Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate-based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus-based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.

Abstract: The present invention provides a multi-component composite film comprising a) polymer support layer; and b) porous gellable polymer layer which is formed on one side or both sides of the support layer of a), wherein the support film of a) and the gellable polymer layer of b) are unified without the interface, a method for preparing the same, and a polymer electrolyte system applied the same.

Abstract: The present invention provides a multi-component composite film comprising a) polymer support layer, and b) porous gellable polymer layer which is formed on one side or both sides of the support layer of a), wherein the support film of a) and the gellable polymer layer of b) are unified without the interface, a method for preparing the same, and a polymer electrolyte system applied the same.

Abstract: The present invention relates to a copper clad laminate for chip on film, specifically to a copper clad laminate for a chip on film comprising a copper clad and at least one polyimide layer laminated on the copper clad, wherein the polyimide layer in contact with the copper clad comprises at least one additive selected from the group consisting of an azole-based compound, a polysiloxane-based compound, and a polyphosphate-based compound. The copper clad laminate for a chip on a film according to the present invention, upon tin plating the copper clad at high temperature, prevents delamination between the copper clad and the polyimide layer, and has excellent adhesiveness under the temperature and pressure on IC chip bonding.

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.

Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10?6 to 2.5×10?5/° C. and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.

Abstract: The present invention provides a multi-component composite film comprising a) polymer support layer; and b) porous gellable polymer layer which is formed on one side or both sides of the support layer of a), wherein the support film of a) and the gellable polymer layer of b) are unified without the interface, a method for preparing the same, and a polymer electrolyte system applied the same.

Abstract: The present invention provides a multi-component composite film comprising a) polymer support layer; and b) porous gellable polymer layer which is formed on one side or both sides of the support layer of a), wherein the support film of a) and the gellable polymer layer of b) are unified without the interface, a method for preparing the same, and a polymer electrolyte system applied the same.

Abstract: The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10-6 to 2.5×10-5/iÉ and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.

Abstract: It is an object of the present invention to provide a microporous film made of polyolefin blend having outstanding electrolyte wettability, puncture strength, and shut down characteristics, its manufacturing method, and a secondary battery separator. The present invention provides a microporous film and a method for manufacturing the same characterized in that the microporous film is manufactured by molding a film with a mixed blend containing two or more of polyolefins by using a casting or film blowing, and that a microporous film is manufactured by annealing and stretching the molded film, and the microporous film is surface treated by irradiating it with ionizing radiation either before or after the pore formation in order to achieve the above object.

Abstract: The present invention relates to a multi-component composite separate membrane and a method for preparing the same, and to a multi-component composite membrane comprising a support layer and active layers, wherein the support layer is located between the active layers.

Abstract: The present invention relates to a metallic laminate for printed-circuit base board composed of two low thermal expansion polyimide resin layers having thermal expansion coefficient of up to 20 ppm/?, a metal conductor layer, and a high thermal expansion polyimide resin layer having thermal expansion coefficient of more than 20 ppm/? which is loaded on the above low thermal expansion polyimide resin layers, and a preparation method of the same.

Abstract: The present invention provides a electrochemical element, wherein a multi-component composite film comprising a) polymer support layer film and b) a porous gellable polymer layer which is formed on either or both sides of the support layer film of a), wherein the support layer film of a) and the gellable polymer layer of b) are unified with each other without an interface between them.

Abstract: The present invention relates to a high crystalline polypropylene microporous membrane and a preparation method of the same, and it provides a preparation method of a polypropylene microporous membrane comprising the steps of preparing a precursor film using high crystalline polypropylene having a crystallinity of 50% or more and a very high isotacticity, annealing, stretching at a low temperature, stretching at a high temperature, and heat setting, and a polypropylene microporous membrane having superior permeability and mechanical properties prepared by the preparation method.

Abstract: The present invention relates to a multi-component composite separate membrane and a method for preparing the same, and to a multi-component composite membrane comprising a support layer and active layers, wherein the support layer is located between the active layers.

Abstract: The present invention relates to a method for reforming the surface of polymer, especially to a method for providing hydrophilicity or increasing hydrophobicity by reforming the surface of polymer or polymer membrane. The present invention is a method for reforming the surface of polymer membrane by irradiating it with energized ionic particles under the vacuum condition. The method including the steps of: a) manufacturing polymer membrane, including a surface activated, by inserting polymer membrane into a vacuum chamber, and by irradiating energized ionic particles on the surface of polymer membrane with an ion beam under a high vacuum; and b) manufacturing polymer membrane treated with a reactive gas on the surface of membrane, including the activated surface of step a), by infusing the reactive gas into a vacuum chamber after energized ionic particles of step a) have been irradiated.

Abstract: The present invention relates to a polyimide copolymer used in a precursor of heat resistant adhesive and methods for preparing the same, and more particularly, to a polyamic acid copolymer and methods for preparing the same obtained by controlling a polymerization degree of the tetracarboxylic acid dianhydride and aromatic diamine. The present invention also comprises a polyimide copolymer obtained by curing the polyamic acid copolymer, and methods for preparing the same. The present invention also provides a heat resistant adhesive composition comprising the polyamic acid copolymer and the polyimide copolymer, and a semiconductor device using the same. The polyamic acid copolymer used in a precursor and polyimide copolymer obtained therefrom of the present invention has superior adhesion strength and simultaneously satisfies physical properties like high heat resistance and low water absorption rate, etc. and thus it can be effectively adhered parts of semiconductor devices, etc.

Abstract: The present invention provides a electrochemical element, wherein a multi-component composite film comprising a) polymer support layer film and b) a porous gellable polymer layer which is formed on either or both sides of the support layer film of a), wherein the support layer film of a) and the gellable polymer layer of b) are unified with each other without an interface between them.

Abstract: A method of producing a microporous membrane comprising the steps of: extruding a polymer at a temperature of from (polymer melting point +10° C.) to (polymer melting point +100° C.); drawing the extruded polymer at a rate of 5˜120 m/min in 10˜150° C. to obtain a polymer film; annealing the polymer film at a temperature of from (polymer melting point −100° C.) to (polymer melting point −5° C.) for 10 seconds to 1 hour; irradiating both surfaces of the annealed polymer film with an ion-particle amount of 102˜1020 ion/cm2 energized at 10−2˜107 KeV, at an irradiating distance of 5˜100 cm under a vacuum of 10−2˜10−[torr; cold stretching the irradiated polymer film at a temperature of from −20° C. to (polymer melting point −40° C.); hot stretching the cold stretched polymer film at a temperature of from (polymer melting point −40° C.) to (polymer melting point −5° C.

Abstract: The present invention relates to a high crystalline polypropylene microporous membrane and a preparation method of the same, and it provides a preparation method of a polypropylene microporous membrane comprising the steps of preparing a precursor film using high crystalline polypropylene having a crystallinity of 50% or more and a very high isotacticity, annealing, stretching at a low temperature, stretching at a high temperature, and heat setting, and a polypropylene microporous membrane having superior permeability and mechanical properties prepared by the preparation method.