Patents by Inventor Heoung Sub Lee

Heoung Sub Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160189851
    Abstract: An electronic component includes a multilayer body including a plurality of magnetic or dielectric layers and a coil part including a plurality of conductor patterns and conductive vias electrically connecting the plurality of conductor patterns to each other. External electrodes are disposed on outer surfaces of the multilayer body and electrically connected to the coil part. Adjacent conductor patterns have at least one among the magnetic or dielectric layers interposed therebetween. Buffer layers having a permittivity lower than that of the multilayer body are disposed at interfaces between the conductor patterns and the magnetic or dielectric layers.
    Type: Application
    Filed: November 17, 2015
    Publication date: June 30, 2016
    Inventor: Heoung Sub LEE
  • Patent number: 9196410
    Abstract: Disclosed herein are a chip inductor and a method of manufacturing the same. The chip inductor includes: a laminate in which a magnetic sheet having a C-pattern electrode formed thereon and a magnetic sheet having an I-pattern electrode formed thereon are alternately laminated; a via penetrating through the magnetic sheet and connecting the C-pattern electrode and the I-pattern electrode; and an external electrode terminal provided at either side portion of the laminate.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: November 24, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Heoung Sub Lee
  • Publication number: 20150084729
    Abstract: Disclosed herein is a multilayer type inductor, including: a ceramic body formed by multilayering a plurality of ceramic sheets; internal electrodes multilayered, having the ceramic sheet disposed therebetween; a dummy pattern disposed on any one of upper and lower surfaces of the ceramic body; and external terminals disposed at both ends of the ceramic body, whereby an inductance value is finely controlled.
    Type: Application
    Filed: September 24, 2014
    Publication date: March 26, 2015
    Inventor: Heoung Sub LEE
  • Publication number: 20130314193
    Abstract: Disclosed herein are a chip inductor and a method of manufacturing the same. The chip inductor includes: a laminate in which a magnetic sheet having a C-pattern electrode formed thereon and a magnetic sheet having an I-pattern electrode formed thereon are alternately laminated; a via penetrating through the magnetic sheet and connecting the C-pattern electrode and the I-pattern electrode; and an external electrode terminal provided at either side portion of the laminate.
    Type: Application
    Filed: May 21, 2013
    Publication date: November 28, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Heoung Sub Lee