Abstract: There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated.

Abstract: A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

Abstract: There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system.

Abstract: A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

Abstract: In a process for forming elements from a slurry that includes particulate ceramic and/or glass, an organic binder resin, and a solvent for the resin, where the element is shaped from the slurry, and the element heated to remove the organic materials of the slurry and subsequently fuse the ceramic and/or glass particles, the improvement comprised of coating the ceramic and/or glass particles prior to forming the slurry with a surface modification compound selected from the group consisting of organo silanes, organo silazanes, titanium chelates, titanium esters, and mixtures thereof.

Abstract: A process for forming a desired metal pattern on a substrate which comprises forming a mask of a thermally depolymerizable polymer on the substrate with a pattern of openings complementary to the desired metal pattern, blanket coating the substrate and the mask with a metal, heating to depolymerize the thermally depolymerizable polymer, and removing the thermally depolymerizable polymer and metal thereover in a mild solvent.

Abstract: An improved lift-off process for multilevel metal structure in the fabrication of integrated circuits by employing lift-off layer formed from polymers which undergo clean depolymerization under the influence of heat or radiation and allow rapid and residue-free release of an "expendable mask". An embedded interconnection metallurgy system is formed by application of the lift-off layer of this invention over a cured polymer film or on an oxygen RIE barrier layer previously deposited on organic or inorganic substrate, followed by another barrier over which is then coated a radiation sensitive resist layer.

Abstract: In a soldering process for joining a plurality of metal components wherein a flux is employed to promote the process, the improvement comprises using as a flux in the process a flux consisting essentially of dihydroabietyl alcohol or dihydroabietyl alcohol and a member selected from the group consisting of a thermally depolymerizable polymer or a mixture of thermally depolymerizable polymers having the structure: ##STR1## where X and Y are n-alkyl and iso-alkyl not exceeding 6 carbon atoms; halogen; --COOR where R is n-alkyl and iso-alkyl not exceeding 6 carbon atoms; phenyl, naphthyl, tolyl and methyl-naphthyl groups; n is 5 to 500, and mixtures thereof.

Abstract: A process for forming a desired metal pattern on a substrate which comprises, forming a mask of a thermally depolymerizable polymer on the substrate with a pattern of openings complementary to the desired metal pattern, blanket coating the substrate and the mask with a metal, heating the substrate to depolymerize the depolymerizable polymer, cooling the surface of the metal to thereby delaminate the metal coated in areas where thermally depolymerizable polymer is present, removing the delaminated metal where necessary, and optionally plasma ashing the depolymerized polymer, if residue thereof remains, to remove the same from said substrate.