Abstract: A heat dissipating housing (W/Gl/G) for a circuit component (IC) consists of at least one bottom tub (G) and a cover (W) having a planar cover face. A frame-shaped portion of this cover face serves as a bearing surface (TF) for meeting a planar bearing surface (TF) of the sidewalls (G1) of the bottom tub (G). Both bearing surfaces (TF) are finally fastened together. At least parts of the cover's outside surface (W) are cooled in operation by a cooling medium (KL), dissipated heat being conveyed from the circuit component (IC) via a stiff heat conducting body (SC1, SC2) and a good heat conductor element consisting of elastic material (FE/WS/WL) to the cover (W).

Abstract: A heat dissipating housing (1, 4, 5, 6) with a tub (1, 4) and an outer cover (5, 6) seated on the tub (1, 4)--preferably hermetically tight--for an electronic circuit component (11, 17) which in operation gives off heat to be dissipated such as a light emitting diode (17) and/or a semiconductor driver chip (11) is disclosed. The circuit component (11, 17) is fastened on the bottom (1) of the tub (1, 4). In operation, the heat to be dissipated is to be transferred at least in considerable part via a heat removal body (5, 6) of the housing (1, 4, 5, 6) to an outer surface of the housing, preferably via a heat conducting outer cover (5, 6) serving as the heat removal body (5, 6) to the outer surface air, sweeping the housing.

Abstract: A housing for an optoelectronic circuit module useful in a glass fiber communications system including a luminous flux suspended into the housing. The flux is conducted in a vacuum or a gas, between first and second mutually positioned optical components. The first optical component is attached to the housing via a first support, and a second optical component is attached to the housing via a second support. The first support is installed in one of the housing walls or inside the housing and the second support is rigidly attached to an interior section of the housing. In operation, at least the second support is subjected to large temperature variations of e.g., between -40.degree. C. and +130.degree. C. At least the interior section of the housing which is adjacent to the second support is comprised of a first weldable material and has a first linear thermal expansion coefficient.

Abstract: A glass fiber bushing is provided for a wall opening of a housing which has a light-transmitting or a light receiving component mounted therein, the component having an optically-active location to be optimally coupled to the tip of the glass fiber. At least in the region of the opening through the housing, the glass fiber is firmly surrounded by and is secured in a stiff tube which is inserted through the wall opening. An adjustment member which adjusts the glass fiber position is slipped with a tight clearance over the tube and/or over a transition piece which is secured to the tube. An end face of the adjustment member is oriented toward the exterior surface of the housing in the region surrounding the wall opening. At least close to the tip of the glass fiber, the outer diameter of the glass fiber or of a glass fiber protective layer is surrounded by the inner wall of the tube with so little play that the tube defines the position of the tip of the glass fiber.

Abstract: A method for laser-light welding of a metallic base layer to a thin, metallic covering lying thereon, whereby the covering which is highly reflective for the laser light is covered with a metal skin which is less highly reflective for the laser light, namely with a metal skin which noticeably absorbs the laser light. In case both the covering as well as the base layer are wettable with solder metal, the covering highly reflective for the laser light is first covered with a metal skin composed of a solder metal, whereupon said covering is welded to the base layer by means of the laser light.

Abstract: A housing-free, vertically insertable single-in-line circuit module has a carrier consisting of synthetic film or ceramic which carries a series of metal terminal pins and one or more electrical components including at least one integrated semiconductor circuit element, and associated conductor runs connecting the circuit element to the terminals, and the carrier has one lateral face thereof which is substantially covered by a metallic cooling sheet for permitting improved cooling of the circuit module by convection.

Abstract: A protective tube arrangement particularly useful for positioning the end of a glass fiber relative to an opto-electronic component of a module having a housing, which housing engages the protective tube characterized by the glass fiber being secured to the tube at two axially spaced locations with the length of the fiber extending between the two locations and the distance of the tube between the locations being selected so that the fiber has a greater length than the distance for all temperatures below a maximum temperature limit. Thus, the fiber is not subjected to tensile stresses and the distance between the two locations on the tube and the length of the fiber are selected so that the compressive stresses are below 1 N/mm.sup.2 for all temperature ranges between the maximum temperature limit and the minimum temperature limit.

Abstract: A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, whereby the housing surface preferably composed entirely of metal is cooled during operation by a flowable coolant, preferably cooling air. The front, first semi-conductor body is attached in the front section thereof and the back, second semi-conductor body is attached in the back section thereof, the maximum operating temperature of the back semi-conductor body being higher than the maximum operating temperature of the front semi-conductor body, at least at times.