Patents by Inventor Herbert A. Lord

Herbert A. Lord has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for reducing temperature variations across a semiconductor wafer during heating
    Patent number: 4560420
    Abstract: Temperature variations across the surface of a semiconductor wafer (12), having at least one major surface thereof exposed to a source of radiant heat energy (18), are reduced by positioning a reflective ring (30, 30', 30" or 30'") proximate the wafer edge (28). The reflective ring (30, 30', 30" or 30'") reflects the heat energy towards the wafer periphery (27) to provide substantially uniform heat across the wafer.
    Type: Grant
    Filed: June 13, 1984
    Date of Patent: December 24, 1985
    Assignee: AT&T Technologies, Inc.
    Inventor: Herbert A. Lord
  • Uniformly cooled plasma etching electrode
    Patent number: 4361749
    Abstract: A planar electrode (17) having a plurality of concentric channels (34-34) therein through which coolant fluid passes to cool the electrode during a plasma etching process. The coolant is directed through at least two of the adjacent channels in opposite directions with the inputs (31) and outputs (32) located in close spaced relation to one another to provide a substantially uniform temperature on the surface of the electrode proximate thereto.
    Type: Grant
    Filed: November 3, 1980
    Date of Patent: November 30, 1982
    Assignee: Western Electric Co., Inc.
    Inventor: Herbert A. Lord
  • Method and apparatus for extruding tubular jackets
    Patent number: 4279851
    Abstract: Methods and apparatuses are disclosed for extruding tubular jackets of uniform radial thicknesses about cables employing a diverter tube assembly 10 that provides a divergent flow path for a plastic fluid from diametrically opposite channel orifices 46 to a tubular confluence. The diverter tube circumference is between 22 and 50 times the prespread width of each channel orifice while the axial to lateral spread ratio of the divergent flow path is between 1:2 tangent 30.degree. and 1:2 tangent 40.degree..
    Type: Grant
    Filed: November 1, 1979
    Date of Patent: July 21, 1981
    Assignee: Western Electric Company, Inc.
    Inventors: Herbert A. Lord, Randy G. Schneider
  • Uniformly cooled plasma etching electrode
    Patent number: 4275289
    Abstract: A planar electrode (17) having a plurality of concentric channels (34--34) therein through which coolant fluid passes to cool the electrode during a plasma etching process. The coolant is directed through at least two of the adjacent channels in opposite directions with the inputs (31) and outputs (32) located in close spaced relation to one another to provide a substantially uniform temperature on the surface of the electrode proximate thereto.
    Type: Grant
    Filed: February 4, 1980
    Date of Patent: June 23, 1981
    Assignee: Western Electric Company, Inc.
    Inventor: Herbert A. Lord