Abstract: A flexible circuit connector is presented which is used to electrically and mechanically connect a flexible circuit to a circuit board or other electronic device. The connector also functions to wipe off any residue or debris on the electrical contacts before final connection. The connector is comprised of a male plug and a female adapter. The male plug comprises two interlocking pieces including a block and a cover. These two pieces allow for easy assembly and disassembly of the plug in conjunction with a flexible circuit. The female adapter comprises a hood which may be fastened directly to a circuit board. Alternatively, the hood may be fastened to a base plate which has gold plated contacts and conductive pins which pass through and which are soldered to the circuit board.

Abstract: An electrical connector is presented for effecting a non-wiping pressure mated connection between at least a pair of flexible circuits and another circuit device in a compact package with allowance for very tight tolerances on pad width and spacing.

Abstract: A solderless connector technique and apparatus is presented for establishing electrical contact between a flexible circuit and another circuit device utilizing relative motion therebetween to wipe away or remove any debris or other foreign matter present on the terminals which could adversely effect electrical contact. In a first embodiment of the present invention, relative motion between the respective circuit devices is provided by male and female housings having a camming device incorporated therein. This camming device will effectively wipe away any foreign matter or debris located on the respective terminal devices. In another embodiment of the present invention, mechanical springs are used to provide lateral motion to the circuit devices thereby wiping away any dirt, dust or debris. Preferably, a means for prewiping i.e., a cleaning pad, is provided to the present invention to facilitate removal of debris.

Abstract: A solderless connector for effecting the connection between a multi-layer flexible circuit and other electronic circuit devices is presented. A first embodiment of the present invention is characterized by wrapping separated layers of a two or more layer flexible circuit about an elastomeric resilient member such that the terminal ends of each layer are provided on one side of the resilient member. In a second embodiment of the present invention, a multi-layer flexible circuit is provided with successive steps formed in each layer wherein the terminating portions of each circuit layer have a progressively longer length. This stepped multi-layer flexible circuit is then used in conjunction with a correspondingly stepped rigid retainer plate wherein a resilient elastomeric member is positioned between the stepped flexible circuit and the steps of the rigid retainer plate such that uniform pressure is maintained on all layers during interconnection with another electronic circuit device.

Abstract: A technique for providing a solderless connection between data/servo flex circuits and magnetic heads in disc drives is presented. The solderless connection is particularly well suited for making the electrical connection between a thin film head on one end of a Whitney Suspension Mechanism (WSM) and a flex circuit which is at the other end of the WSM.

Abstract: Contact portions of a first array of conductive elements are urged against mating contacts of a second array by a pressure applicator comprising a resilient open celled plastic material to establish and maintain an electrical connection therebetween.

Abstract: A keyboard has first and second nested planar members with depressions formed thereon. The upper member is transparent. The lower member may be color coded and carry replaceable key indicia in the depressions.The laminated overlay nested planar members are disposed adjacent to a conventional elastomeric diaphragm switch assembly having an upper layer of shaped protrusions abutting the lower most inner surfaces of the second or lower member depressions. Frame structure of variable form assists in retaining the laminated overlay members in fixed relationship to the elastomeric diaphragm switch assembly.