relate to injectable compositions comprising such microspheres and methods of treating a number of conditions by administering such injectable compositions to a subject.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 24, 2021
    Inventors: Jeffrey Missling, Emily R. Rolfes Meyering, Henry Meyer, Celeste Ondich
  • Patent number: 10925883
    Abstract: Embodiments of the present invention are directed to a plurality of substantially spherical microspheres comprising at least one API substantially dispersed in at least one polymer and a lyoprotectant on an outside surface of the plurality of substantially spherical microspheres, wherein the plurality of substantially spherical microspheres have a D99[num] particle diameter of less than about 10 m; a D90[num] circularity value of from about 0.8 to about 1.0; and comprise API in a weight of about 20 to about 40 wt. % of the polymer. Other embodiments relate to injectable compositions comprising such microspheres and methods of treating a number of conditions by administering such injectable compositions to a subject.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: February 23, 2021
    Assignee: SpineThera
    Inventors: Jeffrey Missling, Emily R. Rolfes Meyering, Henry Meyer, Celeste Ondich
  • Patent number: 10667388
    Abstract: An optical waveguide is disclosed. In a disclosed embodiment, the optical waveguide includes a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer. A second AlN thin film is embedded in the first AlN thin film. In disclosed embodiments, the nitrogen concentration level of the first AlN thin film is different than the concentration level of the second AlN thin film.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: May 26, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Henry Meyer Daghighian, Steven C. Bird
  • Patent number: 10628297
    Abstract: Embodiments of a device and method to automatically acquire signal quality metrics in a digital communication system are disclosed. The device may include acquisition means to sample the likelihood of a digital communication signal passing through a grid of time and amplitude regions, and storage means by which such likelihood measurements may be accumulated in a computer memory array for analysis. A state machine may execute a method that controls both the acquisition means and the storage means, requiring minimal intervention from supervisory systems.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: April 21, 2020
    Assignee: Finisar Corporation
    Inventors: Henry Meyer Daghighian, Lucy G. Hosking, Gilles P. Denoyer
  • Patent number: 10594829
    Abstract: Concepts and technologies disclosed herein are directed to a cloud workload proxy as link-local service. According to one aspect disclosed herein, a datacenter environment system can include an infrastructure network, a service proxy gateway attached to the infrastructure network, and a software-defined networking (“SDN”) controller. The service proxy gateway can include an infrastructure network address. The SDN controller can be configured with a link-local Internet protocol (“IP”) address to the infrastructure network address. The SDN controller can store the link-local IP address mapped to the infrastructure network address for routing packets from a workload executing in a cloud computing environment to a target service operating external to the datacenter environment system.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: March 17, 2020
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Frederick Henry Meyer, Edward Hope
  • Publication number: 20200068706
    Abstract: An optical waveguide is disclosed. In a disclosed embodiment, the optical waveguide includes a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer. A second AlN thin film is embedded in the first AlN thin film. In disclosed embodiments, the nitrogen concentration level of the first AlN thin film is different than the concentration level of the second AlN thin film.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Inventors: Henry Meyer Daghighian, Steven C. Bird
  • Patent number: 10503545
    Abstract: A universal security agent deployed on a computing endpoint includes one or both of a base agent and a security agent plugin module. The base agent loads the security agent plugin module and, in response, receives plugin tasks from the security agent plugin module for registration. The base agent schedules the received plugin tasks based on a policy and/or a system access information associated with the security agent plugin module. Further, the base agent executes the plugin tasks based on the scheduling. The base agent controls system access requests generated during the execution of the plugin tasks based on the policy associated with the security agent plugin module. Additionally, the base agent monitors and logs system access information associated with the security agent plugin module.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: December 10, 2019
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Edward Hope, Daniel Solero, Christopher Moran, Frederick Henry Meyer
  • Patent number: 10470302
    Abstract: A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: November 5, 2019
    Assignee: Finisar Corporation
    Inventors: Henry Meyer Daghighian, Steven C. Bird
  • Publication number: 20190269698
    Abstract: Embodiments of the present invention are directed to a plurality of substantially spherical microspheres comprising at least one API substantially dispersed in at least one polymer and a lyoprotectant on an outside surface of the plurality of substantially spherical microspheres, wherein the plurality of substantially spherical microspheres have a D99[num] particle diameter of less than about 10 m; a D90[num] circularity value of from about 0.8 to about 1.0; and comprise API in a weight of about 20 to about 40 wt. % of the polymer. Other embodiments relate to injectable compositions comprising such microspheres and methods of treating a number of conditions by administering such injectable compositions to a subject.
    Type: Application
    Filed: October 28, 2016
    Publication date: September 5, 2019
    Inventors: Jeffrey Missling, Emily R. Rolfes Meyering, Henry Meyer, Celeste Ondich
  • Publication number: 20190166684
    Abstract: A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.
    Type: Application
    Filed: November 26, 2018
    Publication date: May 30, 2019
    Inventors: Steven C. Bird, Henry Meyer Daghighian
  • Publication number: 20190164891
    Abstract: A circuit of tunable differential vias may include a first tunable via circuit configured to couple a first signal of a differential signal pair from a first outer surface of a printed circuit board (PCB) to a second outer surface of the PCB. The circuit may further include a second tunable via circuit configured to couple a second signal of the differential signal pair from the first outer surface of the PCB to the second outer surface of the PCB. The first tunable via circuit may further include a first buried via spatially offset from the second tunable via circuit to cause a predetermined impedance for the first and second signals through the first and second tunable via circuits at an operating frequency.
    Type: Application
    Filed: November 27, 2017
    Publication date: May 30, 2019
    Inventors: Steven C. Bird, Ron Greenlaw, Henry Meyer Daghighian
  • Publication number: 20190132053
    Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.
    Type: Application
    Filed: November 19, 2018
    Publication date: May 2, 2019
    Inventors: Giuliano Coli, Stephen Nelson, Henry Meyer Daghighian
  • Publication number: 20180343316
    Abstract: Concepts and technologies disclosed herein are directed to a cloud workload proxy as link-local service. According to one aspect disclosed herein, a datacenter environment system can include an infrastructure network, a service proxy gateway attached to the infrastructure network, and a software-defined networking (“SDN”) controller. The service proxy gateway can include an infrastructure network address. The SDN controller can be configured with a link-local Internet protocol (“IP”) address to the infrastructure network address. The SDN controller can store the link-local IP address mapped to the infrastructure network address for routing packets from a workload executing in a cloud computing environment to a target service operating external to the datacenter environment system.
    Type: Application
    Filed: May 24, 2017
    Publication date: November 29, 2018
    Applicant: AT&T Intellectual Property I, L.P.
    Inventors: Frederick Henry Meyer, Edward Hope
  • Patent number: 10135538
    Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: November 20, 2018
    Assignee: Finisar Corporation
    Inventors: Giuliano Coli, Stephen Nelson, Henry Meyer Daghighian
  • Patent number: 10111343
    Abstract: Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: October 23, 2018
    Assignee: FINISAR CORPORATION
    Inventors: Henry Meyer Daghighian, Steven C. Bird, YongShan Zhang