Abstract: A magneto-resistive read/write tape head is provided for reading and writing to tape media along a tape head face. The tape head comprises a plurality of modules, each module comprising a read element and a write element spaced apart and terminating at the tape head face and formed over a substrate. The read element comprises a soft film bias layer and a hard film bias layer butted against the SFB layer. The write element comprises two pole tips spaced apart by a gap. The tape head further includes a plurality of activating conducting coil turns operatively associated with the write element and covered by a cross-linked photoresist and positioned between the gap and one of the pole tips and set back from the tape head face.

Abstract: An arbitrary pattern write head assembly for writing timing-based servo patterns on magnetic storage media is provided, comprising: (a) a first pole piece comprising a substrate comprising a magnetic material, said substrate having a major surface; (b) a plurality of electrically conducting windings formed on the major surface; and (c) a second pole piece formed on the substrate, with a portion thereof formed above the plurality of electrically conducting windings and electrically insulated therefrom, the second pole piece having at least one opening therethrough defining a gap above the electrically conducting windings and the substrate, the second pole piece comprising at least two layers, each layer comprising a magnetic material. A method of batch fabricating servo writer heads is also provided for batch fabrication of servo writer heads at a very low cost. The method enables fabrication of heads capable of azimuthal recording commonly practiced in the video recording art.

Abstract: A polyimide mask is used as an undercoat for a standard resist material during the patterning of an underlying thin film layer by plasma etching. The polyimide mask can withstand the conditions of reactive ion (plasma) etching so that it can be used as a protective coating when the thin film is subtractively etched by the plasma etching. The polyimide is particularly useful in processes using either positive or negative electron beam lithography which require sensitive resists.